Patent EP0072673A2 successfully refreshed from Google Patents.
EP0072673A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Area tape for the electrical interconnection between electronic components and external circuitry
Assignee: 3M Co
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Filing: 1982-08-12
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Granted: —
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Expires: 2002-08-12
Abstract
Abstract A flexible area-bonding tape (2) comprising a flexible, electrically insulating body, and arrays of internal and external terminals (10 and 11) which are electrically interconnected by multiplicities of conductive paths (14). At least some of the paths (14) are essentially completely embedded in the body.
Inventors
- 👤 Robert J. Nelson
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-29 06:04
CPC Classifications
H; H10; H10P; H10P74/00; H10P74/27; H10P74/273; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/688; H10W70/69; H10W70/695; H10W72/00; H10W72/071; H10W72/077; H10W72/701; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
92 words
A flexible area-bonding tape (2) for providing electrical interconnection between electronic components and external circuitry, said tape (2) comprising a flexible, solid, electrically insulating body having a predetermined array of internal terminals (10) for electrical interconnection to salt electronic components, a predetermined array of external terminals (11) for electrical interconnection to said external circuitry, said internal and external terminals (10 and 11) being electrically interconnected by a multiplicity of conductive paths (14) provided in more than one level, at least some of said paths (14) being essentially completely embedded in said body.
Claim 2
Dependent Claim
92 words
A flexible area-bonding tape (2) for providing electrical interconnection between electronic components and external circuitry, said tape (2) comprising a flexible, solid, electrically insulating body having a predetermined array of internal terminals (10) for electrical interconnection to salt electronic components, a predetermined array of external terminals (11) for electrical interconnection to said external circuitry, said internal and external terminals (10 and 11) being electrically interconnected by a multiplicity of conductive paths (14) provided in more than one level, at least some of said paths (14) being essentially completely embedded in said body.
Claim 3
Dependent Claim
26 words
A tape (2) according to claim 1 wherein said array of external terminals (11) is disposed about the periphery of said array of internal terminals (10).
Claim 4
Dependent Claim
27 words
A tape (2) according to claim 1 wherein said array of internal terminals (10) comprises a multiplicity of horizontal and vertical rows of first metal land areas.
Claim 5
Dependent Claim
31 words
A tape (2) according to claim 3 wherein said array of external terminals (11) comprises a row of second metal land areas around the periphery of said array of internal contacts.
Claim 6
Dependent Claim
21 words
A tape (2) according to claim 4 wherein said second metal land areas have essentially none of said insulating body therearound.
Claim 7
Dependent Claim
47 words
A tape (2) according to claim 1 further comprising an array of test terminals, wherein said test terminals (20) are electrically interconnected to said external terminals (11), and wherein said array of test terminals (20) is disposed about the periphery of said array of external terminals (11).
Claim 8
Dependent Claim
32 words
A tape (2) according to claim 6 wherein said array of test terminals (20) comprises a row of third metal land areas around the periphery of said array of external terminals (11).
Claim 9
Dependent Claim
14 words
A tape (2) according to claim 1 wherein said insulating material is a polyimide.
Claim 10
Independent Claim
165 words
A method for providing electrical interconnection between an electronic component and external circuitry, the method comprising the steps of a) providing a flexible area-bonding tape (2) comprising a flexible, solid, electrically insulating body having a predetermined array of internal terminals (10) for electrical interconnection to said electronic components, a predetermined array of external terminals (11) for electrical interconnection to said external circuitry, said internal and external terminals (10 and 11) being electrically interconnected by a multiplicity of conductive paths (14) provided in more than one level, at least some of said paths (14) being essentially completely embedded in said body; b) aligning said array of internal terminals (10) with the bonding locations on said electronic component; c) bonding said array of internal terminals (10) to said bonding locations on said electronic component; d) aligning said array of external terminals (11) with the bonding locations on said external circuitry; and e) bonding said array of external terminals (11) to said bonding locations on said external circuitry.
Claim 11
Independent Claim
165 words
A method for providing electrical interconnection between an electronic component and external circuitry, the method comprising the steps of a) providing a flexible area-bonding tape (2) comprising a flexible, solid, electrically insulating body having a predetermined array of internal terminals (10) for electrical interconnection to said electronic components, a predetermined array of external terminals (11) for electrical interconnection to said external circuitry, said internal and external terminals (10 and 11) being electrically interconnected by a multiplicity of conductive paths (14) provided in more than one level, at least some of said paths (14) being essentially completely embedded in said body; b) aligning said array of internal terminals (10) with the bonding locations on said electronic component; c) bonding said array of internal terminals (10) to said bonding locations on said electronic component; d) aligning said array of external terminals (11) with the bonding locations on said external circuitry; and e) bonding said array of external terminals (11) to said bonding locations on said external circuitry.
References Cited (Backward Citations)
No citation records indexed.
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