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EP0066883A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Exposure method with electron beam exposure apparatus

Assignee: Hitachi Ltd
•
Filing: 1982-06-08
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Granted: —
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Expires: 2002-06-08
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Abstract

Abstract An exposure method with an electron beam exposure apparatus in which an electron beam is emitted onto a substrate (1) such as a silicon wafer on which an electron-beam sensitive resist is coated, thereby directly forming or writing patterns. A substrate (1) having thereon a number of chips (2) are divided into blocks (3), marks (4) are provided on each of the blocks (3), the positions of the marks (4) are detected and the writing exposure positions of the chips (2) within each block (3) are modified on the basis of the detection results. According to this invention, efficient writing exposure can be made with high accuracy.

Inventors

  • 👤 Tadahito Matsuda
  • 👤 Tsuneo Okubo
  • 👤 Susumu Ozasa
  • 👤 Norio Saitou
  • 👤 Haruo Yoda

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-09 20:10
CPC Classifications
H; H10; H10W; H10W46/00; H01; H01J; H01J37/00; H01J37/30; H01J37/304; H01J37/3045; H10P; H10P76/00; H10P76/20; H10P76/204; H10P76/2045; H10P95/00; H10W46/501

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 84 words
An exposure method with an electron beam exposure apparatus comprising steps of: dividing in advance a substrate (1) having thereon a number of chips (2) into blocks (3) each having a plurality of chips (2); providing marks (4) on each of said blocks (3); detecting the positions of the marks (4) provided on said blocks (3) upon exposing a desired block (3); and correcting writing exposure positions of the chips (2) within each of said blocks (3) on the basis of the detection results.
Claim 2
Dependent Claim 84 words
An exposure method with an electron beam exposure apparatus comprising steps of: dividing in advance a substrate (1) having thereon a number of chips (2) into blocks (3) each having a plurality of chips (2); providing marks (4) on each of said blocks (3); detecting the positions of the marks (4) provided on said blocks (3) upon exposing a desired block (3); and correcting writing exposure positions of the chips (2) within each of said blocks (3) on the basis of the detection results.
Claim 3
Dependent Claim 21 words
An exposure method according to claim 1, wherein said marks (4) are provided on the four corners of each block (3).
Claim 4
Dependent Claim 26 words
A pattern exposure method according to claim 1 or 2, wherein each of said blocks (3) has its sides of no greater than 20 mm each.
Claim 5
Dependent Claim 58 words
A pattern exposure method according to claim 1, 2 or 3, wherein each of said chips (2) is divided into a plurality of fields (F 1 , F 2 ...) so that the corresponding fields (F 1 , F 2 ...) of all the chips (2) within a desired one of said blocks (3) are exposed in sequence.
Claim 6
Dependent Claim 49 words
An exposure method according to claim 1, 2 or 3, further comprising steps of .detecting in advance the height of each mark (4) put on a desired one of said blocks (3), and modifying writing exposure reference plane (a) of said block (3) in accordance with the detection results.

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