Patent EP0066631A1 successfully refreshed from Google Patents.
EP0066631A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Mounting and testing equipment for leadless electronic parts
Assignee: Panasonic Holdings Corp
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Filing: 1981-12-16
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Granted: —
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Expires: 2001-12-16
Abstract
Abstract Mounting and testing equipment for leadless electronic parts, wherein a mounting member (6) mounts a leadless electronic part (1) after a printed circuit board (2) is fed onto an X-Y table (5), the printed circuit board (2) with the leadless electronic part (1) mounted on it is transported a predetermined distance and then a testing member (7) tests the mounting state of the leadless electronic part (1) mounted on the printed circuit board (2) while another lead less electronic part (1) is mounted onto the next printed circuit board (2). Operation can thus be made reliable and efficient.
Inventors
- 👤 Takayuki Fujita
- 👤 Yoshiaki Yoshida
- 👤 Toshiyuki Higashiura
- 👤 Kunio Tanaka
- 👤 Keiji Shibata
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-08 06:11
CPC Classifications
H; H05; H05K; H05K13/00; H05K13/04; H05K13/046; H05K13/0465; H05K13/08; H05K13/081; H05K13/0812
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
155 words
A mounting and inspecting apparatus for leadless electronic parts, by which each of the leadless electronic parts is mounted between conductive patterns of a printed circuit board by the use of adhesive and the mounting states of the leadless electronic parts mounted on the printed circuit board are inspected prior to curing of the adhesive, said mounting and inspecting apparatus comprising: a mounting unit for mounting.the leadless electronic parts on the printed circuit board held, for positioning thereof, on rails provided on an X-Y table; and an inspecting unit for inspecting mounting states of the leadless electronic parts mounted on the printed circuit board, which holds the printed circuit board having the leadless electronic parts mounted thereon by said mounting unit, for positioning thereof; said inspecting unit being provided above the printed circuit board having the leadless electronic part mounted thereon so as to be disposed at a position corresponding to the leadless electronic parts.
Claim 2
Dependent Claim
155 words
A mounting and inspecting apparatus for leadless electronic parts, by which each of the leadless electronic parts is mounted between conductive patterns of a printed circuit board by the use of adhesive and the mounting states of the leadless electronic parts mounted on the printed circuit board are inspected prior to curing of the adhesive, said mounting and inspecting apparatus comprising: a mounting unit for mounting.the leadless electronic parts on the printed circuit board held, for positioning thereof, on rails provided on an X-Y table; and an inspecting unit for inspecting mounting states of the leadless electronic parts mounted on the printed circuit board, which holds the printed circuit board having the leadless electronic parts mounted thereon by said mounting unit, for positioning thereof; said inspecting unit being provided above the printed circuit board having the leadless electronic part mounted thereon so as to be disposed at a position corresponding to the leadless electronic parts.
Claim 3
Dependent Claim
78 words
A mounting and inspecting apparatus as claimed in Claim 1, wherein said inspecting unit comprises a lamp for irradiating the leadless electronic parts, a lens for condensing light which has been reflected by metallic terminals of each of the leadless electronic parts, a masking plate having transmitting holes disposed at positions where spots of light are formed by the reflected light transmitted through said lens, and photo detectors provided, respectively, on said transmitting holes of said masking plate.
References Cited (Backward Citations)
No citation records indexed.
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