Manufacture of laminated electronic substrates involving electrical inspection

Abstract

Abstract A method of manufacturing substrates for LSI chips starts with the usual steps of punching holes in green sheets, screening patterning paste (adapted to form cermet conductors or the like after firing) onto the greensheets, and inspecting the greensheets optically. Subsets of green sheets are then stacked and compressed into sub-laminates. The sub-laminates are then functionally inspected electrical i.e. before firing the greensheets. Inspection is done by means of electromechanical contact, scanning electron microscope like techniques, or by other means (e.g. light or ions) of irradiating the conductors to energize them for electrical measurement. Secondary electrons can measure the specimen's potential locally or change its charge. This method can also be employed for the purpose of inspecting other multilayer structures (such as large multilayer printed circuits formed on a plastic base) prior to final assembly of the conductors and the various substrates into a laminated support for electrical circuits.

Inventors

• 👤 Arthur Richard Zingher

Bibliographic Details