Patent EP0064872A2 successfully refreshed from Google Patents.
EP0064872A2
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Ceramic wiring boards
Assignee: Hitachi Ltd
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Filing: 1982-05-07
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Granted: —
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Expires: 2002-05-07
Abstract
Abstract A ceramic wiring board which comprises a ceramic part in which through-holes are made, a sintered wiring pattern part provided on the surface of the ceramic part and a sintered conductor part filled in the through-holes, shows a decrease in cracks at the through-hole part caused by sintering and reduction in moisture absorbency when the ceramic part comprises ceramic and a sintering assistant and the sintered conductor part comprises a metal and the same sintering assistant as that present in the ceramic part.
Inventors
- 👤 Tsuyoshi Fujita
- 👤 Noriyuki Taguchi
- 👤 Gyozo Toda
- 👤 Takashi Kuroki
- 👤 Shoosaku Ishihara
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 20:45
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K1/03; H05K1/0306; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/62; H10W70/63; H10W70/635; H10W70/66; H10W70/666; H10W70/67; H10W70/69; H05K3/00; H05K3/46; H05K3/4611; H05K3/4626; H05K3/4629; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49163; Y10T428/00; Y10T428/24; Y10T428/24273; Y10T428/24322; Y10T428/24331
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
85 words
A ceramic wiring board which comprises a ceramic part, a sintered wiring pattern part provided on the surface of the ceramic part and a sinteredconductor part filling through-holes in the ceramic part, wherein the ceramic part comprises 99.9 wt% or less of ceramic and 0.1 wt% or more of a sintering assistant and at least the sintered conductor part filling the through-holes comprises 80 - 99.5 wt% of a metal and 20 - 0.5wt% of a sintering assistant which is present in the ceramic part.
Claim 2
Dependent Claim
85 words
A ceramic wiring board which comprises a ceramic part, a sintered wiring pattern part provided on the surface of the ceramic part and a sinteredconductor part filling through-holes in the ceramic part, wherein the ceramic part comprises 99.9 wt% or less of ceramic and 0.1 wt% or more of a sintering assistant and at least the sintered conductor part filling the through-holes comprises 80 - 99.5 wt% of a metal and 20 - 0.5wt% of a sintering assistant which is present in the ceramic part.
Claim 3
Dependent Claim
46 words
A ceramic wiring board according to claim 1 wherein the sintering assistant is at least one compound selected from SiO 2 -MgO-Al 2 O 3 low melting compounds, SiO 2 -MgO-CaO low melting compounds, Al 2 O 3 -SiO 2 minerals, MgO-CaO minerals, and MgO-Si02 minerals.
Claim 4
Dependent Claim
50 words
A ceramic wiring board according to claim 2 wherein the SiO 2 -MgO-Al 2 O 3 low melting compound is cordierite, the SiO 2 -MgO-CaO low melting compound is diopside,the A1 2 0 3 -Si0 2 mineral is kaolinite, the MgO-CaO mineral is dolomite and the MgO-Si02 mineral is talc.
Claim 5
Dependent Claim
18 words
A ceramic wiring board according to claim 1, 2 or 3 wherein the metal is W and/or Mo.
Claim 6
Dependent Claim
43 words
A ceramic wiring board according to any one of the preceding claims wherein the ceramic is a metal oxide selected from Al 2 O 3 , MgO, SiO 2 , Zr0 and Be0 or a metal oxide selected from murite, forsterite and steatite.
Claim 7
Dependent Claim
30 words
A ceramic wiring board according to any one of the preceding claims wherein the ceramic part comprises 85-95 wt% of ceramic and 20 - 5 wt% of a sintering assistant.
Claim 8
Dependent Claim
23 words
A multilayer wiring board comprising a stack of two or more ceramic wiring boards as claimed in any one of the preceding claims.
References Cited (Backward Citations)
No citation records indexed.
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