Patent EP0063408A1 successfully refreshed from Google Patents.
EP0063408A1
Expired / Lapsed
EP
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Semiconductor chip carrier
Assignee: TE Connectivity Corp
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Filing: 1982-03-15
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Granted: —
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Expires: 2002-03-15
Abstract
Abstract A ceramic chip carrier having a copper lead frame (3) bonded directly to a ceramic substrate (1) has a common rim (13, 23) connecting the tip portions (7) of the leads. The rim (13,23) is raised above the substrate (1) and does not bond to the substrate (1) and is removed after bonding. In one embodiment the rim (13) is of reduced thickness to space it from the substrate (1) and a perforated ground pad (10) may be provided which is connected to the rim (13) by tabs (14). In another embodiment the rim (23) is provided with extended portions (15) which permit bending the rim (23) away from the substrate without altering the relative positions of the tip portions (7).
Inventors
- 👤 Dimitry G. Grabbe
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-27 14:27
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/701; H10W70/00; H10W70/40; H10W70/411; H10W70/479
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
96 words
A semiconductor chip carrier of the type comprising a ceramic substrate (1-) with a lead frame (3) attached thereto, said lead frame (3) comprising a plurality of leads having outer portions (5) which extend to the edge of said substrate and-tip portions (7) proximate to the interior region (9) thereof, said tip portions (7) having integral support means attached thereto, characterized in that said lead frame (3) has a copper surface which is bonded directly to said substrate (1), and said support means comprises a common rim (13, 23) overlying said .substrate (1) and spaced therefrom.
Claim 2
Dependent Claim
96 words
A semiconductor chip carrier of the type comprising a ceramic substrate (1-) with a lead frame (3) attached thereto, said lead frame (3) comprising a plurality of leads having outer portions (5) which extend to the edge of said substrate and-tip portions (7) proximate to the interior region (9) thereof, said tip portions (7) having integral support means attached thereto, characterized in that said lead frame (3) has a copper surface which is bonded directly to said substrate (1), and said support means comprises a common rim (13, 23) overlying said .substrate (1) and spaced therefrom.
Claim 3
Dependent Claim
37 words
The chip carrier of claim 1 characterized in that said common rim (13) is coplanar with said lead frame (3), said rim (13) having a thickness which is less than the thickness of said lead frame (3).
Claim 4
Dependent Claim
54 words
The chip carrier of claim 2 characterized in that said carrier further comprises a grounding pad (10) having a copper surface which is bonded directly to the interior region (9) of said substrate, said grounding pad (10) being connected to said rim (13) by a plurality of tabs (14) integral with said rim (13).
Claim 5
Dependent Claim
15 words
The chip carrier of claim 3 characterized in that said grounding pad (10) is perforated.
Claim 6
Dependent Claim
58 words
The chip carrier of claim 1 characterized in that said rim (23) has extended portions (15) which connect tip portions (7) which are substantially non-parallel, said extended portions (15) having a length greater than the shortest straight line distance between said non-parallel tip portions, said rim (23) being bent to a non-coplanar relationship to said lead frame (3).
Claim 7
Dependent Claim
24 words
The chip carrier of claim 1 wherein said ceramic substrate (1) is of a ceramic taken from the class consisting of alumina and beryllia.
Claim 8
Dependent Claim
30 words
The chip carrier of claim 1 characterized in that said interior region (9) is coplanar with the surface of the substrate (1) to which the lead frame (3) is bonded.
References Cited (Backward Citations)
US3832480A
Cited
US4137546A
Cited
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