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EP0063273A1 Expired / Lapsed EP ⏱️ 0.0 years remaining

Discharge system for plasma processing

Assignee: Applied Biosystems Inc
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Filing: 1982-03-31
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Granted: —
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Expires: 2002-03-31
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Abstract

Abstract An apparatus (10) for the downstream etching of semiconductor devices (31) which utilizes internal electrodes (12, 18) while avoiding the formation of loosely bonded particles in the discharge chamber (26).

Inventors

  • 👤 Alan R. Reinberg
  • 👤 George N. Steinberg

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-09 08:47
CPC Classifications
H; H01; H01J; H01J37/00; H01J37/32; H01J37/32009; H01J37/32082; H01J37/321; H01J37/32357

Claims Analysis

Total Claims: 13
Claim 1
Independent Claim 88 words
. An apparatus for the downstream etching of semiconductor devices, comprising in combination; an etching chamber containing the semiconductor device to be etched, a tube having a discharge chamber connected between a source of etching gas and said etching chamber, . said tube including a pair of electrodes disposed therein made of a material which chemically reacts with the plasma products created when the etching gases in said tube are excited to form an etching plasma whereby the etching plasma entering said etching chamber is substantially particle free.
Claim 2
Dependent Claim 88 words
. An apparatus for the downstream etching of semiconductor devices, comprising in combination; an etching chamber containing the semiconductor device to be etched, a tube having a discharge chamber connected between a source of etching gas and said etching chamber, . said tube including a pair of electrodes disposed therein made of a material which chemically reacts with the plasma products created when the etching gases in said tube are excited to form an etching plasma whereby the etching plasma entering said etching chamber is substantially particle free.
Claim 3
Dependent Claim 17 words
An apparatus according to claim 1 wherein said electrodes are disposed at opposite ends of said tube.
Claim 4
Dependent Claim 13 words
An apparatus according to claim 2 wherein said electrodes are made of graphite.
Claim 5
Dependent Claim 13 words
An apparatus according to claim 2 wherein said electrodes are made of silicon.
Claim 6
Dependent Claim 14 words
An apparatus according to claim 4 wherein said electrodes are made of silicon carbide.
Claim 7
Dependent Claim 28 words
An apparatus according to claim 2 further including, a low frequency power source connected to said electrodes for creating a plasma of said etching gas in said tube.
Claim 8
Dependent Claim 19 words
An apparatus according to claim 6 wherein said low frequency power source is a 60 hertz, 1,000 volt source.
Claim 9
Dependent Claim 27 words
An apparatus according to claim 2 further including, a d.c. power source connected to said electrodes for creating a plasma of said etching gas in said tube.
Claim 10
Dependent Claim 17 words
An apparatus according to claim 8 wherein said d.c. power source provides approximately 300 watts of power.
Claim 11
Independent Claim 33 words
An apparatus according to claims 1, 2, 3, 4, 5, 6, 7, 8 or 9 further including pump means connected to said etching chamber for evacuating said etching chamber at a predetermined rate.
Claim 12
Dependent Claim 31 words
A apparatus according to claim 10 wherein the etching gas is 1 part CF 4 to 3 or 4 parts 0 2 when photoresist is being stripped from the semiconductor device.
Claim 13
Dependent Claim 25 words
An apparatus according to claim 10 wherein the etching gases are 3 parts CF 4 and one part 0 2 when silicon is being etched.

References Cited (Backward Citations)

US3476971A Cited
US3984301A Cited
US4030967A Cited
US4175235A Cited
US4253907A Cited
US4209357A Cited

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