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EP0060682A2
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EP
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Process for making dielectric stencilled microcircuits
Assignee: Honeywell Inc
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Filing: 1982-03-11
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Granted: —
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Expires: 2002-03-11
Abstract
Abstract A process for making complex, high density microcircuits in which thick-film dielectric pastes (21) are photolithography patterned into high resolution stencils to produce complementary conductor circuitry patterns, the voids (25, 26 Figure 2b) of the developed dielectric stencil are filled with thick-film conductor paste (27,28 Figure 2c) and then the resulting structure is fired in an air or nitrogen atmosphere. Thus the number of separate firing operations is reduced which is important in multilevel hybrid structures.
Inventors
- 👤 John P. Cummings
- 👤 David E. Pitkanen
- 👤 Janice D. Makos
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-01 14:36
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/4664; H05K3/4667; G; G03; G03F; G03F7/00; H05K3/10; H05K3/12; H05K3/1258; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K1/09; H05K1/092; H05K2203/00; H05K2203/05; H05K2203/0502; H05K2203/0514; H05K2203/0562; H05K2203/0568; H05K3/0011; H05K3/0017; H05K3/002; H05K3/0023; H05K3/107; H05K3/40; H05K3/4038; H05K3/4053; H05K3/465
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
87 words
A process for fabricating dielectric stenciled microcircuits, the process comprising the steps of coating an insulating dielectric paste and photopatterning means over the surface of a substrate; selectively exposing through a photolithography mask the substrate coating to light; and removing the exposed dielectric paste in the areas where the conductive circuit lines are to be located, thereby forming a dielectric stencil with voids; characterized by the steps of filling the dielectric stencil voids with thick-film conductive paste to form the conductive lines; and, firing the resulting structure.
Claim 2
Dependent Claim
87 words
A process for fabricating dielectric stenciled microcircuits, the process comprising the steps of coating an insulating dielectric paste and photopatterning means over the surface of a substrate; selectively exposing through a photolithography mask the substrate coating to light; and removing the exposed dielectric paste in the areas where the conductive circuit lines are to be located, thereby forming a dielectric stencil with voids; characterized by the steps of filling the dielectric stencil voids with thick-film conductive paste to form the conductive lines; and, firing the resulting structure.
Claim 3
Dependent Claim
26 words
.The process according to Claim 1, characterized in that the firing step takes place in a nitrogen atmosphere at a temperature range of 800°C to 1000°C.
Claim 4
Dependent Claim
26 words
The process according to Claim 1, characterized in that the firing step takes place in an air atmosphere at a temperature range of 800°C to 1000°C.
Claim 5
Dependent Claim
27 words
The process according to Claim 1, 2 or 3, characterized in that the thick-film conductive paste is a noble metal, or a base metal such as copper.
Claim 6
Dependent Claim
26 words
The process according to any one of the preceding claims, characterized in that the photopatterning means of the coating is a constituent of the dielectric paste.
Claim 7
Dependent Claim
30 words
The process according to any one of Claims 1 to 4, characterized in that the photopatterning means of the coating is a layer of photoresist deposited over the dielectric paste.
Claim 8
Dependent Claim
51 words
The process of any one of the preceding claims, characterized in that the coating step includes depositing a layer of an insulating dielectric paste over the surface of the substrate and drying the dielectric paste layer, and depositing a layer of photoresist over the-insulating dielectric paste and drying the photoresist layer.
Claim 9
Dependent Claim
15 words
A microcircuit made by the process according to any one of Claims 1 to 7.
References Cited (Backward Citations)
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