Patent EP0059434A2 successfully refreshed from Google Patents.
EP0059434A2
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EP
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Multi-layer printed circuit board and process for production thereof
Assignee: Hitachi Ltd
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Filing: 1982-02-25
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Granted: —
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Expires: 2002-02-25
Abstract
Abstract A multi-layer printed circuit board produced by laminating a plurality of unit circuit sheets via prepreg resin sheets, the cured resin in said unit circuit sheet having a glass transition temperature Tg 1 , said prepreg resin sheets having been prepared by impregnating a reinforcing substrate with a resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature of Tg, and that of T 92 of the resin in the prepreg resin sheet after cured, and binding the laminated sheets with heating under pressure at a temperature equal to or lower than both the temperatures of Tg, and Tg 2 , has excellent dimensional stability, heat resistance and through-hole reliability.
Inventors
- 👤 Akio Takahashi
- 👤 Takeshi Shimazaki
- 👤 Motoyo Wajima
- 👤 Hirosada Morishita
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-31 23:45
CPC Classifications
B; B32; B32B; B32B27/00; B32B27/06; B32B27/08; B32B27/04; C; C08; C08G; C08G59/00; C08G59/18; C08G59/40; C08G59/4007; C08G59/4014; C08G59/4042; C08G59/50; C08G59/56; C08G73/00; C08G73/06; C08G73/0622; C08G73/0638; C08G73/0644; C08J; C08J5/00; C08J5/24; C08J5/248; C08L; C08L79/00; C08L79/04; C08L79/08; C08L79/085; H; H01; H01B; H01B3/00; H01B3/18; H01B3/30; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/032; H05K1/0346; H05K3/00; H05K3/46; H05K3/4688; B32B2260/00; B32B2260/04; B32B2260/046; B32B2305/00; B32B2305/07; B32B2305/076; B32B2457/00; B32B2457/08; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0154; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09536; H05K2203/00; H05K2203/06; H05K2203/061; H05K2203/11; H05K2203/1105; H05K3/4611; H05K3/4623; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31511; Y10T428/31721
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
129 words
A multi-layer printed circuit board produced by laminating a plurality of unit circuit sheets having circuit layers on at least one surface of said unit circuit sheets in which a resin compositoin has been impregnated and cured via prepreg resin sheets, said prepreg resin sheets having been prepared by impregnating reinforcing substrates with a resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature (Tg l ) of the cured resin in the unit circuit sheets and the glass transition temperature (Tg 2 ) of the resin in the prepreg resin sheets after cured,-and binding the laminated sheets with heating under pressure at a temperature equal to or lower than both the temperatures of Tg 1 and Tg 2 .
Claim 2
Dependent Claim
129 words
A multi-layer printed circuit board produced by laminating a plurality of unit circuit sheets having circuit layers on at least one surface of said unit circuit sheets in which a resin compositoin has been impregnated and cured via prepreg resin sheets, said prepreg resin sheets having been prepared by impregnating reinforcing substrates with a resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature (Tg l ) of the cured resin in the unit circuit sheets and the glass transition temperature (Tg 2 ) of the resin in the prepreg resin sheets after cured,-and binding the laminated sheets with heating under pressure at a temperature equal to or lower than both the temperatures of Tg 1 and Tg 2 .
Claim 3
Dependent Claim
23 words
A multi-layer printed circuit board according to Claim 1, wherein both the temperatures of Tg 1 and Tg 2 are 170°C or higher.
Claim 4
Dependent Claim
167 words
A multi-layer printed circuit board according to Claim 1, wherein the resin composition for at least the prepreg resin sheet comprises (I) a prepolymer obtained by preliminarily reacting with heating (a) a bisimide of the formula: wherein R is a divalent organic group having at least one carbon-carbon double bond; and R 1 is a divalent organic group having at least two carbon atoms, and (b) a diamine of the formula: wherein R 2 is a divalent organic group having at least two carbon atoms, (II) an epoxy resin, and (III) at least one amine selected from the group consisting of a s-triazine type amine compound of the formula: wherein R 32 R 4 and R 5 are independently hydrogen, halogen, a hydrocarbon group, an amino group, a hydroxyl group, an amino-substituted hydrocarbon group, a hydroxl- substituted hydrocarbon group, or a hydrocarbon-substituted amino group, and at least one of R 33 R 4 and R 5 being an amino group or an amino-substituted hydrocarbon group, and dicyandiamide.
Claim 5
Dependent Claim
19 words
A multi-layer printed circuit coard according to Claim 3, wherein the amine is benzoguanamine, 2,4-diamino-s-triazlne, 2,4-diamino-6-methyl-s-triazine, melamine, or dicyandiamide.
Claim 6
Dependent Claim
122 words
A combined material system for producing a multi-layer printed circuit board comprising (i) at least one unit circuit sheet having circuit layers on at least one surface of said sheet in which a resin composition has been impregnated and cured, said cured resin having a glass transition temperature (Tg 1 ) of 170°C or higher, and (ii) at least one prepreg resin sheet having being prepared by impregnating a reinforcing substrate with a resin composition which can be cured at a temperature equal to or lower than both the glass transition tempera- ture of Tg l and the glass transition temnerature (T g 2 ) of the resin in the prepreg resin sheet after cured, said Tg 2 being 170°C or higher.
Claim 7
Dependent Claim
122 words
A combined material system for producing a multi-layer printed circuit board comprising (i) at least one unit circuit sheet having circuit layers on at least one surface of said sheet in which a resin composition has been impregnated and cured, said cured resin having a glass transition temperature (Tg 1 ) of 170°C or higher, and (ii) at least one prepreg resin sheet having being prepared by impregnating a reinforcing substrate with a resin composition which can be cured at a temperature equal to or lower than both the glass transition tempera- ture of Tg l and the glass transition temnerature (T g 2 ) of the resin in the prepreg resin sheet after cured, said Tg 2 being 170°C or higher.
Claim 8
Dependent Claim
168 words
A combined material system according to Claim 5, wherein the resin composition for at least the prepreg resin sheet comprises (I) a prepolymer obtained by preliminarily reacting with heating (a) a bisimide of the formula; wherein R is a divalent organic group having at least one carbon-carbon double bond; and R 1 is a divalent organic group having at least two carbon atoms, and (b) a diamine of the formula: wherein R 2 is a divalent organic group having at least two carbon atoms, (II) an epoxy resin, and (III) at least one amine selected from the group consisting of a s-triazine type amine compound of the formula: wherein R 3 , R 4 and R 5 are independently hydrogen, halogen, a hydrocarbon group, an amino group, a hydroxyl group, an amino-substituted hydrocarbon group, a hydroxyl-substituted hydrocarbon group, or a hydrocarbon -substituted amino group, and at least one of R 3 , R 4 and R 5 being an amino group or an amino-substituted hydrocarbon group, and dicyandiamide.
Claim 9
Dependent Claim
174 words
A combined material system according to Claim 5, wherein the unit circuit sheet contains a polyimide resin and the prepreg resin sheet contains a resin composition comprising (I) a prepolymer obtained by preliminarily reacting with heating (a) a bisimide of the formula: wherein R is a divalent organic group having at least one carbon-carbcn double bond; and R 1 is a divalent organic group having at least two carbon atoms, and (b) a diamine of the formula: wherein R 2 is a divalent organic group having at least two carbon atoms, (II) an epoxy resin, and (III) at least one amine selected from the group consisting of a s-triazine type amine compound of the formula: wherein R 3 , R 4 -and R 5 are independently hydrogen, halogen, a hydrocarbon group, an amino group, a hydroxyl group, an amino-substituted hydrocarbon group, a hydroxyl-substituted hydrocarbon group, or a hydrocarbon-substituted amino group, and at least one of R 3 , R 4 and R 5 being an amino group or an amino-substituted hydrocarbon group, and dicyandiamide.
Claim 10
Dependent Claim
20 words
A combined material system according to Claim 6 or 7, wherein the amine is benzoguanamine, 2,4-diamino-s-triazine, 2,4-diamino-6-methyl-s-triazine, melamine, or dicyandiamide.
Claim 11
Dependent Claim
45 words
A prepreg resin sheet prepared by impregnating a reinforcing substrate with a resin composition which can be cured at a temperature equal to or lower than the glass transition temperature (Tg 2 ) of the resin after cured, said Tg 2 being 170°C or higher.
Claim 12
Dependent Claim
45 words
A prepreg resin sheet prepared by impregnating a reinforcing substrate with a resin composition which can be cured at a temperature equal to or lower than the glass transition temperature (Tg 2 ) of the resin after cured, said Tg 2 being 170°C or higher.
Claim 13
Dependent Claim
160 words
A prepreg resin sheet according to Claim 9, wherein the resin composition comprises (I) a prepolymer obtained by preliminarily reacting with heating (a) a bisimide of the formula: wherein R is a divalent organic group having at least one carbon-carbon double bond; and R 1 is a divalent organic group having at least two carbon atoms, and (b) a diamine of the formula: wherein R 2 is a divalent organic group having at least two carbon atoms, (II) an epoxy resin, and (III) at least one amine selected from the group consisting of a s-triazine type amine compound of the formula: wherein R 3 , R 4 and R 5 are independently hydrogen, halogen, a hydrocarbon group, an amino group, a hydroxyl group, an amino-substituted hydrocarbon group, a hydroxyl-substituted hydrocarbon group, or a hydrocarbon-substituted amino group, and at least one of R 3 , R 4 and R 5 being an amino group or an amino-substituted hydrocarbon group, and dicyandiamide.
Claim 14
Dependent Claim
17 words
A prepreg resin sheet according to Claim 10, wherein the amine is benzoguanamine, 2,4-diamino-s-triazine, 2,4-diamino-6-methyl-s-triazine, or dicyandiamide.
Claim 15
Dependent Claim
172 words
A varnish for preparing a prepreg resin sheet or a unit circuit sheet for producing a multi-layer printed circuit board comprising (I) a prepolymer obtained by preliminarily reacting with heating (a) a bismide of the formula: wherein R is a divalent organic group having at least one carbon-carbon double bond; and R 1 is a divalent organic group having at least two carbon atoms, and (b) a diamine of the formula: wherein R 2 is a divalent organic group having at least two carbon atoms, (II) an epoxy resin, (III) at least one amine selected from the group consisting of a s-triazine type amine compound of the formula: wherein R 3 , R 4 and R 5 are independently hydrogen, halogen, a hydrocarbon group, an amino group, a hydroxyl group, an amino-substituted hydrocarbon group, a hydroxyl-substituted hydrocarbon group, or a hydrocarbon-substituted amino group, and at least one of R 3 , R 4 and R 5 being an amino group or an amino-substituted hydrocarbon group, and dicyandiamide, and (IV) an organic solvent.
Claim 16
Dependent Claim
172 words
A varnish for preparing a prepreg resin sheet or a unit circuit sheet for producing a multi-layer printed circuit board comprising (I) a prepolymer obtained by preliminarily reacting with heating (a) a bismide of the formula: wherein R is a divalent organic group having at least one carbon-carbon double bond; and R 1 is a divalent organic group having at least two carbon atoms, and (b) a diamine of the formula: wherein R 2 is a divalent organic group having at least two carbon atoms, (II) an epoxy resin, (III) at least one amine selected from the group consisting of a s-triazine type amine compound of the formula: wherein R 3 , R 4 and R 5 are independently hydrogen, halogen, a hydrocarbon group, an amino group, a hydroxyl group, an amino-substituted hydrocarbon group, a hydroxyl-substituted hydrocarbon group, or a hydrocarbon-substituted amino group, and at least one of R 3 , R 4 and R 5 being an amino group or an amino-substituted hydrocarbon group, and dicyandiamide, and (IV) an organic solvent.
Claim 17
Dependent Claim
16 words
A varnish according to Claim 12, wherein the amine is benzoguanamie, 2,4-diamino-s-triazine, 2,4-diamino-6-methyl-s-triazine, melamine, or dicyandiamide.
Claim 18
Dependent Claim
135 words
A process for producing a multi-layer circuit board which comprises laminating a plurality of unit circuit sheets having circuit layers on at least one surface of said unit circuit sheets in which a resin composition has been impregnated and cured, via prepreg resin sheets, said prepreg resin sheets having been prepared by impregnating a reinforcing substrate with a resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature (Tg l ) of the cured resin in the unit circuit sheets and the glass transition temperature (Tg 2 ) of the resin in the prepreg resin sheets after cured, and binding the laminated sheets with heating under pressure at a temperature equal to or lower than both the temperatures of Tg 1 and T g 2 .
Claim 19
Dependent Claim
135 words
A process for producing a multi-layer circuit board which comprises laminating a plurality of unit circuit sheets having circuit layers on at least one surface of said unit circuit sheets in which a resin composition has been impregnated and cured, via prepreg resin sheets, said prepreg resin sheets having been prepared by impregnating a reinforcing substrate with a resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature (Tg l ) of the cured resin in the unit circuit sheets and the glass transition temperature (Tg 2 ) of the resin in the prepreg resin sheets after cured, and binding the laminated sheets with heating under pressure at a temperature equal to or lower than both the temperatures of Tg 1 and T g 2 .
Claim 20
Dependent Claim
20 words
A process according to Claim 14, wherein both the temperatures of Tg 1 and Tg 2 are 170°C or higher.
Claim 21
Dependent Claim
166 words
A process according to Claim 14 or 15, wherein the resin composition for at least the prepreg resin sheet comprises (I) a prepolymer obtained by preliminarily reacting with heating (a) a bisimide of the formula: wherein R is a divalent organic group having at least one carbon-carbon double bond; and R 1 is a divalent organic group having at least two carbon atoms, and (b) a diamine of the formula: wherein R 2 is a divalent organic group having at least two carbon atoms, (II) an epoxy resin, and (III) at least one amine selected from the group consisting of a s-triazine type amine compound of the formula: wherein R 3 , R 4 and R 5 are independently hydrogen, halonge, a hydrocarbon group, an amino group, a hydroxyl group, an amino-substituted hydrocarbon group, a hydroxyl-substituted hydrocarbon group, or a hydrocarbon-substituted amino group, and at least one of R 31 R 4 and R 5 being an amino group or an amino-substituted hydrocarbon group, and dicyandiamide.
Claim 22
Dependent Claim
21 words
A process according to Claim 14, wherein the pressure for binding the laminated sheets is 5 to 30 kg/cm 2 .
Claim 23
Dependent Claim
34 words
A process according to Claim 14 or 16, wherein the pressure for binding the laminated sheets is 5 to 30 kg/cm 2 and the temperature for binding the laminated sheets is 180°C or lower.
References Cited (Backward Citations)
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