Patent EP0059337A2 successfully refreshed from Google Patents.
EP0059337A2
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EP
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High density connecting system and method for semi-conductor devices
Assignee: International Business Machines Corp
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Filing: 1982-02-05
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Granted: —
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Expires: 2002-02-05
Abstract
Abstract A system for connecting a semiconductor chip (70) on a carrier substrate (11) to a printed circuit card (80) is described. The substrate (11) has a flexible, extendable wiring membrane (50) attached to the bottom thereof which extends beyond the periphery of the substrate (11) and in the area beyond the periphery is provided with electrical contacts (51). These electrical contacts (51) are mated to complementary contacts in the printed circuit card (80) which is biased from the semiconductor chip carrier by electrical and thermal contact means (91). The membrane (50) provides high density electrical contact between the semiconductor (70) and printed circuit card (80). A process for forming the same is also described.
Inventors
- 👤 Mario Enrique Ecker
- 👤 Leonard Theodore Olson
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 08:25
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/303; H05K3/36; H05K3/361; H05K3/363; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/095; H10W70/60; H10W70/611; H10W70/62; H10W70/63; H10W70/635; H10W70/67; H10W70/688; H05K1/00; H05K1/02; H05K1/0201; H05K1/0203; H05K1/0204; H05K1/0206; H05K1/11; H05K1/111; H05K1/112; H05K1/113; H05K1/14; H05K1/141; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09472; H05K2201/095; H05K2201/09509; H05K2201/09572; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10659; H05K2201/10666; H05K2201/10681; H05K2201/10727; H05K2201/10742; H05K2201/1075; H05K2201/10878; H05K2201/20; H05K2201/2036; H05K2203/00; H05K2203/04; H05K2203/043; H05K3/306; H05K3/308; H05K3/32; H05K3/34; H05K3/3447; H05K3/3452; H05K3/3465; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
73 words
A connecting system for semiconductor devices with a semiconductor (70) carried on a substrate (11) and a printed circuit card (80) in electric contact with said semiconductor (70) via said substrate (11) characterized by a flexible, extendable membrane (50) being attached to both said substrate (11) and said card (80), said membrane (50) including a conductive pattern (42, 44) which electrically connects said semiconductor (70) via said substrate (11) with said card (80).
Claim 2
Dependent Claim
73 words
A connecting system for semiconductor devices with a semiconductor (70) carried on a substrate (11) and a printed circuit card (80) in electric contact with said semiconductor (70) via said substrate (11) characterized by a flexible, extendable membrane (50) being attached to both said substrate (11) and said card (80), said membrane (50) including a conductive pattern (42, 44) which electrically connects said semiconductor (70) via said substrate (11) with said card (80).
Claim 3
Dependent Claim
55 words
The connecting system of claim 1, wherein said semiconductor (70) is carried on one major surface of said substrate (11) and selectively electrically connected through said substrate (11) with an opposed major surface thereof, and wherein said membrane (50) is attached and its conductive pattern (42, 44) selectively electrically connected to said opposite major surface.
Claim 4
Dependent Claim
45 words
The connecting system of claim 2, wherein said membrane (50) has an area greater than said substrate (11) and wherein in the area outside the periphery of said substrate (11) electrical contacts (51) are provided which complement the electrical contacts (81a-81d) on said card (80).
Claim 5
Dependent Claim
39 words
The connecting system of claim 2, further including biasing means (91) between said substrate (11) and said card (80), said biasing means (91) maintaining said semiconductor (70) and said card (80) in thermal and electrical contact while separating them.
Claim 6
Dependent Claim
18 words
The connecting system of claim 1, wherein said membrane (50) comprises a resin, in particular a polyimide resin.
Claim 7
Dependent Claim
28 words
The connecting system of claim 2, wherein said electrical contacts in said membrane (50) are female contacts (51) and in said printed circuit card are male contacts (81).
Claim 8
Dependent Claim
28 words
The connecting system of claim 1, wherein said printed circuit card (80) carries therein a plurality of signal lines (42, 44) which are skewed relative to one another.
Claim 9
Dependent Claim
45 words
The connecting system of claim 6, wherein said male contacts (81, 83) extend only partly into said card (81) and are provided on both sides of said printed circuit card (80), whereby a membrane (50) can be mounted on both sides of said card (80).
Claim 10
Dependent Claim
230 words
A process for forming a connecting system for semiconductor devices which comprises: forming on a substrate (11) a plurality of via holes (13) therethrough which are metal (14) filled and which maintain a first metallization pattern on one major surface thereof in electric contact with a second metallization pattern on a second major surface thereof, encasing the minor surfaces of said substrate (11) with a protective resinous material (28, 31), attaching to the second major surface of said substrate (11) a flexible, extendable membrane (50), in particular a multi-level wiring membrane, which extends beyond the periphery of said substrate (11), which membrane (50) comprises a metallization pattern (42, 44) and which is encased in a protective resin in selective electric contact with said second metallization pattern and which has contact means (51) in the periphery thereof exterior to said substrate (11), said contact means (51) being in electric contact with said first metallization pattern by way of the metallization pattern encased in protective resin, said second metallization pattern and said via holes (13) filled with metal (14), removing said protective resinous material (28, 31) from said minor surfaces resin, and mounting a semiconductor (70) on the first major surface of said substrate (11), such that said semiconductor (70) is in electric contact with said first metallization pattern and thereby with said contacts (51) in the periphery of said membrane (50).
Claim 11
Dependent Claim
230 words
A process for forming a connecting system for semiconductor devices which comprises: forming on a substrate (11) a plurality of via holes (13) therethrough which are metal (14) filled and which maintain a first metallization pattern on one major surface thereof in electric contact with a second metallization pattern on a second major surface thereof, encasing the minor surfaces of said substrate (11) with a protective resinous material (28, 31), attaching to the second major surface of said substrate (11) a flexible, extendable membrane (50), in particular a multi-level wiring membrane, which extends beyond the periphery of said substrate (11), which membrane (50) comprises a metallization pattern (42, 44) and which is encased in a protective resin in selective electric contact with said second metallization pattern and which has contact means (51) in the periphery thereof exterior to said substrate (11), said contact means (51) being in electric contact with said first metallization pattern by way of the metallization pattern encased in protective resin, said second metallization pattern and said via holes (13) filled with metal (14), removing said protective resinous material (28, 31) from said minor surfaces resin, and mounting a semiconductor (70) on the first major surface of said substrate (11), such that said semiconductor (70) is in electric contact with said first metallization pattern and thereby with said contacts (51) in the periphery of said membrane (50).
Claim 12
Dependent Claim
17 words
The process of claim 9, wherein said membrane (50) is formed in situ on said substrate (11).
References Cited (Backward Citations)
No citation records indexed.
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