Soldering apparatus

Claim 1

A soldering apparatus for a printed circuit board, comprising: a first solder tank and a second solder tank which are provided independently of each other so as to store molten solder therein; , a first nozzle and a second nozzle which are disposed, respectively, in said first solder tank and said second solder tank so as to spout therefrom the molten solder in said first solder tank and said second solder tank, respectively; a first pump device and a second pump device which are provided independently of each other so as to supply the molten solder to said first nozzle and said second nozzle, respectively; and means for conveying said printed circuit board so that a lower surface of said printed circuit board may be sequentially brought into contact with the solder waves discharged from said first nozzle and said second nozzle; said first nozzle discharging two first solder waves therefrom so that said first solder waves may be formed approximately symmetrically with respect to an outlet of said first nozzle; said printed circuit board being passed through said first solder waves so as to depart from said first solder waves at a forward position with respect to an uppermost point of said first solder waves in a direction of conveyance of said printed circuit board; said second nozzle discharging a second solder wave therefrom so that said second solder wave may be disposed above said first solder waves; said second solder wave flowing down in a direction opposite to that of conveyance of said printed circuit board; said printed circuit board being conveyed slantways in accordance with a difference in height between said first solder waves and said second solder wave.