EP0051165A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Repairable IC package with thermoplastic chip attach
Assignee: Unisys Corp
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Filing: 1981-10-09
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Granted: —
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Expires: 2001-10-09
Abstract
Abstract Disclosed is an integrated circuit package that is comprised of a substrate (12), a first integrated circuit chip (11a), and a thermoplastic material (20a) which rigidly attaches the first chip to the substrate. This thermoplastic material is an organic polymer capable of repeatedly being softened when heated and hardened again when cooled, such as polyethylene. The thermoplastic material is disposed on the substrate in a manner that enables the first chip to be removed and to be replaced with a second chip by a softening-hardening sequence.
Inventors
- 👤 Daniel Marshall Andrews
- 👤 Carl Edward Hoge
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 05:14
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0442; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W72/00; H10W72/01; H10W72/013; H10W72/071; H10W72/0711; H10W70/682; H10W72/073; H10W72/07331; H10W72/07337; H10W72/07339; H10W72/075; H10W72/30; H10W72/351; H10W72/353; H10W72/354; H10W72/50; H10W72/531; H10W72/5363; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
71 words
An integrated circuit package comprised of a substrate, a first integrated circuit chip, and a thermoplastic material rigidly attaching said first chip to said substrate; said thermoplastic material including any organic polymer capable of repeatedly being softened when heated and hardened again when cooled, and being disposed in a manner that enables said first chip to be removed from said substrate and replaced with a second chip by a softening-hardening sequence.
Claim 2
Dependent Claim
71 words
An integrated circuit package comprised of a substrate, a first integrated circuit chip, and a thermoplastic material rigidly attaching said first chip to said substrate; said thermoplastic material including any organic polymer capable of repeatedly being softened when heated and hardened again when cooled, and being disposed in a manner that enables said first chip to be removed from said substrate and replaced with a second chip by a softening-hardening sequence.
Claim 3
Dependent Claim
32 words
An integrated circuit package according to Claim 1 wherein said thermopla'stic material is selected from the group consisting of polyethylene, polysulfone, polyphenylene sulfide, acrylics, nylon, phenylene oxide, polycarbonate, polypropylene, polystyrene, and polyvinyl.
Claim 4
Dependent Claim
20 words
An integrated circuit package according to Claim 1 wherein said thermoplastic material is mixed with a thermally conductive filler material.
Claim 5
Dependent Claim
20 words
An integrated circuit package according to Claim 1 wherein said thermoplastic material is mixed with an electrically conductive filler material.
Claim 6
Dependent Claim
34 words
An integrated circuit package according to Claim 1 wherein said substrate has a cavity, said thermoplastic material partially fills said cavity, and said first chip has a backside surface imbedded in said thermoplastic material.
Claim 7
Dependent Claim
44 words
An integrated circuit package according to Claim 1 wherein said substrate has a substantially flat major surface, a layer of said thermoplastic material covers a predetermined portion of said major surface, and said first chip has a backside surface imbedded in said thermoplastic material.
Claim 8
Dependent Claim
44 words
An integrated circuit package according to Claim 1 wherein said integrated circuit package further includes at least one other integrated circuit chip rigidly attached to said substrate with said thermoplastic material in a manner that enables said other chip to be removed and replaced.
Claim 9
Dependent Claim
31 words
An integrated circuit package according to Claim 1 wherein said substrate is selected from the group consisting of a ceramic, a porcelain coated metal, and an epoxy glass printed circuit board.
Claim 10
Dependent Claim
32 words
An integrated circuit package according to Claim 1 wherein ! said integrated circuit package further includes a plurality of electrical leads bonded between respective pads on said first chip and said substrate.
References Cited (Backward Citations)
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