Patent EP0043029A2 successfully refreshed from Google Patents.
EP0043029A2
Expired / Lapsed
EP
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Sintered multi-layer ceramic substrate and method of making same
Assignee: International Business Machines Corp
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Filing: 1981-06-16
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Granted: —
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Expires: 2001-06-16
Abstract
Abstract The MLC substrate (10) is formed of a plurality of ceramic green sheets that are provided with metallurgy patterns and/or metal filled vias laminated together and sintered. The top sheet (40) thickness is at least 20 % greater than the individual thickness of the underlying sheets (21, 23, 25). At least part of the vias (30, 34) in said top sheet (40) form a pattern of vias (30) having a center-to-center spacing of 178 to 305 um, with the via diameter being in the range of 35 to 55 % of the center-center via spacing. The MLC substrate (10) in which cracks especially between closely spaced metal filled vias (30) are minimized or eliminated can be used to interconnect LSI circuit chips mounted on top of it.
Inventors
- 👤 Richard J. Hetherington
- 👤 George E. Melvin
- 👤 Stephen A. Milkovich
- 👤 Ernest N. Urfer
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 21:55
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/692; H10W70/01; H10W70/05; H10W70/095; H10W70/611; H10W70/68; H10W70/685; H05; H05K; H05K1/00; H05K1/02; H05K1/0271; H05K1/0296; H05K1/0298; H05K1/03; H05K1/0306; H05K3/00; H05K3/46; H05K3/4611; H05K3/4626; H05K3/4629; H05K3/4644; H05K3/4673; H05K3/4676; H10W70/62; H10W70/63; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
102 words
A sintered multi-layer ceramic (MLC) substrate (10) formed of a plurality of ceramic green sheets that are provided with metallurgy patterns and/or metal filled vias, laminated together and sintered characterized in that the top sheet (40) has a thickness of at least 20 % greater than the individual thickness of the underlying sheets (21, 23, 25), that at least part of the vias (30, 34) in said top sheet (40) form a'pattern of vias (30) having a center-to-center spacing of 178 to 305 pm, with the via diameter being in the range of 35 to 50 % of the center-to-center via spacing.
Claim 2
Dependent Claim
102 words
A sintered multi-layer ceramic (MLC) substrate (10) formed of a plurality of ceramic green sheets that are provided with metallurgy patterns and/or metal filled vias, laminated together and sintered characterized in that the top sheet (40) has a thickness of at least 20 % greater than the individual thickness of the underlying sheets (21, 23, 25), that at least part of the vias (30, 34) in said top sheet (40) form a'pattern of vias (30) having a center-to-center spacing of 178 to 305 pm, with the via diameter being in the range of 35 to 50 % of the center-to-center via spacing.
Claim 3
Dependent Claim
50 words
MLC substrate according to claim 1, wherein a plurality of sheets (21, 23, 25) having redistribution metallurgy patterns including vias is located on the top portion of the substrate (10), each one of said sheets (21, 2.3, 25) each having a thickness in the range of 114 to 161 um.
Claim 4
Dependent Claim
49 words
MLC substrate according to claim 1 or 2, wherein said pattern of vias (30, 34) in said top sheet (40) comprises at least one pattern in grid form of vias (30) adapted to provide a solder pad configuration (12) for joining a semiconductor device (14) by solder bonding technique.
Claim 5
Dependent Claim
29 words
MLC substrate according to claim 3, wherein said grid pattern of vias (30) is surrounded by at least 1 row of vias (34) connected to engineering change pads (24).
Claim 6
Dependent Claim
47 words
MLC substrate according to any one of claims 2 to 4 wherein the diameter of the vias (30, 34) in said top sheet (40) is approximately the same as the diameter of said vias associated with said redistribution metallurgy patterns in the underlying sheets (21, 23, 25).
Claim 7
Independent Claim
140 words
A method of fabricating a sintered MLC substrate especially according to any one of claims 1 to 5, wherein a plurality of ceramic green sheets are formed and provided with vias, wherein using a conductive metallurgy paste a metallurgy pattern is printed on the green sheets and the vias are filled, and wherein the sheets are stacked, laminated together and sintered, characterized in that the top ceramic green sheet is made at least 20% thicker than the underlying green sheets having a thickness in the range of 152 to 229 pm and is provided with a pattern of vias (30, 34) wherein after sintering at least some vias (30) are spaced center-to-center in the range of 178 to 305 µm,with the via diameter adjusted to a value in the range of 35 to 55 % of said center-to-center via spacing.
Claim 8
Dependent Claim
52 words
A method according to claim 6 wherein into said top sheet having a thickness of 279 um vias with a diameter of 140 µm and a center-to-center spacing of 249 µm are punched, and wherein said top sheet is laminated togethe with a stack of 203 µm thick sheets (21, 23, 25).
References Cited (Backward Citations)
No citation records indexed.
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