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EP0040905A1 Expired / Lapsed EP ⏱️ 0.0 years remaining

The manufacture of ceramic circuit substrates

Assignee: Fujitsu Ltd
•
Filing: 1981-04-07
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Granted: —
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Expires: 2001-04-07
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Abstract

Abstract Gold balls 9 are pressed into and embedded in a green sheet 2. This effectively provides, in a single step process, the formation and filling of via holes in the green sheet 2. <??>The green sheet 2 is carried by a tray 1. A mould or ball arranging plate 8 is placed on the green sheet 2 and gold balls 9 are introduced into holes in the mould or plate 8. The gold balls 9 are pressed down into and embedded in green sheet 2 by a force piston 10.

Inventors

  • 👤 Kishio Yokouchi
  • 👤 Hiromi Ogawa
  • 👤 Hiromitsu Yokoyama
  • 👤 Nobuo Kamehara
  • 👤 Koichi Niwa
  • 👤 Kyohei Murakawa

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-02 15:24
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/4038; H05K3/4046; H05K3/46; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/095; H10W70/098; H10W70/60; H10W70/611; H10W70/62; H10W70/63; H10W70/635; H10W70/67; H10W70/69; H10W70/692; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K1/09; H05K1/092; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0364; H05K2201/0382; H05K2201/10; H05K2201/10227; H05K2201/10234; H05K2203/00; H05K2203/01; H05K2203/0195; H05K3/4611; H05K3/4626; H05K3/4629; H10W72/00; H10W72/01; H10W72/012; H10W72/01204; H10W72/01221; H10W72/01223; H10W72/01225; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49147; Y10T29/49151; Y10T29/49153; Y10T29/49636; Y10T29/49643; Y10T29/49679; Y10T29/49694

Claims Analysis

Total Claims: 19
Claim 1
Independent Claim 24 words
A method of forming a ceramic substrate, characterised in that a conductive ball is embedded into a green sheet used to form the substrate.
Claim 2
Independent Claim 24 words
A method of forming a ceramic substrate, characterised in that a conductive ball is embedded into a green sheet used to form the substrate.
Claim 3
Dependent Claim 72 words
A method as claimed in claim 1, wherein a mould having many holes therein, into which conductive balls will fit, is placed on the green sheet, which is being carried by a tray, the mould and the green sheet are brought into close contact, conductive balls are introduced into the holes in the mould, the conductive balls are pressed into the green sheet and embedded therein, and the green sheet is baked.
Claim 4
Dependent Claim 48 words
A method as claimed in claim 2, wherein the green sheet, the conducive balls, the mould and the tray are maintained at 80°C to 100 0 C whilst the conductive balls are pressed into the green sheet under a pressure of 100 kg/cm 2 to 150 kg/cm 2.
Claim 5
Dependent Claim 145 words
A method as claimed in claim 2 or 3, wherein close contact between the mould and the green sheet is brought about by the application of an external force to the mould and/or the green sheet by one of, or a combination of, the following means:- (a) the introduction of compressed air between the tray and the green sheet, to urge the green sheet into contact with the mould; (b) the application of a magnetic force to the mould, which is of a magnetic material, directed towards the tray side of the green sheet, to urge the mould into contact with the green sheet; (c) the application of a suction force (a vacuum or a negative pressure) between the tray and the mould at a region outside the perimeter of the green sheet, to urge the tray and mould together (with the green sheet between).
Claim 6
Dependent Claim 76 words
A method as claimed in claim 2, 3-or 4, wherein debris produced on the tray side of the green sheet as a result of displacement of material of the green sheet when the conductive balls are embedded is removed by suction, the tray being provided with suction holes, of diameter less than the diameter of the conductive balls, at positions corresponding to positions at which the conductive balls are to be embedded in the green sheet.
Claim 7
Dependent Claim 52 words
A method as claimed in claim 2, 3, 4 or 5, wherein the conductive balls are pressed into the green sheet by means of a force piston, having projections thereon in positions corresponding to the positions of the holes in the mould, which projections are urged into the holes in the mould.
Claim 8
Dependent Claim 25 words
A method as claimed in claim 6, wherein the force piston is of a photo-sensitive glass material, the projections thereon being formed by chemical etching.
Claim 9
Independent Claim 77 words
A method of forming metallic balls, for example for use as conductive balls in a method as claimed in any preceding claim, comprising placing,fine wire or lead of a metal on a carrier plate, cutting the fine wire or lead into segments of a selected length, melting the segments; and resolidifying the melted segments, preferably the carrier plate being coated with a bonding agent for holding the fine wire or lead in position during cutting into segments.
Claim 10
Independent Claim 17 words
A method as claimed in any preceding claim, wherein the conductive balls are metallic balls of gold.
Claim 11
Dependent Claim 45 words
A method as claimed in claim 9, when read as appended to claim 8, wherein the segments are melted by heating to 1080°C at a rate of 700°C/hour, are held at 1080°C for 10 minutes, and are resolidified by cooling at a rate of 500°C/hour.
Claim 12
Dependent Claim 61 words
A method of forming a body of photosensitive glass material, for example a force piston as claimed in claim 7, by chemical etching, wherein the photosensitive glass material is of the Si0 2 - Li 2 0 - A1 2 0 3 system, for example of a composition provided by fusing a mixture of powders as specified in the table below
Claim 13
Dependent Claim 29 words
the material is exposed to ultra violet light through a mask, and is etched, for example with a 10% fluoric acid solution after heating for two hours at 620°C.
Claim 14
Dependent Claim 29 words
the material is exposed to ultra violet light through a mask, and is etched, for example with a 10% fluoric acid solution after heating for two hours at 620°C.
Claim 15
Dependent Claim 17 words
A ceramic substrate made by a method as claimed in any one of claims 1 to 7.
Claim 16
Dependent Claim 12 words
A semiconductor device including a ceramic substrate as claimed in claim 12.
Claim 17
Dependent Claim 45 words
Apparatus for use in a method as claimed in claim 2, substantially as hereinbefore described with reference to Figures 2, 3 and 4, or Figure 11, or Figure 12, or Figures 13 and 14, or Figure 15, or Figures 17 and 18, of the drawings.
Claim 18
Dependent Claim 55 words
Apparatus for forming a ceramic substrate, comprising a member having many holes therein for. receiving conductive balls, means for bringing the member into close contact with the green sheet, and means for pressing conductive balls, received in the holes in the mould, into the green sheet, to embed the conductive balls in the green sheet.
Claim 19
Dependent Claim 55 words
Apparatus for forming a ceramic substrate, comprising a member having many holes therein for. receiving conductive balls, means for bringing the member into close contact with the green sheet, and means for pressing conductive balls, received in the holes in the mould, into the green sheet, to embed the conductive balls in the green sheet.

References Cited (Backward Citations)

US3541222A Cited
US3762029A Cited
EP0011013A1 Cited

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