US3762029A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Manufacture of supports for semiconductor devices
Assignee: Ferranti International PLC
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Filing: 1972-06-12
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Granted: 1973-10-02
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Expires: 1992-06-12
Abstract
Abstract In manufacturing a support such as a lead frame for a semiconductor device, alloying material such as gold is selectively applied in sufficient thickness for the device bonding operation to a part only of a supporting member of the support, by impacting an initially-spherical particle of the alloying material onto the selected part by an unheated impacting tool, the particle possibly initially being secured on the selected part by slight impacting under a suction tool.
Inventors
- 👤 S Jackson
- 👤 J Titterington
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 23:06
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/013; H01; H01H; H01H11/00; H01H11/04; H10W70/00; H10W70/01; H10W70/04; H10W70/041; H10W70/048; H10W72/011; H10W72/0113; H10W72/0198; H10W72/071; H10W72/073; H10W72/07331; H10W72/07336; H10W72/075; H10W72/30; H10W72/351; H10W72/353; H10W72/354; H10W72/50; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/951; H10W72/952; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
96 words
A method as claimed in claim 1 in which, in addition to the selection of said one particle, at least one further particle is selected from the supply, said one selected particle and each further selected particle being transported onto the selected part of the supporting member, the selected particles adjacent to each other being bonded on the selected part by impacting substantially the whole of the particles into the surface of the selected part and so causing the particles to form a single region of the particle material at the location of the selected part.
Claim 2
Dependent Claim
54 words
A method as claimed in claim 1 in which the material of each particle is such that the device is to be bonded to the support by the semiconductor material of the device forming a eutectic mixture with the particle material, the mixture comprising an intermediate bonding layer between the device and the support.
Claim 3
Dependent Claim
33 words
A method as claimed in claim 1 in which the material of each particle is gold, and a surface layer, at least, of the selected part of the supporting member is of silver.
Claim 4
Dependent Claim
55 words
A method as claimed in claim 1 in which each particle is selected by a suction means having a nozzle with a circular orifice of diameter smaller than the diameter of the spherical particle, the selected particle being securely held in contact with the orifice and acting as a shut-off valve for the suction means.
Claim 5
Dependent Claim
32 words
A method as claimed in claim 5 in which the transportation of each selected particle is effected by relative movement between the suction means and the selected part of the supporting means.
Claim 6
Dependent Claim
46 words
A method as claimed in claim 6 in which each selected particle is initially secured to the selected part of the supporting member by being impacted onto the selected part by the suction means prior to said deformation of the selected part by the impacting tool.
Claim 7
Independent Claim
96 words
A method of manufacturing a support for the semiconductor device comprises the steps of providing a supply of spherical particles of a suitable bonding material, selecting any one of such particles by a suction means, trans-porting the selected particle by said suction means to and depositing it on a selected part oF a supporting member while simultaneously deforming the deposited particle, and impacting said particle with an unheated impacting tool with sufficient force to cause a deformation in the supporting member beneath said particle and to effect a bond between said particle and the selected part.
Claim 8
Dependent Claim
82 words
A method as claimed in claim 8 in which, in addition to the selection of said one particle, at least one further particle is selected, said one selected particle and each further particle being transported onto the selected part of the supporting member and being deposited thereon closely adjacent each other, the closely adjacent selected particles being bonded on the selected part by simultaneous impact on the particles causing the particles to flow into each other and form a substantially continuous layer.
Claim 9
Dependent Claim
18 words
A method as claimed in claim 8 in which said deformation in the supporting member is saucer shaped.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-10-01 | 1977-04-02 | 1977-10-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-10-01 | 1981-04-02 | 1981-10-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-10-01 | 1985-04-02 | 1985-10-02 | $7700.00 | Window Closed / Lapsed |