Patent EP0029501A2 successfully refreshed from Google Patents.
EP0029501A2
Expired / Lapsed
EP
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Heat sink member and aircooling system for semiconductor modules
Assignee: International Business Machines Corp
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Filing: 1980-10-15
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Granted: —
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Expires: 2000-10-15
Abstract
Abstract An air cooled high density integrated circuit system wherein heat sink structures are located on one of the surfaces of the modules (10) in the system. The structure includes a plurality of hollow round or flat heat conductive members (12) having an opening or openings (22) extending from the module surface toward, but not reaching, the top of the member. Air flow is directed substantially perpendicular to the upper end of the members (12). The air flow will be from the top of the members (12) and out of the opening or openings (22, 32) to cool the heat sink members and the module.
Inventors
- 👤 Edgar Crawford Leaycraft
- 👤 Sevgin Oktay
- 👤 Carl David Ostergren
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 13:43
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W40/226; H10W40/40; H10W40/43; Y; Y10; Y10S; Y10S165/00; Y10S165/908
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
66 words
Heat sink member for cooling an integrated circuit module (10), said module (10) having a heat conductive covering surface (20) with which said heat sink member (12, 30) is in contact, characterized in that said heat sink member (12, 30) has one or more openings (22, 32) extending from said heat conductive covering surface (20) towards the top end of said heat sink member (12, 30).
Claim 2
Dependent Claim
66 words
Heat sink member for cooling an integrated circuit module (10), said module (10) having a heat conductive covering surface (20) with which said heat sink member (12, 30) is in contact, characterized in that said heat sink member (12, 30) has one or more openings (22, 32) extending from said heat conductive covering surface (20) towards the top end of said heat sink member (12, 30).
Claim 3
Dependent Claim
29 words
The heat sink member of claim 1 having a circular cross section, a top opening and a plurality of longitudinal side openings (22) spaced, preferably equidistantly, around its circumference.
Claim 4
Dependent Claim
28 words
. The heat sink member of claim 1, having the form of a straight fin (30) to, but not reaching, the top end of said member (12, 30).
Claim 5
Dependent Claim
33 words
The heat sink member of any of the claims 2 and 3, wherein said openings (22, 32) are slits which extend at least half way from - the heat conductive covering surface (20).
Claim 6
Dependent Claim
31 words
The heat sink member of any of the claims 2 and 3, wherein the area of the side openings (22) is between about one-third to one-half of the member surface area.
Claim 7
Dependent Claim
17 words
The heat sink member of claim 2, wherein the top end (40) of the member is flared.
Claim 8
Dependent Claim
92 words
An air cooling system for integrated circuit modules (10) having a heat conductive surface (20) with one or more heat sink members (12, 30) attached thereto, characterized by a heat sink member (12, 30) with one or pore openings (22, 32) extending from said heat conductive surface (20) towards the top end, and means for providing impingement air flow substantially parallel to said heat sink member (12, 30) towards said heat conductive surface (20), causing air flow around and through said heat sink member (12, 30) and said openings (22, 32), respectively.
Claim 9
Dependent Claim
92 words
An air cooling system for integrated circuit modules (10) having a heat conductive surface (20) with one or more heat sink members (12, 30) attached thereto, characterized by a heat sink member (12, 30) with one or pore openings (22, 32) extending from said heat conductive surface (20) towards the top end, and means for providing impingement air flow substantially parallel to said heat sink member (12, 30) towards said heat conductive surface (20), causing air flow around and through said heat sink member (12, 30) and said openings (22, 32), respectively.
Claim 10
Dependent Claim
34 words
The cooling system of claim 7, wherein the heat sink member has a circular cross section (12), a top opening, and a plurality of longitudinal side openings (22) preferably equidistantly spaced around its circumference.
Claim 11
Dependent Claim
36 words
The cooling system of claim 7, wherein the heat sink member is a straight fin (30) with slits (32) extending from the heat conductive-surface (20) at least half way towards the top end of said member.
Claim 12
Dependent Claim
55 words
The cooling system of claim 7, wherein the means for providing impingement air flow includes an air plenum (15) adapted to receive cooling air at substantially constant pressure and to direct said cooling air through an opening (18) in said plenum (15), said opening (18) being located directly above the heat sink member (12, 30).
References Cited (Backward Citations)
No citation records indexed.
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