Patent US4786612A successfully refreshed from Google Patents.
Patent EP0000856A1 successfully refreshed from Google Patents.
EP0000856A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Magnetic heat transfer device for semiconductor chip
Assignee: International Business Machines Corp
•
Filing: 1978-07-20
•
Granted: —
•
Expires: 1998-07-20
Abstract
Abstract 1. Heat sink for transferring heat between a semiconductor chip and a cooling device, comprising a heat transfer fluid disposed between and in contact with said chip and said device, characterized in that : the fluid consists of magnetic particles suspended in a carrier, and the cooling device is provided with an element that creates a magnetic field acting on the fluid, the pattern of the flux lines of the magnetic field being such that it keeps the fluid in place.
Inventors
- 👤 Kenneth Selig Sachar
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 10:48
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/25; H10W40/257; H10W40/70; H10W40/77; H10W72/00; H10W72/01; H10W72/013; H10W72/01308; H10W72/071; H10W72/073; H10W72/07311; H10W72/07351; H10W72/07353; H10W72/30; H10W72/331; H10W72/334; H10W72/381; H10W72/387; H10W72/851; H10W72/874; H10W72/877; H10W72/879; H10W72/90; H10W72/931; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 0
No claims parsed yet. Click Sync Now above to re-index claims from Google Patents.
References Cited (Backward Citations)
US3706127A
Cited
GB1441433A
Cited
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.