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DE4122428C2 - - Google Patents

Assignee: Semikron Elektronik GmbH and Co KG
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Filing: 1991-07-06
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Granted: 1993-07-22
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Expires: 2011-07-06
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Abstract

Abstract A circuit device (10) is described which has at least one base plate (14) on which at least one component (20) and contact pads (16) are provided. The/each component (20) is connected in an electrically conducting manner to associated contact pads (16) by means of connecting elements (26). The circuit device (10) has a heat sink (12) and a press-on device (38). The at least one base plate (14) is mounted on the heat sink (12). The press-on device (38) can be joined mechanically to the heat sink (12). The base plate (14) is pressed against the heat sink (12) with the aid of the press-on device (38). According to the invention, the press-on device (38) has at least one assembly element (40) and an elastically flexible pressure device (42) which is provided on the inside (44) of the assembly element (40) facing the heat sink (12) and presses against the component (20) and/or against the base plate (14) in an electrically insulated manner in the vicinity of the component. <IMAGE>

Inventors

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Bibliographic Details

Application Number —
Jurisdiction DE
Data Source google_patents
Last Synchronized 2026-11-02 23:42
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/701; H10W40/00; H10W40/60; H10W40/611; H10W40/20; H10W40/231; H10W40/233; H10W40/242; H10W40/625; H10W72/00; H10W72/071; H10W72/073; H10W72/075; H10W72/50; H10W72/531; H10W72/5363; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/731; H10W90/734; H10W90/736; H10W90/751; H10W90/754

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