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Patent DE2139498A1 successfully refreshed from Google Patents.
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DE2139498A1 Expired / Lapsed DE ⏱️ 0.0 years remaining

Soldered joints prodn

Assignee: Wells Electronics Inc
•
Filing: 1971-08-06
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Granted: —
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Expires: 1991-08-06
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Abstract

Abstract Prodn. of soldered joints between specific positions of an electric circuit utilising a wire, at least one part of which forming a soldering position is tinned with soft solder, by clamping the electric circuit on a support above which is a soldering appts. with a heating tip through which the wire can slide, the heating tip travelling on a guide path above the welding position under consideration and being reciprocated on the support in such a way that the end of the wire comes into contact with the guide path. The heating tip is then heated electrically until the insulation on the wire is burnt off if present and solder on the guide path is melted after which the current supply to the heating tip is cut off so that the fused solder can re-cool and finally the heating lip is again raised towards the carrier so that a piece of the wire is drawn up through the heating tip.

Inventors

  • 👤 Raymond Bruce Larson
  • 👤 Frank Winfield Wogoman

Bibliographic Details

Application Number —
Jurisdiction DE
Data Source google_patents
Last Synchronized 2026-11-03 12:48
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0444; B; B23; B23K; B23K3/00; B23K3/04; B23K3/047; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H10W; H10W72/00; H10W72/071; H10W72/075; B23K2101/00; B23K2101/32; H05K1/00; H05K1/02; H05K1/03; H05K1/0393; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/10287; H05K2203/00; H05K2203/01; H05K2203/0195; H05K3/3494; H10W72/0711; H10W72/07141; H10W72/50; H10W72/531; H10W72/533; H10W72/534; H10W72/551; H10W72/552; H10W72/5525; Y; Y02; Y02P; Y02P70/00; Y02P70/50

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