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CA1277070C Expired / Lapsed CA ⏱️ 0.0 years remaining

Photocurable epoxy resin compositions which contain fillers, and the use thereof

Assignee: Ciba Geigy Investments Ltd
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Filing: 1985-11-12
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Granted: 1990-11-27
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Expires: 2005-11-12
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Abstract

Abstract Photocurable epoxy resin compositions which contain fillers, and the use thereof Abstract of the Disclosure The invention relates to epoxy resin compositions which contain fillers, said compositions comprising (a) 5-90% by weight of an epoxy resin or mixture of epoxy resins, which resin or resins do not contain olefinically unsaturated C=C double bonds, (b) 0.1 to 15% by weight of at least one photoinitiator of formula I [(R1)(R2M)a]+an [LQm]-q (I), wherein a is 1 or 2 and each of n and q independently of the other is an integer from 1 to 3, H is the cation of a monovalent to trivalent metal of Periodic Groups IVb to VIIb, VIII or Ib, m is an integer corresponding to the valency of L + q and Q is a halogen atom, L is a divalent to heptavalent metal or non-metal R1 is a .pi.-arene and R2 is a .pi.-arena or the anion of a .pi.-arene, and (c) 10 -90% by weight of at least one finely particulate filler selected from the group consisting of carbon black, graphite, metal-containing fillers and fillers with semi-conductor properties, and, optionally (d) flux materials and/or (e) further additives, the sum of all components being 100% by weight. These compositions are suitable for the production of relief structures, images or bonds.

Inventors

  • 👤 Gerald Giller
  • 👤 Niklaus Buhler

Bibliographic Details

Application Number —
Jurisdiction CA
Data Source google_patents
Last Synchronized 2026-11-10 01:34
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/027; G03F7/028; G03F7/029; C; C08; C08G; C08G59/00; C08G59/18; C08G59/68; C08K; C08K3/00; C08K3/01; C08K3/013

Claims Analysis

Total Claims: 23
Claim 1
Independent Claim 193 words
A photocurable epoxy resin composition which contains filler, said composition comprising (a) 5-90 % by weight of an epoxy resin or epoxy resin mixture, which resin or resins do not contain olefinically unsaturated C=C double bonds, (b) 0.1 to 15 % by weight of at least one photoinitiator of formula I [(R1)(R2M)a]+an [LQm]-q (I), wherein a is 1 or 2 and each of n and q independently of the other is an integer from 1 to 3, M is the cation of a monovalent to trivalent metal of Periodic Groups IVb to VIIb, VIII or Ib, m is an integer corresponding to the valency of L + q and Q is a halogen atom, L is a divalent to heptavalent metal or non-metal, R1 is a .pi.-arene and R2 is a .pi.-arene or the anion of a .pi.-arene, and (c) 10 -90 % by weight of at least one finely particulate filler selected from the group consisting of electrically conductive or semiconductive fillers, thermally conductive or dielectric fillers, fillers which influence the ferroelectric, ferromagnetic, piezo-electric or electrochromic properties and fillers with luminescent properties, the sum of all compounds being 100 % by weight.
Claim 2
Dependent Claim 193 words
A photocurable epoxy resin composition which contains filler, said composition comprising (a) 5-90 % by weight of an epoxy resin or epoxy resin mixture, which resin or resins do not contain olefinically unsaturated C=C double bonds, (b) 0.1 to 15 % by weight of at least one photoinitiator of formula I [(R1)(R2M)a]+an [LQm]-q (I), wherein a is 1 or 2 and each of n and q independently of the other is an integer from 1 to 3, M is the cation of a monovalent to trivalent metal of Periodic Groups IVb to VIIb, VIII or Ib, m is an integer corresponding to the valency of L + q and Q is a halogen atom, L is a divalent to heptavalent metal or non-metal, R1 is a .pi.-arene and R2 is a .pi.-arene or the anion of a .pi.-arene, and (c) 10 -90 % by weight of at least one finely particulate filler selected from the group consisting of electrically conductive or semiconductive fillers, thermally conductive or dielectric fillers, fillers which influence the ferroelectric, ferromagnetic, piezo-electric or electrochromic properties and fillers with luminescent properties, the sum of all compounds being 100 % by weight.
Claim 3
Dependent Claim 35 words
A composition according to claim 1, wherein component c) is selected from the group consisting of carbon black, graphite, metal-containing fillers and fillers with semi-conductor properties, the sum of all components being 100% by weight.
Claim 4
Dependent Claim 73 words
A composition according to claim 1, wherein the epoxy resin (a) is an epoxy resin containing on average more than one group of the formula II (II) wherein each of Q' and Q2 is a hydrogen atom and Q1 is a hydrogen atom or a methyl group, or Q' and Q2 together are -CH2CH2- or -CH2CH2CH2- and Q1 is a hydrogen atom, which group is attached to an -O-, -S- or -N- atom.
Claim 5
Dependent Claim 46 words
A composition according to claim 1, wherein the epoxy resin (a) is a diglycidyl ether or an advanced diglycidyl ether of a dihydric phenol or of a dihydric aliphatic alcohol of 2 to 4 carbon atoms, a polyglycidyl ether of a novolak or a tetraglycidylated 4,4'-diamino-diphenylmethane.
Claim 6
Dependent Claim 43 words
A composition according to claim 1, wherein the epoxy resin (a) is a diglycidyl ether or an advanced diglycidyl ether of bis-phenol A, tetrabromo-bisphenol A or bisphenol F, a polyglycidyl ether of a phenol/formaldehyde or cresol/formaldehyde novolak or a mixture of such resins.
Claim 7
Dependent Claim 54 words
A composition according to claim 1 which contains a photoinit-iator of formula I, wherein a is 1, R1 is benzene, toluene, xylene, cumene, methoxybenzene, chlorobenzene, p-chlorotoluene, naphthalene, methylnaphthalene, chloronaphthalene, methoxynaphthalene, biphenyl, indene, pyrene or diphenylenesulfide, and R2 is the anion of cyclopentadiene, acetylcyclopentadiene or indene, or is benzene, toluene, xylene, trimethylbenzene, naphthalene or methylnaphthalene.
Claim 8
Dependent Claim 39 words
A composition according to claim 1 which contains a photoiniator of formula I, wherein a is 1, R1 is ?6-cumene or ?6-2-methylnaphtha-lene and R2 is the anion of ?5-cyclopentadiene, and n is 1 or 2 and q is 1.
Claim 9
Dependent Claim 26 words
A composition according to claim 1, wherein M is a chromium, cobalt, manganese, tungsten, molybdenum or iron cation, and [LQm]-q is SbF6-, BF4-, AsF6- or PF6-.
Claim 10
Dependent Claim 10 words
A composition according to claim 8, wherein M is Fe2+.
Claim 11
Dependent Claim 44 words
A composition according to claim 1, wherein the metal-containing filler or the filler with semiconductor properties is a metal, a metal compound or a metal alloy, in which the metal is a metal of Periodic Groups IIa, IIIa, IVa, Ib, Vb, VIb and/or VIII.
Claim 12
Dependent Claim 22 words
A composition according to claim 1, wherein the metal-containing filler is silver, copper, a silver/palladium alloy, palladium, platinum, gold, tungsten or molybdenum.
Claim 13
Dependent Claim 15 words
A composition according to claim 1, wherein the metal-containing filler is Au, Pt or AgPd.
Claim 14
Dependent Claim 15 words
A composition according to claim 1, wherein the filler is silver powder or copper powder.
Claim 15
Dependent Claim 34 words
A composition according to claim 1, wherein the filler is aluminium oxide, beryllium oxide, lithium aluminium oxide, silicon carbide, barium titanate, lead titanate, lead zirconate, WO3, Fe3O4, NiFe2O4, CoFe2O4, a manganese/zinc ferrite or ZnS.
Claim 16
Dependent Claim 18 words
A composition according to claim 1, wherein the filler is in the form of spherical or rod-shaped particles.
Claim 17
Dependent Claim 18 words
A composition according to claim 1, wherein the filler has a particle size of 0.1 to 20 micrometers.
Claim 18
Dependent Claim 31 words
A composition according to claim 1, which additionally contains 5-50 % by weight of a flux material (d), the sum total of components (a) to (d) being 100 % by weight.
Claim 19
Dependent Claim 30 words
A composition according to claim 1, which contains 5-40 % by weight of component (a), 0.3-4 % by weight of photoinitiator (b) and 30-85 % by weight of filler (c).
Claim 20
Dependent Claim 31 words
A composition according to claim 17, which contains together not more than 95 % by weight of filler (c) and flux material (d), based on the total weight of said composition.
Claim 21
Dependent Claim 13 words
A composition according to claim 17, wherein the flux material is glass powder.
Claim 22
Dependent Claim 23 words
A process for the production of relief structures, images or bonds, which comprises subjecting a composition as claimed in claim 1 to photocuring.
Claim 23
Dependent Claim 16 words
A process according to claim 21, which comprises carrying out a thermal postcuring. FO 7.3 ACK/bg*

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