Activator for electroless plating - contg copper and stannous ions, in which the article is immersed followed by reduction in alkali

Abstract

Abstract Non-conductors are activated prior to electroless plating with e.g. Cu, Ni, Co, Au, etc., by immersion in an acid soln. contg. Cu and stannous ions followed by reduction of Cu ions in an alkaline soln. of a reducing agent. The first soln. contains 0.12-15 mole 1-1 Sn and 0.03-1.0 mole 1-1 with Sn:Cu 1:1 and may opt. contain a small concn. of precious metal. Suitable reducing agents include borohydrives, CH2O, hydrazine sulphate, and derivs. of boramine. The initial activation may be done in two stages, firstly with Sn soln. then in Cu soln. The activator is used in electroless plating of non-conductors and dielectrics.

Inventors

• 👤 N Feldstein

Bibliographic Details