UST105403I4
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing a sealing cap for an integrated circuit carrying substrate
Assignee: Eric B. Hultmark
•
Filing: 1984-08-02
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Granted: 1985-05-07
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Expires: 2004-08-02
Abstract
Abstract A cap for sealing a substrate having integrated circuit chips thereon is manufactured by ultrasonically machining a pattern of channels in the top surface of a plate, the pattern of channels defining a plurality of pedestals at locations corresponding to integrated circuit chip locations on the substrate. The pedestal tops are then ultrasonically machined so that each top lies a predetermined distance from the top surface of the plate. Ceramic caps manufactured according to the present invention may be mass produced with precise dimensional tolerances.
Inventors
- 👤 Eric B. Hultmark
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:44
CPC Classifications
H; H10; H10W; H10W99/00; H10W76/00; H10W76/10; H10W76/12; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/851; H10W72/874; H10W72/877; Y; Y10; Y10T; Y10T428/00; Y10T428/16; Y10T428/161
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-05-06 | 1988-11-05 | 1989-05-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-05-06 | 1992-11-05 | 1993-05-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-05-06 | 1996-11-05 | 1997-05-07 | $7700.00 | Window Closed / Lapsed |