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USH650H Expired / Lapsed US ⏱️ 0.0 years remaining

Double sided circuit board and a method for its manufacture

Assignee: United States Department of Energy
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Filing: 1988-04-14
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Granted: 1989-07-04
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Expires: 2008-04-14
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Abstract

Abstract Conductance between the sides of a large double sided printed circuit board is provided using a method which eliminates the need for chemical immersion or photographic exposure of the entire large board. A plurality of through-holes are drilled or punched in a substratum according to the desired pattern, conductive laminae are made to adhere to both sides of the substratum covering the holes and the laminae are pressed together and permanently joined within the holes, providing conductive paths.

Inventors

  • 👤 Carl W. Lindenmeyer

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 20:07
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/4038; H05K3/4084; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2201/0388; H05K2201/0394; H05K2203/00; H05K2203/01; H05K2203/0195; H05K2203/06; H05K2203/063; H05K2203/15; H05K2203/1572; H05K3/30; H05K3/32; H05K3/328; H05K3/38; H05K3/386

Claims Analysis

Total Claims: 12
Claim 1
Independent Claim 99 words
A double-sided circuit board which comprises: a supporting substratum made of electrically insulating material; adhesive applied to each surface of said substratum; a desired and predetermined pattern comprised of holes drilled through said substratum; a lamina on each surface of said substratum and adhering to said surface by said adhesive; junctures between said laminae within said holes, comprising deformations of said laminae such that each said lamina abuts said lamina on the opposite side of said substratum and is permanently joined to said lamina; said laminae and junctures comprising a circuit pattern according to a desired and predetermined design.
Claim 2
Dependent Claim 99 words
A double-sided circuit board which comprises: a supporting substratum made of electrically insulating material; adhesive applied to each surface of said substratum; a desired and predetermined pattern comprised of holes drilled through said substratum; a lamina on each surface of said substratum and adhering to said surface by said adhesive; junctures between said laminae within said holes, comprising deformations of said laminae such that each said lamina abuts said lamina on the opposite side of said substratum and is permanently joined to said lamina; said laminae and junctures comprising a circuit pattern according to a desired and predetermined design.
Claim 3
Dependent Claim 28 words
The circuit board as recited in claim 1 wherein said substratum is from the group of materials consisting of bakelite, epoxy resin, glass fiber reinforced resins and polyester.
Claim 4
Dependent Claim 30 words
The circuit board as recited in claim 2 wherein said substratum comprises two layers of material, adhering to one another as one by a layer of adhesive between said layers.
Claim 5
Dependent Claim 30 words
The circuit board as recited in claim 2 wherein said substratum comprises multiple layers of material, adhering to adjacent layers as one by layers of adhesive between said adjacent layers.
Claim 6
Dependent Claim 13 words
The circuit board as recited in claim 1 wherein said adhesive is acrylic.
Claim 7
Dependent Claim 15 words
The circuit board as recited in claim 1 wherein said adhesive is hot melt epoxy.
Claim 8
Dependent Claim 15 words
The circuit board as recited in claim 1 wherein said laminae are composed of copper.
Claim 9
Dependent Claim 37 words
The circuit board as recited in claim 1 wherein said junctures are comprised of equal deformations of both said laminae such that each said lamina abuts the opposite said lamina near the midpoint of each said hole.
Claim 10
Dependent Claim 38 words
The circuit board as recited in claim 1 wherein said junctures are comprised of deformation of only one said lamina such that said deformed lamina abuts the opposite said lamina in the plane of the opposite said lamina.
Claim 11
Independent Claim 131 words
A method for manufacturing a double-sided circuit board comprising: providing a supporting substratum made of electrically insulating material; applying adhesive to both surfaces of said substratum and exposing it to air until it is dry to touch; forming a plurality of holes through said substratum according to a predetermined pattern; laminating both sides of said substratum by adhering laminae to both sides of said substratum with said adhesive, said laminae covering said surfaces and said holes; forming junctures between said laminae within said holes by pressing said laminae together until they abut one another and then making permanent said junctures by spotwelding; and removing portions of laminae to form a circuit pattern in said junctures and remaining laminae on both sides of said substratum according to a desired and predetermined design.
Claim 12
Independent Claim 131 words
A method for manufacturing a double-sided circuit board comprising: providing a supporting substratum made of electrically insulating material; applying adhesive to both surfaces of said substratum and exposing it to air until it is dry to touch; forming a plurality of holes through said substratum according to a predetermined pattern; laminating both sides of said substratum by adhering laminae to both sides of said substratum with said adhesive, said laminae covering said surfaces and said holes; forming junctures between said laminae within said holes by pressing said laminae together until they abut one another and then making permanent said junctures by spotwelding; and removing portions of laminae to form a circuit pattern in said junctures and remaining laminae on both sides of said substratum according to a desired and predetermined design.

References Cited (Backward Citations)

US4360570A Cited
US4351697A Cited
US4610756A Cited
US4597988A Cited
US4689111A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1992-07-03 1993-01-02 1993-07-04 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1996-07-03 1997-01-02 1997-07-04 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2000-07-03 2001-01-02 2001-07-04 $7700.00 Window Closed / Lapsed

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