In package ESD protections of IC using a thin film polymer

Claim 1

A device comprising: an electronic component having first electrodes for electrical signal and power, and second electrodes for electrical ground; a substrate, onto which the component is assembled, having built-in local protection shortcuts for the first electrodes operable to bypass electrical overcharge events directly to ground, the substrate including: an insulator material having a top surface with a first set and a third set of terminals, and a bottom surface with a second set and a fourth set of terminals; a flat sheet-like sieve member sandwiched in the insulator having a first surface and a second surface, the sieve member made of a non-linear material that switches from insulator to conductor mode at a preset voltage, the member perforated with a first set and a second set of through-holes and otherwise being free of indentations on its surfaces, and; first metal traces over the first surface, each first trace positioned covering a first set through-hole and having a conductive connection to a third set terminal and a conductive connection to a second set terminal; second metal traces on the second surface, each second trace covering a second set through-hole and overlapping a first trace, the overlap areas constituting a conductivity switch, and the second metal traces further having a conductive connection to a fourth set terminal and a conductive connection to a first set terminal; and the first and second electrodes connected to the first and third set terminals so that each first electrode is connected to a switch built into the substrate.

Claim 2

A device comprising: an electronic component having first electrodes for electrical signal and power, and second electrodes for electrical ground; a substrate, onto which the component is assembled, having built-in local protection shortcuts for the first electrodes operable to bypass electrical overcharge events directly to ground, the substrate including: an insulator material having a top surface with a first set and a third set of terminals, and a bottom surface with a second set and a fourth set of terminals; a flat sheet-like sieve member sandwiched in the insulator having a first surface and a second surface, the sieve member made of a non-linear material that switches from insulator to conductor mode at a preset voltage, the member perforated with a first set and a second set of through-holes and otherwise being free of indentations on its surfaces, and; first metal traces over the first surface, each first trace positioned covering a first set through-hole and having a conductive connection to a third set terminal and a conductive connection to a second set terminal; second metal traces on the second surface, each second trace covering a second set through-hole and overlapping a first trace, the overlap areas constituting a conductivity switch, and the second metal traces further having a conductive connection to a fourth set terminal and a conductive connection to a first set terminal; and the first and second electrodes connected to the first and third set terminals so that each first electrode is connected to a switch built into the substrate.

Claim 12

A method for fabricating a semiconductor device, comprising the steps of: providing a tape having a length and a width including a sheet of non-linear material sandwiched between a first and a second metal layer, the sheet being capable of switching from insulator to conductor mode at a preset voltage, extending over the entire tape length and width and being without indentations or grooves on its surfaces; patterning the first metal layer to create first metal traces separated by first gaps; patterning the second metal layer to create second metal traces separated by second gaps and overlapping portions of the first traces; providing a first insulator foil laminated with a third metal layer; placing the first foil on the first traces, the third metal layer facing outwardly; providing a second insulator foil laminated with a fourth metal layer; placing the second foil on the second traces, the fourth metal layer facing outwardly; laminating the insulators of each foil unto the respective traces and filling the gaps between the traces with insulating material, thereby creating the tape-like substrate having sites for a series of repetitive devices; opening a first set of through-holes, aligned with the first gaps, extending through the third metal layer, the first insulator foil, the insulator-filled gaps, and the sheet of non-linear material, thereby perforating the sheet with a first set of through-holes terminating at the second metal traces; opening a second set of through-holes, aligned with the second gaps, extending through the fourth metal layer, the second insulator foil, the insulator-filled gaps, and the sheet of non-linear material, thereby perforating the sheet with a second set of through-holes terminating at the first metal traces; opening a third set of through-holes extending through the third metal layer and first insulator foil, terminating at the first metal traces; opening a fourth set of through-holes extending through the fourth metal layer and second insulator foil, terminating at the second metal traces; depositing metal to fill the through-holes and to add a continuous fifth metal layer on top of the third metal layer and a continuous sixth metal layer on top of the fourth metal layer; patterning the fifth and third metal layers to create terminals connected to a respective metal-filled through-hole, wherein terminals connected to a first set through-hole represent a first set, and terminals connected to a second set through-hole represent a second set; patterning the sixth and fourth metal layers to create terminals connected to a respective metal-filled through-hole, wherein terminals connected to a third set through-hole represent a third set, and terminals connected to a fourth set through-hole represent a fourth set; selecting certain second traces and the respective fourth and first set terminals for connection to electrical ground; selecting certain second traces, the first traces, and the respective terminals of the fourth, first, second, and third sets for connection for electrical signal or power; providing a plurality of electronic components having first electrodes for electrical signal and power, and second electrodes for electrical ground; connecting the first electrodes to the terminals of the respective substrate site for signal and power; connecting the second electrodes of the component to the terminals of the respective substrate site for ground; repeating the connecting steps for each component to assemble the component to the respective substrate site; and singulating the tape with the assembled components into discrete devices.

Claim 13

A method for fabricating a semiconductor device, comprising the steps of: providing a tape having a length and a width including a sheet of non-linear material sandwiched between a first and a second metal layer, the sheet being capable of switching from insulator to conductor mode at a preset voltage, extending over the entire tape length and width and being without indentations or grooves on its surfaces; patterning the first metal layer to create first metal traces separated by first gaps; patterning the second metal layer to create second metal traces separated by second gaps and overlapping portions of the first traces; providing a first insulator foil laminated with a third metal layer; placing the first foil on the first traces, the third metal layer facing outwardly; providing a second insulator foil laminated with a fourth metal layer; placing the second foil on the second traces, the fourth metal layer facing outwardly; laminating the insulators of each foil unto the respective traces and filling the gaps between the traces with insulating material, thereby creating the tape-like substrate having sites for a series of repetitive devices; opening a first set of through-holes, aligned with the first gaps, extending through the third metal layer, the first insulator foil, the insulator-filled gaps, and the sheet of non-linear material, thereby perforating the sheet with a first set of through-holes terminating at the second metal traces; opening a second set of through-holes, aligned with the second gaps, extending through the fourth metal layer, the second insulator foil, the insulator-filled gaps, and the sheet of non-linear material, thereby perforating the sheet with a second set of through-holes terminating at the first metal traces; opening a third set of through-holes extending through the third metal layer and first insulator foil, terminating at the first metal traces; opening a fourth set of through-holes extending through the fourth metal layer and second insulator foil, terminating at the second metal traces; depositing metal to fill the through-holes and to add a continuous fifth metal layer on top of the third metal layer and a continuous sixth metal layer on top of the fourth metal layer; patterning the fifth and third metal layers to create terminals connected to a respective metal-filled through-hole, wherein terminals connected to a first set through-hole represent a first set, and terminals connected to a second set through-hole represent a second set; patterning the sixth and fourth metal layers to create terminals connected to a respective metal-filled through-hole, wherein terminals connected to a third set through-hole represent a third set, and terminals connected to a fourth set through-hole represent a fourth set; selecting certain second traces and the respective fourth and first set terminals for connection to electrical ground; selecting certain second traces, the first traces, and the respective terminals of the fourth, first, second, and third sets for connection for electrical signal or power; providing a plurality of electronic components having first electrodes for electrical signal and power, and second electrodes for electrical ground; connecting the first electrodes to the terminals of the respective substrate site for signal and power; connecting the second electrodes of the component to the terminals of the respective substrate site for ground; repeating the connecting steps for each component to assemble the component to the respective substrate site; and singulating the tape with the assembled components into discrete devices.