US7679187B2
Active / In Force
US
⏱️ 0.2 years remaining
Bonding pad structure for back illuminated optoelectronic device and fabricating method thereof
Assignee: VisEra Technologies Co Ltd
•
Filing: 2007-01-11
•
Granted: 2010-03-16
•
Expires: 2027-01-11
Abstract
Abstract A bonding pad structure for an optoelectronic device. The bonding pad structure comprises a carrier substrate having a bonding pad region and an optoelectronic device region. An insulating layer is disposed on the carrier substrate, having an opening corresponding to the bonding pad region. A bonding pad is embedded in the insulating layer under the opening to expose the top surface thereof. A device substrate is disposed on the insulating layer corresponding to the optoelectronic device region. A cap layer covers the device substrate and the insulating layer excluding the opening. A conductive buffer layer is disposed in the opening to directly contact the bonding pad. The invention also discloses a method for fabricating the same.
Inventors
- 👤 Kai-Chih Wang
- 👤 Fang-Chang Liu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 15:09
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/019; H10W72/071; H10W72/075; H10W72/07531; H10W72/07537; H10W72/50; H10W72/531; H10W72/536; H10W72/59; H10W72/90; H10W72/921; H10W72/923; H10W72/9232; H10W72/931; H10W72/934; H10W72/941; H10W72/9415; H10W72/951; H10W72/952; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49204; Y10T29/49224
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
101 words
A bonding pad structure for an optoelectronic device, comprising: a carrier substrate having a bonding pad region and an optoelectronic device region; an insulating layer disposed on the cater substrate, having an opening corresponding to the bonding pad region; at least one bonding pad embedded in the insulating layer under the opening to expose a top surface thereof; a semiconductor substrate disposed on the insulating layer corresponding to the optoelectronic device region; a cap layer covering the semiconductor substrate and the insulating layer excluding the opening; and a conductive buffer layer disposed in the opening to directly contact the bonding pad.
Claim 2
Dependent Claim
101 words
A bonding pad structure for an optoelectronic device, comprising: a carrier substrate having a bonding pad region and an optoelectronic device region; an insulating layer disposed on the cater substrate, having an opening corresponding to the bonding pad region; at least one bonding pad embedded in the insulating layer under the opening to expose a top surface thereof; a semiconductor substrate disposed on the insulating layer corresponding to the optoelectronic device region; a cap layer covering the semiconductor substrate and the insulating layer excluding the opening; and a conductive buffer layer disposed in the opening to directly contact the bonding pad.
Claim 3
Dependent Claim
24 words
The bonding pad structure as claimed in claim 1 , wherein the bonding pad comprises a metal layer and a barrier layer formed thereon.
Claim 4
Dependent Claim
24 words
The bonding pad structure as claimed in claim 1 , wherein the bonding pad comprises a metal layer with no barrier layers formed thereon.
Claim 5
Dependent Claim
20 words
The bonding pad structure as claimed in claim 1 , wherein the cater substrate and the semiconductor substrate comprise silicon.
Claim 6
Dependent Claim
21 words
The bonding pad structure as claimed in claim 1 , wherein the cap layer comprises an anti-reflection coating material or oxide.
Claim 7
Dependent Claim
20 words
The bonding pad structure as claimed in claim 1 , wherein the conductive buffer layer comprises metal or conductive glue.
Claim 8
Dependent Claim
28 words
The bonding pad structure as claimed in claim 1 , further comprising a multi-level interconnect disposed in the insulating layer under the bonding pad and electrically connected thereto.
Claim 9
Dependent Claim
20 words
The bonding pad structure as claimed in claim 1 , wherein the conductive buffer layer comprises copper, aluminum, or gold.
Claim 10
Dependent Claim
79 words
A bonding pad structure for an optoelectronic device, comprising: a carrier substrate having a bonding pad region and an optoelectronic device region; an insulating layer disposed on the carrier substrate, having an opening corresponding to the bonding pad region; at least one metal pad with no barrier layers formed thereon, embedded in the insulating layer under the opening to expose a top surface thereof; and a semiconductor substrate disposed on the insulating layer corresponding to the optoelectronic device region.
Claim 11
Dependent Claim
79 words
A bonding pad structure for an optoelectronic device, comprising: a carrier substrate having a bonding pad region and an optoelectronic device region; an insulating layer disposed on the carrier substrate, having an opening corresponding to the bonding pad region; at least one metal pad with no barrier layers formed thereon, embedded in the insulating layer under the opening to expose a top surface thereof; and a semiconductor substrate disposed on the insulating layer corresponding to the optoelectronic device region.
Claim 12
Dependent Claim
20 words
The bonding pad structure as claimed in claim 9 , wherein the carrier substrate and the semiconductor substrate comprise silicon.
Claim 13
Dependent Claim
28 words
The bonding pad structure as claimed in claim 9 , further comprising a multi-level interconnect disposed in the insulating layer under the metal pad and electrically connected thereto.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2013-03-15 | 2013-09-14 | 2014-03-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2017-03-15 | 2017-09-14 | 2018-03-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2021-03-15 | 2021-09-14 | 2022-03-16 | $7700.00 | Window Closed / Lapsed |