Heat dissipating mechanism of a pluggable optical transceiver

Claim 2

An optical transceiver capable of inserting into or extracting from a cage installed on a host system so as to expose one end portion thereof from a face panel of the host system to receive an optical connector and to provide an electrical plug in the other end thereof to be mated with the host system by a hot-pluggable configuration, the optical transceiver comprising: an optical assembly unit including, an optical receptacle to receive the optical connector therein, and an optical subassembly having a semiconductor device therein to couple optically to an optical fiber secured in the optical connector; and a body unit including, a substrate providing the electrical plug to mate with an electrical connector within the cage of the host system, and mounting an electronic circuit thereon electrically connected to the semiconductor device within the optical subassembly and the electrical plug, a heat conducting plate to be in contact with the electronic circuit, a metal base including first and second portions, the first portion mounting the substrate and the second portion being fitted to the heat conducting plate, and a metal cover for putting the optical subassembly, the substrate, the base and the heat conducting plate therein, wherein the optical subassembly, the substrate, the base and the heat conducting plate are arranged in longitudinal of the optical transceiver, wherein the heat conducting plate is in contact with the cage at a rear end of the optical transceiver to conduct heat generated in the electronic circuit to the cage, and wherein the heat conducting plate is in contact with the electronic circuit via a thermal sheet made of resin with a good thermal conductivity.

Claim 3

The optical transceiver according to claim 1 , wherein the heat conducting plate includes first to third portions arranged longitudinally in this order, the first portion being configured to open upward to come in contact with the electronic circuit, the second portion being configured to open downward to fit the metal base thereto, the third portion being configured to come in contact with the cage at the rear end, and wherein the heat conducting plate has a zigzag shaped cross section.

Claim 4

The optical transceiver according to claim 1 , wherein the heat conducting plate includes first to third portions, the first portion being in contact with the electronic circuit, the second portion being substantially parallel to the first portion and covering a rear portion of the first portion to fit the base thereto, and the third portion connecting the first portion to the second portion at the rear end of the transceiver to come in contact with the cage, and wherein the heat conducting plate has a U-shaped cross section.

Claim 5

The optical transceiver according to claim 3 , wherein the heat conducting plate is formed by a metal plate by cutting, bending and tapping of copper based alloy.

Claim 6

The optical transceiver according to claim 1 , wherein the metal cover provides a plurality of structures each including a pair of slits and a portion between the slits that is bent inward to form a bent portion coming in contact with the heat conducting plate.

Claim 7

The optical transceiver according to claim 5 , wherein the heat conducting plate provides a support post with an abutting surface in a tip portion thereof, the bent portion of the cover being in contact with the abutting surface of the support post to conduct heat from the heat conducting plate to the cover.

Claim 8

An optical transceiver capable of inserting into or extracting from a cage installed on a host system so as to expose one end portion thereof from a face panel of the host system to receive an optical connector and to provide an electrical plug in the other end thereof to be mated with the host system by a hot-pluggable configuration, the optical transceiver comprising: an optical assembly unit including, an optical receptacle to receive the optical connector therein, and an optical subassembly having a semiconductor device therein to couple optically to an optical fiber secured in the optical connector; and a body unit including, a substrate providing the electrical plug to mate with an electrical connector within the cage of the host system, and mounting an electronic circuit thereon electrically connected to the semiconductor device within the optical subassembly and the electrical plug, a heat conducting plate to be in contact with the electronic circuit, a metal base including first and second portions, the first portion mounting the substrate and the second portion being fitted to the heat conducting plate, and a metal cover for putting the optical subassembly, the substrate, the base and the heat conducting plate therein, wherein the optical subassembly, the substrate, the base and the heat conducting plate are arranged in longitudinal of the optical transceiver, wherein the heat conducting plate is in contact with the cage at a rear end of the optical transceiver to conduct heat generated in the electronic circuit to the cage, wherein the optical subassembly includes a stem for mounting the semiconductor device thereon, the stem being exposed between the optical receptacle and the substrate, and wherein the optical transceiver further includes a thermal sheet made of resin between the optical receptacle and the substrate to conduct heat from the stem to the cover.

Claim 9

An optical transceiver capable of inserting into or extracting from a cage installed on a host system so as to expose one end portion thereof from a face panel of the host system to receive an optical connector and to provide an electrical plug in the other end thereof to be mated with the host system by a hot-pluggable configuration, the optical transceiver comprising: an optical assembly unit including, an optical receptacle to receive the optical connector therein, and an optical subassembly having a semiconductor device therein to couple optically to an optical fiber secured in the optical connector; and a body unit including, a substrate providing the electrical plug to mate with an electrical connector within the cage of the host system, and mounting an electronic circuit thereon electrically connected to the semiconductor device within the optical subassembly and the electrical plug, a heat conducting plate to be in contact with the electronic circuit, a metal base including first and second portions, the first portion mounting the substrate and the second portion being fitted to the heat conducting plate, and a metal cover for putting the optical subassembly, the substrate, the base and the heat conducting plate therein, wherein the optical subassembly, the substrate, the base and the heat conducting plate are arranged in longitudinal of the optical transceiver, wherein the heat conducting plate is in contact with the cage at a rear end of the optical transceiver to conduct heat generated in the electronic circuit to the cage, wherein the optical subassembly includes a stem for mounting the semiconductor device thereon, the stem being exposed between the optical receptacle and the substrate, and wherein the optical transceiver further includes a thermal sheet made of resin between the optical receptacle and the substrate to conduct heat from the stem to the cover.

Claim 10

An optical transceiver capable of inserting into or extracting from a cage installed on a host system so as to expose one end portion thereof from a face panel of the host system to receive an optical connector and to provide an electrical plug in the other end thereof to be mated with the host system by a hot-pluggable configuration, the optical transceiver comprising: an optical assembly unit including, an optical receptacle to receive the optical connector therein, and an optical subassembly having a semiconductor device therein to couple optically to an optical fiber secured in the optical connector; and a body unit including, a substrate providing the electrical plug to mate with an electrical connector within the cage of the host system, and mounting an electronic circuit thereon electrically connected to the semiconductor device within the optical subassembly and the electrical plug, a heat conducting plate to be in contact with the electronic circuit, a metal base including first and second portions, the first portion mounting the substrate and the second portion being fitted to the heat conducting plate, and a metal cover for putting the optical subassembly, the substrate, the base and the heat conducting plate therein, wherein the optical subassembly, the substrate, the base and the heat conducting plate are arranged in longitudinal of the optical transceiver, wherein the heat conducting plate is in contact with the cage at a rear end of the transceiver to conduct heat generated in the electronic circuit to the cage, wherein the optical subassembly includes a stem for mounting the semiconductor device thereon, and wherein the optical transceiver further includes a thermal sheet made of resin and a metal bracket attached to the stem, the bracket being thermally in contact with the substrate and the cover via the thermal sheet put between the cover and the bracket.

Claim 11

An optical transceiver capable of inserting into or extracting from a cage installed on a host system so as to expose one end portion thereof from a face panel of the host system to receive an optical connector and to provide an electrical plug in the other end thereof to be mated with the host system by a hot-pluggable configuration, the optical transceiver comprising: an optical assembly unit including, an optical receptacle to receive the optical connector therein, and an optical subassembly having a semiconductor device therein to couple optically to an optical fiber secured in the optical connector; and a body unit including, a substrate providing the electrical plug to mate with an electrical connector within the cage of the host system, and mounting an electronic circuit thereon electrically connected to the semiconductor device within the optical subassembly and the electrical plug, a heat conducting plate to be in contact with the electronic circuit, a metal base including first and second portions, the first portion mounting the substrate and the second portion being fitted to the heat conducting plate, and a metal cover for putting the optical subassembly, the substrate, the base and the heat conducting plate therein, wherein the optical subassembly, the substrate, the base and the heat conducting plate are arranged in longitudinal of the optical transceiver, wherein the heat conducting plate is in contact with the cage at a rear end of the transceiver to conduct heat generated in the electronic circuit to the cage, wherein the optical subassembly includes a stem for mounting the semiconductor device thereon, and wherein the optical transceiver further includes a thermal sheet made of resin and a metal bracket attached to the stem, the bracket being thermally in contact with the substrate and the cover via the thermal sheet put between the cover and the bracket.