Patent US3461154A successfully refreshed from Google Patents.
US6998175B2
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US
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Heat-peelable pressure-sensitive adhesive sheet
Assignee: Nitto Denko Corp
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Filing: 2001-05-14
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Granted: 2006-02-14
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Expires: 2021-05-14
Abstract
Abstract A heat-peelable pressure-sensitive adhesive sheet which, even when used for temporarily fixing electronic parts having poor resistance to static electricity, such as magnetic heads, is effective in preventing the yield of such electronic parts from being reduced by electrostatic breakage, while ensuring its functions of adhesiveness before heating and peelability after heating. The heat-peelable pressure-sensitive adhesive sheet comprises a substrate and formed on at least one side thereof a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres, wherein the heat-expandable pressure-sensitive adhesive layer has a surface resistivity of 10 12 Ω/□ or lower. In this heat-peelable pressure-sensitive adhesive sheet, the heat-expandable pressure-sensitive adhesive layer before heating may have a center line average surface roughness of 2 μm or less and a maximum surface roughness of 5 μm or less. The adhesive sheet may have a rubber-like organic elastic layer interposed between the substrate and the heat-expandable pressure-sensitive adhesive layer.
Inventors
- 👤 Akihisa Murata
- 👤 Toshiyuki Oshima
- 👤 Yukio Arimitsu
- 👤 Kazuyuki Kiuchi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 02:27
CPC Classifications
C; C09; C09J; C09J7/00; C09J7/20; C09J7/22; C09J7/30; C09J7/38; C09J9/00; C09J9/02; C09J2203/00; C09J2203/326; C09J2301/00; C09J2301/40; C09J2301/412; Y; Y10; Y10S; Y10S428/00; Y10S428/922; Y10T; Y10T428/00; Y10T428/14; Y10T428/28; Y10T428/2813; Y10T428/2848; Y10T428/2852; Y10T428/2857; Y10T428/2878; Y10T428/2891
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
90 words
A heat-peelable pressure-sensitive adhesive sheet comprising a substrate and formed on at least one side thereof a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres, wherein the heat-expandable pressure-sensitive adhesive layer has a surface resistivity of 10 12 Ω/□ or lower, and the heat-expandable pressure-sensitive adhesive layer before heating has a maximum surface roughness of 5 μm or less, and wherein at least one selected from the group consisting of inorganic conductive materials, organic antistatic agents and organic conductive materials is contained in or applied to the heat-expandable pressure-sensitive adhesive layer.
Claim 2
Dependent Claim
90 words
A heat-peelable pressure-sensitive adhesive sheet comprising a substrate and formed on at least one side thereof a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres, wherein the heat-expandable pressure-sensitive adhesive layer has a surface resistivity of 10 12 Ω/□ or lower, and the heat-expandable pressure-sensitive adhesive layer before heating has a maximum surface roughness of 5 μm or less, and wherein at least one selected from the group consisting of inorganic conductive materials, organic antistatic agents and organic conductive materials is contained in or applied to the heat-expandable pressure-sensitive adhesive layer.
Claim 3
Dependent Claim
31 words
The heat-peelable pressure-sensitive adhesive sheet as claimed in claim 1 , wherein the heat-expandable pressure-sensitive adhesive layer before heating has a center line average surface roughness of 2 μm or less.
Claim 4
Dependent Claim
29 words
The heat-peelable pressure-sensitive adhesive sheet as claimed in claim 1 , which further comprises a rubber-like organic elastic layer interposed between the substrate and the heat-expandable pressure-sensitive adhesive layer.
Claim 5
Dependent Claim
22 words
The heat-peelable pressure-sensitive adhesive sheet as claimed in claim 3 , wherein the rubber-like organic elastic layer comprises a pressure-sensitive adhesive material.
Claim 6
Dependent Claim
40 words
The heat-peelable pressure-sensitive adhesive sheet as claimed in claim 1 , wherein the at least one of inorganic conductive materials, organic antistatic agents and organic conductive materials is contained in the heat-expandable pressure-sensitive adhesive layer and is a conductive powder.
Claim 7
Dependent Claim
83 words
A heat-peelable pressure-sensitive adhesive sheet comprising a substrate and above at least one side thereof a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres, wherein the heat-expandable pressure-sensitive adhesive layer has a surface resistivity of 10 12 Ω/□ or lower, and the heat-expandable pressure-sensitive adhesive layer before heating has a maximum surface roughness of 5 μm or less, and wherein at least one selected from the group consisting of inorganic conductive materials, organic antistatic agents and organic conductive materials is applied to the substrate.
Claim 8
Dependent Claim
83 words
A heat-peelable pressure-sensitive adhesive sheet comprising a substrate and above at least one side thereof a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres, wherein the heat-expandable pressure-sensitive adhesive layer has a surface resistivity of 10 12 Ω/□ or lower, and the heat-expandable pressure-sensitive adhesive layer before heating has a maximum surface roughness of 5 μm or less, and wherein at least one selected from the group consisting of inorganic conductive materials, organic antistatic agents and organic conductive materials is applied to the substrate.
Claim 9
Dependent Claim
27 words
The heat-peelable pressure-sensitive adhesive sheet as claimed in claim 6 , wherein an organic antistatic agent layer is formed on at least one side of the substrate.
Claim 10
Dependent Claim
31 words
The heat-peelable pressure-sensitive adhesive sheet as claimed in claim 6 , wherein the heat-expandable pressure-sensitive adhesive layer before heating has a center line average surface roughness of 2 μm or less.
Claim 11
Dependent Claim
29 words
The heat-peelable pressure-sensitive adhesive sheet as claimed in claim 6 , which further comprises a rubber-like organic elastic layer interposed between the substrate and the heat-expandable pressure-sensitive adhesive layer.
Claim 12
Dependent Claim
22 words
The heat-peelable pressure-sensitive adhesive sheet as claimed in claim 9 , wherein the rubber-like organic elastic layer comprises a pressure-sensitive adhesive material.
Claim 13
Dependent Claim
33 words
The heat-peelable pressure-sensitive adhesive sheet as claimed in claim 6 , wherein at least one selected from the group consisting of inorganic conductive materials and organic conductive materials is applied to the substrate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2009-02-13 | 2009-08-15 | 2010-02-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2013-02-13 | 2013-08-15 | 2014-02-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2017-02-13 | 2017-08-15 | 2018-02-14 | $7700.00 | Window Closed / Lapsed |