US6927484B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Stack arrangement of a memory module
Assignee: Polaris Innovations Ltd
•
Filing: 2003-11-04
•
Granted: 2005-08-09
•
Expires: 2023-11-04
Abstract
Abstract A stack arrangement of discrete components includes a carrier substrate and at least two discrete components, e.g., memory chips. The carrier substrate has line conductor structures and contact pads. Each of the discrete components includes centrally disposed bond pads and a metallic coating, which is electrically connected to the centrally disposed bond pads. The metallic coating is disposed on an active surface area of each discrete component. A protective structure overlies a central region of the discrete component. In the preferred embodiment, the metallic coatings of each discrete component are identical. Preferably, the discrete components are stacked on the carrier substrate so as to have the same orientation, so that the protective structure serves as a spacer between the discrete components. Further, the metallic coating is electrically coupled to the carrier substrate.
Inventors
- 👤 Jochen Thomas
- 👤 Wolfgang Hetzel
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:05
CPC Classifications
H; H10; H10W; H10W90/00; H10W72/00; H10W72/01; H10W72/015; H10W72/01515; H10W72/071; H10W72/075; H10W72/851; H10W72/853; H10W72/865; H10W74/00; H10W90/20; H10W90/231; H10W90/291; H10W90/701; H10W90/721; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 36
Claim 1
Independent Claim
132 words
A stack arrangement of discrete components comprising: a carrier substrate having line conductor structures and contact pads; and at least two discrete components arranged in a stacked alignment on the carrier substrate, each of the discrete components comprising: centrally disposed bond pads; a metallic coating which is electrically connected to the centrally disposed bond pads, the metallic coating disposed on an active surface area of each discrete component; and a protective structure that overlies a central region of the discrete component; wherein the metallic coatings of each discrete component are identical; wherein the discrete components are stacked on the carrier substrate so as to have the same orientation, with the protective structure serving as a spacer between the discrete components; and wherein each metallic coating is electrically coupled to the carrier substrate.
Claim 2
Dependent Claim
132 words
A stack arrangement of discrete components comprising: a carrier substrate having line conductor structures and contact pads; and at least two discrete components arranged in a stacked alignment on the carrier substrate, each of the discrete components comprising: centrally disposed bond pads; a metallic coating which is electrically connected to the centrally disposed bond pads, the metallic coating disposed on an active surface area of each discrete component; and a protective structure that overlies a central region of the discrete component; wherein the metallic coatings of each discrete component are identical; wherein the discrete components are stacked on the carrier substrate so as to have the same orientation, with the protective structure serving as a spacer between the discrete components; and wherein each metallic coating is electrically coupled to the carrier substrate.
Claim 3
Dependent Claim
32 words
The stack arrangement of discrete components as in claim 1 wherein at least an upper one of the discrete components is electrically coupled to the carrier substrate by means of wire jumpers.
Claim 4
Dependent Claim
26 words
The stack arrangement of discrete components as in claim 1 , wherein the at least two discrete components are stacked face down on the carrier substrate.
Claim 5
Dependent Claim
64 words
The stack arrangement of discrete components as in claim 3 wherein the at least two discrete components include a lower discrete component and an upper discrete component, wherein the metallic coating of the upper discrete component is electrically connected to a reroute layer between the upper discrete component and the lower discrete component via soldered connections and to the carrier substrate via wire jumpers.
Claim 6
Dependent Claim
34 words
The stack arrangement of discrete components as in claim 4 wherein the lower discrete component is electrically connected to the carrier substrate via soldered connections directly to the contact pad of the carrier substrate.
Claim 7
Dependent Claim
25 words
The stack arrangement of discrete components as in claim 4 wherein the reroute layer is disposed on the back surface of the lower discrete component.
Claim 8
Dependent Claim
33 words
The stack arrangement of discrete components as in claim 6 wherein the reroute layer comprises a structured metallic layer disposed directly on a dielectric on an inactive surface of the lower discrete component.
Claim 9
Dependent Claim
20 words
The stack arrangement of discrete components as in claim 4 wherein the reroute layer is disposed on an intermediate layer.
Claim 10
Dependent Claim
43 words
The stack arrangement of discrete components as in claim 4 wherein the lower discrete component is disposed on the carrier substrate in such a way that a space is created between the protective structure of the lower discrete component and the carrier substrate.
Claim 11
Dependent Claim
41 words
The stack arrangement of discrete components as in claim 4 wherein the carrier substrate comprises a structured printed circuit board substrate and wherein the lower discrete component is disposed directly on the carrier substrate by means of board on chip technology.
Claim 12
Dependent Claim
31 words
The stack arrangement of discrete components as in claim 1 wherein the protective structure comprises an encapsulation that constitutes the mechanical fixation of the discrete component that is next in sequence.
Claim 13
Dependent Claim
23 words
The stack arrangement of discrete components as in claim 1 and further comprising a packaging element overlying the at least two discrete components.
Claim 14
Dependent Claim
18 words
The stack arrangement of discrete components as in claim 12 wherein the packaging element comprises a casting material.
Claim 15
Dependent Claim
22 words
The stack arrangement of discrete components as in claim 1 wherein the carrier substrate includes a fine pitch ball grid array (FBGA).
Claim 16
Dependent Claim
17 words
The stack arrangement of discrete components as in claim 1 wherein the discrete components comprise semiconductor chips.
Claim 17
Dependent Claim
17 words
The stack arrangement of discrete components as in claim 15 wherein the discrete components comprise memory chips.
Claim 18
Dependent Claim
148 words
A memory module comprising: a carrier substrate including a plurality of contact pads disposed on a first surface thereof and a plurality of external contacts disposed on an opposite surface, the external contacts being electrically coupled to the contact pads; a first memory chip including an active surface and an inactive surface, the inactive surface being adhered to the first surface of the carrier substrate, the first memory chip including bond pads adjacent the active surface, the bond pads being wire bonded to contact pads of the carrier substrate; a spacer material disposed on the active surface of the first memory chip; and a second memory chip including an active surface and an inactive surface, the inactive surface being adhered to the spacer material, the second memory chip including bond pads adjacent the active surface, the bond pads being wire bonded to contact pads of the carrier substrate.
Claim 19
Dependent Claim
148 words
A memory module comprising: a carrier substrate including a plurality of contact pads disposed on a first surface thereof and a plurality of external contacts disposed on an opposite surface, the external contacts being electrically coupled to the contact pads; a first memory chip including an active surface and an inactive surface, the inactive surface being adhered to the first surface of the carrier substrate, the first memory chip including bond pads adjacent the active surface, the bond pads being wire bonded to contact pads of the carrier substrate; a spacer material disposed on the active surface of the first memory chip; and a second memory chip including an active surface and an inactive surface, the inactive surface being adhered to the spacer material, the second memory chip including bond pads adjacent the active surface, the bond pads being wire bonded to contact pads of the carrier substrate.
Claim 20
Dependent Claim
38 words
The module of claim 17 wherein each memory chip comprises centrally disposed pads that are electrically coupled to the bond pads through a metallic coating, the metallic coating being disposed on the active surface of the memory chip.
Claim 21
Dependent Claim
23 words
The module of claim 17 wherein the external contacts of the carrier substrate are arranged in a fine pitch ball grid array (FBGA).
Claim 22
Dependent Claim
23 words
The module of claim 17 wherein the spacer material comprises an encapsulation material formed over the active surface of the first memory chip.
Claim 23
Dependent Claim
21 words
The module of claim 20 and further comprising an encapsulation material formed over the active surface of the second memory chip.
Claim 24
Dependent Claim
178 words
A memory module comprising: a carrier substrate including a plurality of contact pads disposed on a first surface thereof and a plurality of external contacts disposed on an opposite surface, the external contacts being electrically coupled to the contact pads; a first spacer adhered to the first surface of the carrier substrate; a first memory chip including an active surface and an inactive surface, the active surface being adhered to the first spacer, the first memory chip including contact pads adjacent the active surface, the contact pads being electrically coupled to contact pads of the carrier substrate; a second spacer disposed over the inactive surface of the first memory chip; a reroute layer adjacent the inactive surface of the first memory chip, the reroute layer being electrically coupled to contact pads of the carrier substrate; and a second memory chip including an active surface and an inactive surface, the active surface being adhered to the second spacer, the second memory chip including contact pads adjacent the active surface, the contact pads being electrically coupled to the reroute layer.
Claim 25
Dependent Claim
178 words
A memory module comprising: a carrier substrate including a plurality of contact pads disposed on a first surface thereof and a plurality of external contacts disposed on an opposite surface, the external contacts being electrically coupled to the contact pads; a first spacer adhered to the first surface of the carrier substrate; a first memory chip including an active surface and an inactive surface, the active surface being adhered to the first spacer, the first memory chip including contact pads adjacent the active surface, the contact pads being electrically coupled to contact pads of the carrier substrate; a second spacer disposed over the inactive surface of the first memory chip; a reroute layer adjacent the inactive surface of the first memory chip, the reroute layer being electrically coupled to contact pads of the carrier substrate; and a second memory chip including an active surface and an inactive surface, the active surface being adhered to the second spacer, the second memory chip including contact pads adjacent the active surface, the contact pads being electrically coupled to the reroute layer.
Claim 26
Dependent Claim
24 words
The module of claim 22 wherein the contact pads of the first memory chip are soldered to the contact pads of the carrier substrate.
Claim 27
Dependent Claim
39 words
The module of claim 23 wherein the first memory chip comprises centrally disposed pads that are electrically coupled to the contact pads through a metallic coating, the metallic coating being disposed on the active surface of the memory chip.
Claim 28
Dependent Claim
20 words
The module of claim 24 wherein the centrally disposed pads are electrically coupled to the metallic coating by wire bonds.
Claim 29
Dependent Claim
17 words
The module of claim 25 wherein the first spacer comprises a material that encapsulates the wire bonds.
Claim 30
Dependent Claim
67 words
The module of claim 26 wherein the second memory chip comprises centrally disposed pads that are electrically coupled to the contact pads through a metallic coating, the metallic coating being disposed on the active surface of the memory chip, wherein the centrally disposed pads are electrically coupled to the metallic coating by wire bonds, and wherein the second spacer comprises a material that encapsulates the wire bonds.
Claim 31
Dependent Claim
24 words
The module of claim 22 wherein the reroute layer comprises a conductor that is deposited on the inactive surface of the first memory chip.
Claim 32
Dependent Claim
20 words
The module of claim 28 wherein the contact pads of the second memory chip are soldered to the reroute layer.
Claim 33
Dependent Claim
39 words
The module of claim 22 wherein the first memory chip further comprises a dielectric layer formed on the inactive surface, wherein the reroute layer comprises a structured metallic layer disposed directly on the dielectric layer on the inactive surface.
Claim 34
Dependent Claim
20 words
The module of claim 22 wherein the contact pads of the second memory chip are soldered to the reroute layer.
Claim 35
Dependent Claim
32 words
The module of claim 22 and further comprising an intermediate layer disposed between the first memory chip and the second memory chip, wherein the reroute layer is disposed on the intermediate layer.
Claim 36
Dependent Claim
20 words
The module of claim 22 wherein the reroute layer is disposed between the first memory chip and the second spacer.
References Cited (Backward Citations)
US5012323A
Cited
JPH08250651A
Cited
US5726492A
Cited
US5744827A
Cited
JPH11135714A
Cited
US6495442B1
Cited
JP2002261233A
Cited
US20030020151A1
Cited
US20030203537A1
Cited
US20030153122A1
Cited
US20030160312A1
Cited
US6841863B2
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2008-08-08 | 2009-02-07 | 2009-08-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2012-08-08 | 2013-02-07 | 2013-08-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2016-08-08 | 2017-02-07 | 2017-08-09 | $7700.00 | Window Closed / Lapsed |