US6897544B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Capacitor and manufacturing method thereof, semiconductor device and substrate for a semiconductor device
Assignee: Shinko Electric Industries Co Ltd
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Filing: 2003-10-24
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Granted: 2005-05-24
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Expires: 2023-10-24
Abstract
Abstract A capacitor includes a capacitor part formed of a dielectric film sandwiched by a pair of electrodes and a support body formed of a film of an organic polysilane. The support body is provided so as to support the capacitor part thereon.
Inventors
- 👤 Kiyoshi Ooi
- 👤 Yasuyoshi Horikawa
- 👤 Tomoo Yamasaki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:13
CPC Classifications
H; H01; H01G; H01G4/00; H01G4/002; H01G4/224; H05; H05K; H05K1/00; H05K1/16; H05K1/162; H10; H10P; H10P72/00; H10P72/70; H10P72/74; H10W; H10W44/00; H10W44/601; H10W72/00; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0162; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09763; H10P72/7424; H10P72/7432; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W70/654; H10W70/655; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/90; H10W72/921; H10W72/923; H10W72/941; H10W72/9415; H10W72/951; H10W72/952; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
35 words
A capacitor, comprising: a capacitor part comprising a dielectric film sandwiched by a pair of electrodes; and a support body of a film of an organic polysilane, said support body supporting said capacitor part thereon.
Claim 2
Dependent Claim
35 words
A capacitor, comprising: a capacitor part comprising a dielectric film sandwiched by a pair of electrodes; and a support body of a film of an organic polysilane, said support body supporting said capacitor part thereon.
Claim 3
Dependent Claim
17 words
The capacitor as claimed in claim 1 , further comprising an insulation layer covering said capacitor part.
Claim 4
Dependent Claim
108 words
A substrate for mounting a semiconductor chip thereon, comprising: a substrate body defined by top and bottom surfaces; a plurality of terminals provided on said top surface for connection with a semiconductor chip mounted on said top surface, said top surface thereby forming a chip-mounting surface; a plurality of terminals provided on said bottom surface for external connection, said bottom surface thereby forming a mounting surface; and a capacitor embedded in said substrate body right underneath said chip-mounting surface, said capacitor comprising: a capacitor part including a dielectric film sandwiched by a pair of electrodes; and a support body of an organic polysilane film supporting said capacitor part.
Claim 5
Dependent Claim
108 words
A substrate for mounting a semiconductor chip thereon, comprising: a substrate body defined by top and bottom surfaces; a plurality of terminals provided on said top surface for connection with a semiconductor chip mounted on said top surface, said top surface thereby forming a chip-mounting surface; a plurality of terminals provided on said bottom surface for external connection, said bottom surface thereby forming a mounting surface; and a capacitor embedded in said substrate body right underneath said chip-mounting surface, said capacitor comprising: a capacitor part including a dielectric film sandwiched by a pair of electrodes; and a support body of an organic polysilane film supporting said capacitor part.
Claim 6
Dependent Claim
116 words
A semiconductor device, comprising: a substrate; and a semiconductor chip mounted on said substrate, said substrate comprising: a substrate body defined by top and bottom surfaces; a plurality of terminals provided on said top surface for connection with said semiconductor chip mounted on said top surface, said top surface thereby forming a chip-mounting surface; a plurality of terminals provided on said bottom surface for external connection, said bottom surface thereby forming a mounting surface; and a capacitor embedded in said substrate body right underneath said chip-mounting surface, said capacitor comprising: a capacitor part including a dielectric film sandwiched by a pair of electrodes; and a support body of an organic polysilane film supporting said capacitor part.
Claim 7
Dependent Claim
116 words
A semiconductor device, comprising: a substrate; and a semiconductor chip mounted on said substrate, said substrate comprising: a substrate body defined by top and bottom surfaces; a plurality of terminals provided on said top surface for connection with said semiconductor chip mounted on said top surface, said top surface thereby forming a chip-mounting surface; a plurality of terminals provided on said bottom surface for external connection, said bottom surface thereby forming a mounting surface; and a capacitor embedded in said substrate body right underneath said chip-mounting surface, said capacitor comprising: a capacitor part including a dielectric film sandwiched by a pair of electrodes; and a support body of an organic polysilane film supporting said capacitor part.
References Cited (Backward Citations)
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