US6866571B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Boltless carrier ring/carrier plate attachment assembly
Assignee: Monterey Research LLC
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Filing: 2002-05-21
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Granted: 2005-03-15
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Expires: 2022-05-21
Abstract
Abstract A polishing system is provided which includes an o-ring adapted to couple a carrier ring to a carrier plate. In some embodiments, one component may include a groove with which to receive the o-ring and the other component may be substantially absent of a groove adapted to receive an o-ring. Alternatively, both components may include a groove with which to receive the o-ring. Consequently, a semiconductor polishing system component comprising a notch adapted to receive an o-ring is also provided herein. In particular, the semiconductor polishing system component may be adapted to couple to another semiconductor polishing system component by use of the o-ring. In addition, a method for assembling a semiconductor polishing system is contemplated herein, which includes positioning a first component of the semiconductor polishing system against a portion of an o-ring protruding from a groove arranged within a second component of the semiconductor polishing system.
Inventors
- 👤 Ruediger Held
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 20:11
CPC Classifications
B; B24; B24B; B24B37/00; B24B37/27; B24B37/30; B24B37/32
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
73 words
A polishing system, comprising: a carrier plate dimensioned to receive a semiconductor wafer; a carrier ring dimensioned to hold the semiconductor wafer relative to the carrier plate; and an o-ring dimensioned to couple the carrier ring to the carrier plate such that sidewalls of the carrier ring and carrier plate are in contact, wherein the carrier plate and the carrier ring each comprise a groove dimensioned to receive a part of the o-ring.
Claim 2
Dependent Claim
73 words
A polishing system, comprising: a carrier plate dimensioned to receive a semiconductor wafer; a carrier ring dimensioned to hold the semiconductor wafer relative to the carrier plate; and an o-ring dimensioned to couple the carrier ring to the carrier plate such that sidewalls of the carrier ring and carrier plate are in contact, wherein the carrier plate and the carrier ring each comprise a groove dimensioned to receive a part of the o-ring.
Claim 3
Dependent Claim
33 words
The polishing system of claim 1 , wherein the carrier ring and the carrier plate are dimensioned to protrude a portion of the semiconductor wafer within approximately 0.001 inches of a predetermine value.
Claim 4
Dependent Claim
23 words
The polishing system of claim 2 , wherein the carrier ring comprises a thickness tolerance between approximately 0.0001 inches and approximately 0.001 inches.
Claim 5
Dependent Claim
23 words
The polishing system of claim 2 , wherein the carrier plate comprises a thickness tolerance between approximately 0.0001 inches and approximately 0.001 inches.
Claim 6
Dependent Claim
70 words
The polishing system of claim 1 , wherein the polishing system is dimensioned adapted to produce a substantially planar surface in a region extending less than approximately 10 mm from an outer edge of the semiconductor wafer, wherein the substantially planar surface comprises a structure with a thickness that differs by less than approximately 10% of a thickness of a similar structure arranged within the center of the semiconductor wafer.
Claim 7
Dependent Claim
32 words
The polishing system of claim 1 , wherein the carrier plate, carrier ring and o-ring are collectively dimensioned to prevent movement of the carrier ring when the semiconductor wafer is being polished.
Claim 8
Dependent Claim
38 words
The polishing system of claim 1 , wherein the grooves of the carrier plate and carrier ring are arranged within sidewalls which are substantially perpendicular to a surface of the carrier plate configured to receive the semiconductor wafer.
Claim 9
Dependent Claim
41 words
The polishing system of claim 1 , wherein the carrier plate comprises an elongated portion and a shortened portion, and wherein the carrier ring is configured to fit flush with surfaces of at least one of the elongated and shortened portions.
Claim 10
Dependent Claim
27 words
The polishing system of claim 8 , wherein a dimensional variation between elongated portion and shortened portion is substantially similar to a width of the carrier ring.
Claim 11
Dependent Claim
20 words
The polishing system of claim 8 , wherein the groove on the carrier plate is positioned along the shortened portion.
Claim 12
Dependent Claim
57 words
A semiconductor polishing system component comprising a notch dimensioned to receive an o-ring, wherein the semiconductor polishing system component is dimensioned to couple to another semiconductor polishing system component by use of the o-ring, and wherein semiconductor polishing system component is dimensioned to protrude a portion of a semiconductor wafer received and held by the two components.
Claim 13
Dependent Claim
57 words
A semiconductor polishing system component comprising a notch dimensioned to receive an o-ring, wherein the semiconductor polishing system component is dimensioned to couple to another semiconductor polishing system component by use of the o-ring, and wherein semiconductor polishing system component is dimensioned to protrude a portion of a semiconductor wafer received and held by the two components.
Claim 14
Dependent Claim
33 words
The semiconductor polishing system component of claim 11 , wherein the semiconductor polishing system component is dimensioned to protrude the portion of the semiconductor wafer within approximately 0.001 inches of a predetermined value.
Claim 15
Dependent Claim
19 words
The semiconductor polishing system component of claim 12 , wherein the semiconductor polishing system component is a carrier ring.
Claim 16
Dependent Claim
26 words
The semiconductor polishing system component of claim 13 , wherein a thickness variation of the carrier ring is between approximately 0.0001 inches and approximately 0.001 inches.
Claim 17
Dependent Claim
19 words
The semiconductor polishing system component of claim 12 , wherein the semiconductor polishing system component is a carrier plate.
Claim 18
Dependent Claim
35 words
The semiconductor polishing system component of claim 15 , wherein the carrier plate comprises a section with a thickness variation between approximately 0.0001 inches and approximately 0.001 inches across the entire width of the section.
Claim 19
Dependent Claim
29 words
The polishing system of claim 15 , wherein the carrier plate comprises an elongated portion and a shortened portion, and wherein the notch is arranged along the shortened portion.
Claim 20
Independent Claim
73 words
A method for assembling a semiconductor polishing system comprising positioning a first component of the semiconductor polishing system against a portion of an o-ring protruding from a groove arranged within a second component of the semiconductor polishing system such that the first component contacts portions of the second component laterally surrounding the groove within the second component and the protrusion of the o-ring is received by a groove arranged within the first component.
Claim 21
Independent Claim
73 words
A method for assembling a semiconductor polishing system comprising positioning a first component of the semiconductor polishing system against a portion of an o-ring protruding from a groove arranged within a second component of the semiconductor polishing system such that the first component contacts portions of the second component laterally surrounding the groove within the second component and the protrusion of the o-ring is received by a groove arranged within the first component.
Claim 22
Dependent Claim
26 words
The method of claim 18 , further comprising placing a semiconductor wafer against one of the first and second components directly after the step of positioning.
Claim 23
Dependent Claim
31 words
The method of claim 18 , wherein the protrusion of the o-ring extends from a sidewall of the second component by a distance between approximately 0.0001 inches and approximately 0.01 inches.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2008-03-14 | 2008-09-13 | 2009-03-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2012-03-14 | 2012-09-13 | 2013-03-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2016-03-14 | 2016-09-13 | 2017-03-15 | $7700.00 | Window Closed / Lapsed |