US6834133B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Optoelectronic packages and methods to simultaneously couple an optoelectronic chip to a waveguide and substrate
Assignee: Intel Corp
•
Filing: 2003-08-27
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Granted: 2004-12-21
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Expires: 2023-08-27
Abstract
Abstract Optoelectronic packages and methods to simultaneously couple an optoelectronic chip to a waveguide and substrate using conventional flux soldering processes are disclosed. A disclosed optoelectronic package includes a substrate, a waveguide mounted on the substrate, an optoelectronic chip having electrically conductive contacts coupled to the substrate via a metallic solder and an optical element located on the optoelectronic chip and coupled to the waveguide via an optical solder which protects the optical element during a metallic soldering of the optoelectronic chip to the substrate.
Inventors
- 👤 Steven Towle
- 👤 Daoqiang Lu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 18:58
CPC Classifications
G; G02; G02B; G02B6/00; G02B6/24; G02B6/42; G02B6/4201; G02B6/4204; G02B6/4214; G02B6/4219; G02B6/4228; G02B6/4232
Claims Analysis
Total Claims: 34
Claim 1
Independent Claim
60 words
An apparatus comprising: a substrate; a waveguide mounted on the substrate; an optoelectronic chip having electrically conductive contacts coupled to the substrate via a metallic solder; and an optical element located on the optoelectronic chip and coupled to the waveguide via an optical solder which protects the optical element during a metallic soldering of the optoelectronic chip to the substrate.
Claim 2
Independent Claim
60 words
An apparatus comprising: a substrate; a waveguide mounted on the substrate; an optoelectronic chip having electrically conductive contacts coupled to the substrate via a metallic solder; and an optical element located on the optoelectronic chip and coupled to the waveguide via an optical solder which protects the optical element during a metallic soldering of the optoelectronic chip to the substrate.
Claim 3
Dependent Claim
15 words
An apparatus as defined in claim 1 , wherein the optoelectronic chip is a flip-chip.
Claim 4
Dependent Claim
20 words
An apparatus as defined in claim 1 , wherein the optical element comprises a transceiver, a receiver or a transmitter.
Claim 5
Dependent Claim
40 words
An apparatus as defined in claim 1 , wherein the optical solder is at least one of a polymer optical solder, an optically transparent adhesive at a predefined wavelength, a dispensable material, a thixotropic material and a low modulus material.
Claim 6
Dependent Claim
32 words
An apparatus as defined in claim 1 , wherein a refraction index of the optical solder approximately matches a refraction index of the waveguide and a refraction index of the optical element.
Claim 7
Dependent Claim
21 words
An apparatus as defined in claim 1 , further comprising an underfill material disposed between the optoelectronic chip and the substrate.
Claim 8
Dependent Claim
22 words
An apparatus as defined in claim 6 , wherein the underfill material is not disposed between the optical element and the waveguide.
Claim 9
Dependent Claim
14 words
An apparatus as defined in claim 1 , wherein the waveguide includes a mirror.
Claim 10
Dependent Claim
15 words
An apparatus as defined in claim 8 , wherein the mirror is a metallized mirror.
Claim 11
Dependent Claim
15 words
An apparatus as defined in claim 1 , wherein the waveguide is a planar waveguide.
Claim 12
Dependent Claim
32 words
An apparatus as defined in claim 1 , wherein the optical solder protects the optical element from being contaminated by flux residue during the metallic soldering and from being damaged during defluxing.
Claim 13
Independent Claim
75 words
An apparatus comprising: a substrate; a flip-chip having an optically active area; a waveguide at least partially disposed between the substrate and the flip-chip; electrically conductive contacts located on the flip-chip and coupled to the substrate via a metallic solder; and an optical solder bonding the optically active area of the flip-chip to the waveguide via an optical solder which protects the optically active area during metallic soldering of the flip-chip chip to the substrate.
Claim 14
Independent Claim
75 words
An apparatus comprising: a substrate; a flip-chip having an optically active area; a waveguide at least partially disposed between the substrate and the flip-chip; electrically conductive contacts located on the flip-chip and coupled to the substrate via a metallic solder; and an optical solder bonding the optically active area of the flip-chip to the waveguide via an optical solder which protects the optically active area during metallic soldering of the flip-chip chip to the substrate.
Claim 15
Dependent Claim
27 words
An apparatus as defined in claim 12 , wherein the optical solder has a thermal curing temperature substantially equal to a melting temperature of the metallic solder.
Claim 16
Dependent Claim
40 words
An apparatus as defined in claim 12 , wherein the optical solder is at least one of a polymer optical solder, an optically transparent adhesive at a predefined wavelength, a dispensable material, a thixotropic material and a low modulus material.
Claim 17
Dependent Claim
17 words
An apparatus as defined in claim 12 , wherein the optical solder covers the optically active area.
Claim 18
Dependent Claim
25 words
An apparatus as defined in claim 12 , wherein when cured, the optical solder forms an optical solder joint between the flip-chip and the waveguide.
Claim 19
Dependent Claim
20 words
An apparatus as defined in claim 12 , wherein facing surfaces of the flip-chip and the substrate are electrically connected.
Claim 20
Independent Claim
76 words
A method of mounting a flip-chip to a substrate comprising: attaching a waveguide to the substrate; dispensing an optical solder onto the waveguide; aligning the flip-chip at least partially on the substrate and at least partially on the optical solder; and soldering the flip-chip to the waveguide and the substrate simultaneously such that the optical solder couples an optically active area of the flip-chip to the waveguide and solder bumps couple the flip-chip to the substrate.
Claim 21
Independent Claim
76 words
A method of mounting a flip-chip to a substrate comprising: attaching a waveguide to the substrate; dispensing an optical solder onto the waveguide; aligning the flip-chip at least partially on the substrate and at least partially on the optical solder; and soldering the flip-chip to the waveguide and the substrate simultaneously such that the optical solder couples an optically active area of the flip-chip to the waveguide and solder bumps couple the flip-chip to the substrate.
Claim 22
Dependent Claim
15 words
A method as defined in claim 18 , further comprising dispensing flux on the substrate.
Claim 23
Dependent Claim
24 words
A method of manufacturing as defined in claim 19 , further comprising defluxing at least one of the substrate, the flip-chip and the waveguide.
Claim 24
Dependent Claim
26 words
A method as defined in claim 18 , wherein soldering the flip-chip to the substrate comprises capturing the optical solder between the flip-chip and the waveguide.
Claim 25
Dependent Claim
27 words
A method as defined in claim 18 , wherein soldering the flip-chip to the substrate comprises forming an optical solder joint between the flip-chip and the waveguide.
Claim 26
Dependent Claim
22 words
A method as defined in claim 18 , wherein soldering the flip-chip to the substrate comprises snap thermal curing the optical solder.
Claim 27
Dependent Claim
23 words
A method as defined in claim 18 , wherein soldering the flip-chip to the substrate comprises electrically connecting the flip-chip and the substrate.
Claim 28
Dependent Claim
35 words
A method as defined in claim 18 , wherein soldering the flip-chip to the waveguide and the substrate comprises optically connecting the die to the waveguide and electrically connecting the flip-chip to the substrate simultaneously.
Claim 29
Dependent Claim
20 words
A method as defined in claim 18 , further comprising disposing an underfill material between the flip-chip and the substrate.
Claim 30
Dependent Claim
29 words
A method as defined in claim 26 , wherein the optical solder prevents the underfill material from entering between the optically active area of the flip-chip and the waveguide.
Claim 31
Dependent Claim
35 words
A method as defined in claim 18 , further comprising aligning and placing the flip-chip at least partially on the substrate and at least partially on the optical solder using a pick and place machine.
Claim 32
Dependent Claim
28 words
A method as defined in claim 18 , wherein soldering the flip-chip and the waveguide comprises covering the optically active area of the flip-chip with the optical solder.
Claim 33
Dependent Claim
25 words
A method as defined in claim 18 , wherein the refraction indices of the optically active area, the optical solder and the waveguide substantially match.
Claim 34
Dependent Claim
30 words
A method as defined in claim 18 , wherein soldering the flip-chip to the waveguide and the substrate simultaneously comprises solder self-aligning the flip-chip with the waveguide and the substrate.
References Cited (Backward Citations)
US20040057648A1
Cited
US20040118599A1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2007-12-21 | 2008-06-21 | 2008-12-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2011-12-21 | 2012-06-21 | 2012-12-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2015-12-21 | 2016-06-21 | 2016-12-21 | $7700.00 | Window Closed / Lapsed |