US6795120B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Solid-state imaging apparatus and camera using the same
Assignee: Sony Corp
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Filing: 1997-05-13
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Granted: 2004-09-21
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Expires: 2017-05-13
Abstract
Abstract At least a solid-state imaging device and one or a plurality of bare ICs that are disposed on the back face or on the back face side of the solid-state imaging apparatus and serve as peripheral circuits are provided. The bare ICs are sealed by a resin. A circuit board may be interposed between the solid-state imaging device and the bare ICs, or the solid-state imaging device and the ICs are directly bonded together. According to another aspect, IC chips and other parts as peripheral circuits of a solid-state imaging device are disposed on the inner surface, mainly the ceiling surface, of a light-shielding case. According to a further aspect, a solid-state imaging apparatus for photoelectrically converting, with an imaging device, an image formed by introducing imaging light into the inside of the apparatus is provided with a package having a dark space in itself and accommodating the imaging device in the dark space, and a pinhole for introducing imaging light into the dark space and forming an image of an imaging object on the imaging face of the imaging device.
Inventors
- 👤 Yuichi Takagi
- 👤 Masayoshi Kanazawa
- 👤 Kazuhiko Ueda
- 👤 Makoto Tsuchimochi
- 👤 Shigeo Ikeda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 04:11
CPC Classifications
H; H10; H10F; H10F39/00; H10F39/80; H10F39/809; H04; H04N; H04N23/00; H04N23/50; H04N23/54; H04N23/57; H10F39/804; H10F39/805; H10F39/8057; H10F77/00; H10F77/40; H10F77/407; H10F77/50; H10W; H10W90/00; H05; H05K; H05K1/00; H05K1/02; H05K1/0284; H05K1/03; H05K1/0306; H05K1/14; H05K1/144; H10F39/011; H10F39/806; H10F39/8063; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
203 words
A solid-state imaging apparatus comprising: a solid-state imaging device; one or a plurality of bare ICs disposed on a back side of the solid-state imaging device, and serving as a peripheral circuit or circuits of the solid-state imaging device, wherein at least one of the bare ICs is directly disposed on a back surface of the solid-state imaging device; a resin for sealing the bare IC or ICs; a light-shielding case having an aperture for limiting light that comes from an outside of the solid-state imaging apparatus and traveling toward a front side of the solid-state imaging device; and a lens disposed on the front side of the solid-state imaging device, within an interior of the light-shielding case, and apart from the light-shielding case, for forming, on a front surface of the solid-state imaging device, an object image that is carried by light passing through the aperture, the lens having an integral lens fixing member connecting the lens to the solid-state imaging device at such a position that the lens can image an object onto the front surface of the solid-state imaging device, the lens being installed separately from the solid-state imaging device, the lens fixing member being made of a light-interrupting material.
Claim 2
Dependent Claim
203 words
A solid-state imaging apparatus comprising: a solid-state imaging device; one or a plurality of bare ICs disposed on a back side of the solid-state imaging device, and serving as a peripheral circuit or circuits of the solid-state imaging device, wherein at least one of the bare ICs is directly disposed on a back surface of the solid-state imaging device; a resin for sealing the bare IC or ICs; a light-shielding case having an aperture for limiting light that comes from an outside of the solid-state imaging apparatus and traveling toward a front side of the solid-state imaging device; and a lens disposed on the front side of the solid-state imaging device, within an interior of the light-shielding case, and apart from the light-shielding case, for forming, on a front surface of the solid-state imaging device, an object image that is carried by light passing through the aperture, the lens having an integral lens fixing member connecting the lens to the solid-state imaging device at such a position that the lens can image an object onto the front surface of the solid-state imaging device, the lens being installed separately from the solid-state imaging device, the lens fixing member being made of a light-interrupting material.
Claim 3
Dependent Claim
206 words
A camera comprising: a solid-state imaging apparatus comprising: a solid-state imaging device; one or a plurality of bare ICs disposed on a back side of the solid-state imaging device, and serving as a peripheral circuit or circuits of the solid-state imaging device, wherein at least one of the bare ICs is directly disposed on a back surface of the solid-state imaging device; a resin for sealing the bare IC or ICs; a light-shielding case having an aperture for limiting light that comes from an outside of the solid-state imaging apparatus and traveling toward a front side of the solid-state imaging device; and a lens disposed on the front side of the solid-state imaging device, within an interior of the light-shielding case, and apart from the light-shielding case, for forming, on a front surface of the solid-state imaging device, an object image that is carried by light passing through the aperture, the lens having an integral lens fixing member connecting the lens to the solid-state imaging device at such a position that the lens can image an object onto the front surface of the solid-state imaging device, the lens being installed separately from the solid-state imaging device, the lens fixing member being made of a light-interrupting material.
Claim 4
Dependent Claim
206 words
A camera comprising: a solid-state imaging apparatus comprising: a solid-state imaging device; one or a plurality of bare ICs disposed on a back side of the solid-state imaging device, and serving as a peripheral circuit or circuits of the solid-state imaging device, wherein at least one of the bare ICs is directly disposed on a back surface of the solid-state imaging device; a resin for sealing the bare IC or ICs; a light-shielding case having an aperture for limiting light that comes from an outside of the solid-state imaging apparatus and traveling toward a front side of the solid-state imaging device; and a lens disposed on the front side of the solid-state imaging device, within an interior of the light-shielding case, and apart from the light-shielding case, for forming, on a front surface of the solid-state imaging device, an object image that is carried by light passing through the aperture, the lens having an integral lens fixing member connecting the lens to the solid-state imaging device at such a position that the lens can image an object onto the front surface of the solid-state imaging device, the lens being installed separately from the solid-state imaging device, the lens fixing member being made of a light-interrupting material.
Claim 5
Dependent Claim
147 words
A solid-state imaging apparatus comprising: a solid-state imaging device; one or a plurality of bare ICs disposed on a back side of the solid-state imaging device, and serving as a peripheral circuit or circuits of the solid-state imaging device, wherein at least one of the bare ICs is directly disposed on a back surface of the solid-state imaging device; a resin for sealing the bare IC or ICs; a light-shielding case having an aperture for limiting light that comes from an outside of the solid-state imaging apparatus and traveling toward a front side of the solid-state imaging device; and a lens disposed on the front side of the solid-state imaging device, within an interior of the light-shielding case, and apart from the light-shielding case, for forming, on a front surface of the solid-state imaging device, an object image that is carried by light passing through the aperture.
Claim 6
Dependent Claim
147 words
A solid-state imaging apparatus comprising: a solid-state imaging device; one or a plurality of bare ICs disposed on a back side of the solid-state imaging device, and serving as a peripheral circuit or circuits of the solid-state imaging device, wherein at least one of the bare ICs is directly disposed on a back surface of the solid-state imaging device; a resin for sealing the bare IC or ICs; a light-shielding case having an aperture for limiting light that comes from an outside of the solid-state imaging apparatus and traveling toward a front side of the solid-state imaging device; and a lens disposed on the front side of the solid-state imaging device, within an interior of the light-shielding case, and apart from the light-shielding case, for forming, on a front surface of the solid-state imaging device, an object image that is carried by light passing through the aperture.
Claim 7
Dependent Claim
150 words
A camera comprising: a solid-state imaging apparatus comprising: a solid-state imaging device; one or a plurality of bare ICs disposed on a back side of the solid-state imaging device, and serving as a peripheral circuit or circuits of the solid-state imaging device, wherein at least one of the bare ICs is directly disposed on a back surface of the solid-state imaging device; a resin for sealing the bare IC or ICs; a light-shielding case having an aperture for limiting light that comes from an outside of the solid-state imaging apparatus and traveling toward a front side of the solid-state imaging device; and a lens disposed on the front side of the solid-state imaging device, within an interior of the light-shielding case, and apart from the light-shielding case, for forming, on a front surface of the solid-state imaging device, an object image that is carried by light passing through the aperture.
Claim 8
Dependent Claim
150 words
A camera comprising: a solid-state imaging apparatus comprising: a solid-state imaging device; one or a plurality of bare ICs disposed on a back side of the solid-state imaging device, and serving as a peripheral circuit or circuits of the solid-state imaging device, wherein at least one of the bare ICs is directly disposed on a back surface of the solid-state imaging device; a resin for sealing the bare IC or ICs; a light-shielding case having an aperture for limiting light that comes from an outside of the solid-state imaging apparatus and traveling toward a front side of the solid-state imaging device; and a lens disposed on the front side of the solid-state imaging device, within an interior of the light-shielding case, and apart from the light-shielding case, for forming, on a front surface of the solid-state imaging device, an object image that is carried by light passing through the aperture.
Claim 9
Dependent Claim
33 words
A solid-state apparatus according to claim 3 , wherein said at least one of the plurality of ICs is disposed directly on the back surface of the solid-state imaging device with an adhesive.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2007-09-21 | 2008-03-22 | 2008-09-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2011-09-21 | 2012-03-22 | 2012-09-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2015-09-21 | 2016-03-22 | 2016-09-21 | $7700.00 | Window Closed / Lapsed |