US6781241B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device and manufacturing method thereof
Assignee: Fujitsu Ltd
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Filing: 2002-10-17
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Granted: 2004-08-24
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Expires: 2022-10-17
Abstract
Abstract A stacked-type semiconductor device has a reduced overall height and an improved reliability in the mechanical strength of the stacked structure. The semiconductor device also has an improved heat release characteristic. A first interposer has a surface on which first electrode pads are formed and a first semiconductor element is mounted with a circuit forming surface facing the first interposer. A second interposer has a surface on which second electrode pads are formed and a second semiconductor element is mounted with a circuit forming surface facing the second interposer. External connection terminals are provided on a surface of the second interposer opposite to the surface on which the second semiconductor element is mounted. The first and second interposers are electrically connected to each other by conductive members provided therebetween. A back surface of the first semiconductor element and a back surface of the second semiconductor element are fixed to each other by an adhesive.
Inventors
- 👤 Takao Nishimura
- 👤 Tadashi Uno
- 👤 Hiroshi Onodera
- 👤 Akira Takashima
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 03:22
CPC Classifications
H; H10; H10W; H10W72/00; H10W90/00; H10W70/00; H10W70/60; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/877; H10W72/884; H10W74/00; H10W74/10; H10W74/15; H10W90/20; H10W90/22; H10W90/271; H10W90/288; H10W90/297; H10W90/701; H10W90/721; H10W90/722; H10W90/724; H10W90/731; H10W90/732; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
184 words
A semiconductor device comprising: a first semiconductor element having a circuit forming surface and a back surface opposite to the circuit forming surface; a first interposer having a surface on which first electrode pads are formed and said first semiconductor element is mounted with the circuit forming surface facing the first interposer; a second semiconductor element having a circuit forming surface and a back surface opposite to the circuit forming surface; a second interposer having a surface on which second electrode pads are formed and said second semiconductor element is mounted with the circuit forming surface facing the second interposer, the second electrode pads for connection with said first interposer; and external connection terminals provided on a surface of said second interposer opposite to the surface on which said second semiconductor element is mounted, wherein said first interposer and said second interposer are electrically connected to each other by conductive members between said first and second electrode pads, and the back surface of said first semiconductor element and the back surface of said second semiconductor element are fixed to each other by an adhesive.
Claim 2
Dependent Claim
184 words
A semiconductor device comprising: a first semiconductor element having a circuit forming surface and a back surface opposite to the circuit forming surface; a first interposer having a surface on which first electrode pads are formed and said first semiconductor element is mounted with the circuit forming surface facing the first interposer; a second semiconductor element having a circuit forming surface and a back surface opposite to the circuit forming surface; a second interposer having a surface on which second electrode pads are formed and said second semiconductor element is mounted with the circuit forming surface facing the second interposer, the second electrode pads for connection with said first interposer; and external connection terminals provided on a surface of said second interposer opposite to the surface on which said second semiconductor element is mounted, wherein said first interposer and said second interposer are electrically connected to each other by conductive members between said first and second electrode pads, and the back surface of said first semiconductor element and the back surface of said second semiconductor element are fixed to each other by an adhesive.
Claim 3
Dependent Claim
39 words
The semiconductor device as claimed in claim 1 , further comprising at least one third semiconductor element which is mounted on a surface of said first interposer opposite to the surface on which said first semiconductor element is mounted.
Claim 4
Dependent Claim
34 words
The semiconductor device as claimed in claim 2 , wherein a plurality of the third semiconductor elements are mounted and encapsulated on the surface of said first interposer in a stacked and fixed state.
Claim 5
Dependent Claim
37 words
The semiconductor device as claimed in claim 1 , wherein a metal layer for heat release is provided on a surface of said first interposer opposite to the surface on which said first semiconductor element is mounted.
Claim 6
Dependent Claim
31 words
The semiconductor device as claimed in claim 1 , wherein at least one fourth semiconductor element is mounted on the surface of said second interposer provided with said external connection terminals.
Claim 7
Dependent Claim
25 words
The semiconductor device as claimed in claim 5 , wherein a plurality of the fourth semiconductor elements are provided and encapsulated on said second interposer.
Claim 8
Dependent Claim
20 words
The semiconductor device as claimed in claim 1 , wherein each of said external connection terminals is a flat pad.
Claim 9
Dependent Claim
20 words
The semiconductor device as claimed in claim 1 , wherein each of said external connection terminals has a protruding shape.
Claim 10
Dependent Claim
29 words
The semiconductor device as claimed in claim 1 , wherein each of said external connection terminals is a lead terminal extending in a direction outward from said second interposer.
Claim 11
Dependent Claim
40 words
The semiconductor device as claimed in claim 1 , wherein said adhesive, which bonds the back surface of said first semiconductor element and the back surface of said second semiconductor element to each other, is a thermosetting type resin adhesive.
Claim 12
Dependent Claim
23 words
The semiconductor device as claimed in claim 10 , wherein said thermosetting type resin adhesive contains at least one of silver and copper.
Claim 13
Dependent Claim
28 words
The semiconductor device as claimed in claim 1 , wherein a reinforcing adhesive is provided to connecting parts between said conductive materials and said first and second interposers.
Claim 14
Dependent Claim
22 words
The semiconductor device as claimed in claim 12 , wherein said reinforcing adhesive is made of an insulating thermosetting type resin material.
Claim 15
Dependent Claim
29 words
The semiconductor device as claimed in claim 12 , wherein said reinforcing adhesive is in the form of a film having openings corresponding to positions of said conductive members.
References Cited (Backward Citations)
JP2001223297A
Cited
US6388333B1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2007-08-24 | 2008-02-23 | 2008-08-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2011-08-24 | 2012-02-23 | 2012-08-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2015-08-24 | 2016-02-23 | 2016-08-24 | $7700.00 | Window Closed / Lapsed |