US6773960B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate
Assignee: Micron Technology Inc
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Filing: 2003-05-08
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Granted: 2004-08-10
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Expires: 2023-05-08
Abstract
Abstract An interposer includes a substantially planar substrate with a slot formed therethrough. The slot includes a laterally recessed area formed in only a portion of a periphery thereof, which is positioned so as to expose at least a portion of an active surface of the semiconductor die located between a bond pad and an outer periphery of the semiconductor die. The laterally recessed area facilitates access to the bond pad by apparatus for forming, positioning, or securing intermediate conductive elements. The slot may be formed by forming a first, thin elongated slot through the interposer substrate, then widening a portion thereof. Alternatively, a first, small circular hole may be formed through the interposer substrate, then an elongated slot having a width that exceeds the diameter of the small circular hole may be formed through the substrate at a location which is continuous with the small circular hole.
Inventors
- 👤 Setho Sing Fee
- 👤 Tay Wuu Yean
- 👤 Lim Thiam Chye
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 21:12
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/0011; H05K3/0044; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W72/00; H10W72/071; H10W72/077; H10W90/00; H10W90/701; H10W99/00; H05K2203/00; H05K2203/02; H05K2203/0228; H05K2203/14; H05K2203/1476; H10W72/01; H10W72/0198; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/701; H10W72/851; H10W72/853; H10W72/865; H10W74/00; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T408/00; Y10T408/03
Claims Analysis
Total Claims: 29
Claim 1
Independent Claim
88 words
A method for forming an opening through an interposer, comprising: providing a substrate element; forming a first hole through said substrate element; forming a second elongated hole through said substrate element separately in time from forming said first hole, said second hole being continuous with said first hole, said second hole having a greater diameter than a diameter of said first hole, said first hole being positioned for alignment laterally adjacent to a bond pad of a semiconductor device upon positioning said substrate element over said semiconductor device.
Claim 2
Independent Claim
88 words
A method for forming an opening through an interposer, comprising: providing a substrate element; forming a first hole through said substrate element; forming a second elongated hole through said substrate element separately in time from forming said first hole, said second hole being continuous with said first hole, said second hole having a greater diameter than a diameter of said first hole, said first hole being positioned for alignment laterally adjacent to a bond pad of a semiconductor device upon positioning said substrate element over said semiconductor device.
Claim 3
Dependent Claim
16 words
The method of claim 1 , wherein said forming said first and second holes comprises machining.
Claim 4
Dependent Claim
11 words
The method of claim 2 , wherein said machining comprises drilling.
Claim 5
Dependent Claim
21 words
The method of claim 1 , wherein said forming said first hole comprises forming an elongated slot through said substrate element.
Claim 6
Dependent Claim
24 words
The method of claim 4 , wherein said forming said second elongated hole comprises increasing a width of a portion of said first hole.
Claim 7
Dependent Claim
21 words
The method of claim 1 , wherein said forming said first hole comprises forming a small hole in said substrate element.
Claim 8
Dependent Claim
40 words
The method of claim 1 , wherein said forming said second elongated hole comprises introducing a drill bit through a plane of said substrate element and moving said drill bit along said plane as said drill bit intersects said plane.
Claim 9
Dependent Claim
22 words
The method of claim 7 , wherein said moving said drill bit comprises moving said drill bit substantially linearly along said planes.
Claim 10
Dependent Claim
34 words
The method of claim 1 , wherein said providing comprising a substrate element comprising at least one of a resin, a plastic, an insulator-coated semiconductor material, an insulator-coated material, and an electrically insulative material.
Claim 11
Dependent Claim
28 words
The method of claim 1 , wherein said forming said first hole and said forming said second elongated hole both comprise etching a material of said substrate element.
Claim 12
Independent Claim
92 words
A method for forming an interposer, comprising: providing a substrate element; and defining an elongate slot through said substrate element, a portion of at least one end of said elongate slot including a laterally recessed area, said laterally recessed area being positioned for alignment laterally adjacent to a bond pad of a semiconductor device upon positioning said substrate element over said semiconductor device with at least a portion of an active surface located between said bond pad and an outer periphery of said semiconductor device being exposed through said laterally recessed area.
Claim 13
Independent Claim
92 words
A method for forming an interposer, comprising: providing a substrate element; and defining an elongate slot through said substrate element, a portion of at least one end of said elongate slot including a laterally recessed area, said laterally recessed area being positioned for alignment laterally adjacent to a bond pad of a semiconductor device upon positioning said substrate element over said semiconductor device with at least a portion of an active surface located between said bond pad and an outer periphery of said semiconductor device being exposed through said laterally recessed area.
Claim 14
Dependent Claim
18 words
The method of claim 11 , wherein said providing comprises providing a substrate element comprising an etchable material.
Claim 15
Dependent Claim
23 words
The method of claim 12 , wherein said defining comprises removing material of said substrate element in a location of said elongate slot.
Claim 16
Dependent Claim
14 words
The method of claim 13 , wherein said removing comprises etching said substrate element.
Claim 17
Dependent Claim
23 words
The method of claim 11 , wherein said defining said elongate slot, including said laterally recessed area thereof, comprises machining said substrate element.
Claim 18
Dependent Claim
11 words
The method of claim 15 , wherein said machining comprises drilling.
Claim 19
Dependent Claim
23 words
The method of claim 11 , wherein said defining said elongate slot comprises forming a first, elongate, narrow slot through said substrate element.
Claim 20
Dependent Claim
40 words
The method of claim 17 , wherein said defining said elongate slot further comprises increasing a width of a portion of said first, elongate, narrow slot, said laterally recessed area comprising a nonwidened portion of said first, elongate, narrow slot.
Claim 21
Dependent Claim
22 words
The method of claim 11 , further comprising defining said laterally recessed area by forming a small hole in said substrate element.
Claim 22
Dependent Claim
58 words
The method of claim 19 , further comprising defining a remainder of said elongate slot by introducing a drill bit through a plane of said substrate element and moving said drill bit along said plane as said drill bit intersects said plane until a slot formed by said drilling and said moving becomes continuous with said small hole.
Claim 23
Dependent Claim
22 words
The method of claim 20 , wherein said moving said drill bit comprises moving said drill bat substantially linearly along said plane.
Claim 24
Dependent Claim
34 words
The method of claim 11 , wherein said providing comprises providing a substrate element comprising at least one of a resin, a plastic, an insulator-coated semiconductor material, an material, and an electrically insulative material.
Claim 25
Independent Claim
123 words
A method for forming a semiconductor device assembly, comprising: providing a semiconductor die including bond pads on an active surface thereof, at least one of said bond pads being located proximate an outer periphery of said semiconductor die; and securing an interposer to said active surface, said interposer including at least one opening formed therethrough so as to expose at least some of said bond pads through said interposer, said at least one opening including at least one laterally recessed area formed in a periphery of said at least one opening, said at least one laterally recessed area positioned so as to expose at least a portion of said active surface located between said at least one bond pad and said outer periphery.
Claim 26
Independent Claim
123 words
A method for forming a semiconductor device assembly, comprising: providing a semiconductor die including bond pads on an active surface thereof, at least one of said bond pads being located proximate an outer periphery of said semiconductor die; and securing an interposer to said active surface, said interposer including at least one opening formed therethrough so as to expose at least some of said bond pads through said interposer, said at least one opening including at least one laterally recessed area formed in a periphery of said at least one opening, said at least one laterally recessed area positioned so as to expose at least a portion of said active surface located between said at least one bond pad and said outer periphery.
Claim 27
Dependent Claim
24 words
The method of claim 23 , further comprising electrically connecting said at least one bond pad to a corresponding contact area of said interposer.
Claim 28
Dependent Claim
28 words
The method of claim 24 , wherein said electrically connecting comprises disposing an intermediate conductive element between said at least one bond pad and said corresponding contact area.
Claim 29
Dependent Claim
39 words
The method of claim 25 , wherein said electrically connecting comprises introducing at least a portion of an apparatus that forms, positions, or secures said intermediate conductive element at least partially into said at least one laterally recessed area.
References Cited (Backward Citations)
US6472727B2
Cited
US6252298B1
Cited
US6268650B1
Cited
US6201299B1
Cited
US6221697B1
Cited
US6242283B1
Cited
US6531335B1
Cited
US20020020902A1
Cited
US6445077B1
Cited
US6525412B2
Cited
US20030094681A1
Cited
US20030064542A1
Cited
US6472736B1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2007-08-10 | 2008-02-09 | 2008-08-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2011-08-10 | 2012-02-09 | 2012-08-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2015-08-10 | 2016-02-09 | 2016-08-10 | $7700.00 | Window Closed / Lapsed |