Abstract It is an object to provide a semiconductor device having a copper wiring structure in which a copper diffusion preventing capability of a silicon carbide film can be improved and a lifetime maintained until a dielectric breakdown caused by copper diffusion can be increased, and furthermore, a method of manufacturing the semiconductor device. A first copper diffusion preventive film ( 8 ) is provided between a first copper wiring ( 7 ) and a second low permittivity interlayer insulating film ( 9 ). A silicon carbide film containing oxygen atoms or the oxygen atoms and nitrogen atoms in 30 atomic % or more is employed for the first copper diffusion preventive film ( 8 ). By employing such a silicon carbide film, a copper diffusion preventing function can be improved and a lifetime maintained until a dielectric breakdown caused by the copper diffusion can be increased.
A semiconductor device comprising: an interlayer insulating film; an electric conductor containing copper as a main component and having a surface containing copper; and a silicon carbide film, wherein said silicon carbide film is provided between said electric conductor and said interlayer insulation film and in direct contact with said surface containing copper of said electric conductor, and said silicon carbide film contains oxygen atoms and nitrogen atoms in a summed amount of 30 atomic % or more.
Claim 2
Dependent Claim
78 words
A semiconductor device comprising: an interlayer insulating film; an electric conductor containing copper as a main component and having a surface containing copper; and a silicon carbide film, wherein said silicon carbide film is provided between said electric conductor and said interlayer insulation film and in direct contact with said surface containing copper of said electric conductor, and said silicon carbide film contains oxygen atoms and nitrogen atoms in a summed amount of 30 atomic % or more.
Claim 3
Dependent Claim
21 words
The semiconductor device according to claim 1 , wherein said surface containing copper is an upper surface of said electric conductor.
Claim 4
Dependent Claim
21 words
The semiconductor device according to claim 1 , wherein said surface containing copper is a side surface of said electric conductor.
Claim 5
Dependent Claim
21 words
The semiconductor device according to claim 1 , wherein said surface containing copper is a lower surface of said electric conductor.
Claim 6
Dependent Claim
29 words
The semiconductor device according to claim 1 , wherein said silicon carbide film contains oxygen atoms and nitrogen atoms in a summed amount of 30 to 50 atomic %.
Claim 7
Dependent Claim
17 words
The semiconductor device according to claim 1 , wherein said silicon carbide film further contains hydrogen atoms.