High speed connector with matched impedance

Claim 1

An electrical connector comprising: a first housing member having a front face, a rear face and defining a plurality of parallel channels through the front and rear faces; a second housing member defining a plurality of parallel slots aligning with the parallel channels, the second housing member being attached to the first housing member; a plurality of conductive contacts attaching to one of opposite peripheral walls of each of the slots of the second housing member; and a plurality of printed substrates received in corresponding channels of the first housing member and corresponding slots of the second housing member, each printed substrate having a row of first conductive pads, a row of second conductive pads and a plurality of conductive traces connecting the first conductive pads to corresponding second conductive pads on a first surface the each printed substrate, the first and the second conductive pads being respectively located adjacent a first and a second perpendicular edges of the printed substrate, the first edges of the printed substrates being adjacent the front face of the first housing member and the second edges of the printed substrates being received in corresponding slots of the second housing member with the row of second conductive pads electrically connecting with corresponding conductive contacts, the first conductive pads each having a first section connecting to a corresponding conductive trace and a second section connecting with the corresponding conductive trace via the first section, the second section having a width which is formed to be slimmer than that of the first section, whereby an impedance of the corresponding conductive trace with the first and second conductive pads can controlled to meet a set value of an impedance of a system; wherein the conductive traces on the printed substrates are arranged in couples and between each two adjacent couples there is a metallic coating for grounding, the metallic coating blocking noise interference between each two adjacent couples of conductive traces; further comprising a plurality of grounding buses received in the slots, the grounding buses electrically connecting with the metallic coatings on the printed substrates; wherein the printed substrates each have a further metallic coating substantially covering a second opposite surface thereof, the further metallic coatings electrically connected to the grounding buses and the metallic coatings on the first surfaces of the printed substrates, respectively.