US6605551B2
Expired / Lapsed
US
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Electrocoating process to form a dielectric layer in an organic substrate to reduce loop inductance
Assignee: Intel Corp
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Filing: 2000-12-08
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Granted: 2003-08-12
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Expires: 2020-12-08
Abstract
Abstract Embodiments of the present invention include forming a thin, conformal, high-integrity dielectric coating between conductive layers in a via-in-via structure in an organic substrate, using an electrocoating process to reduce loop inductance between the conductive layers. The dielectric coating is formed using a high dielectric constant material such as an organic polymer or an organic polymer mixture. Embodiments of the present invention also include forming a thin, dielectric coating between conductive layers on a substantially planar substrate material and providing an embedded capacitor to reduce loop inductance.
Inventors
- 👤 Paul H. Wermer
- 👤 Brian Kaiser
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 17:19
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/115; H05K1/16; H05K1/162; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/0959; H05K2201/09654; H05K2201/09809; H05K2203/00; H05K2203/13; H05K2203/1333; H05K2203/135; H05K3/00; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4069; H05K3/42; H05K3/429
Claims Analysis
Total Claims: 32
Claim 1
Independent Claim
88 words
A method of forming a self-aligned through-via-in-via structure in an organic substrate material, comprising: forming a first conductive layer on the sidewall of a through-via in the organic substrate material; electrocoating an organic dielectric layer over the formed first conductive layer such that the formed dielectric layer leaves a portion of the through-via unfilled; and forming within the unfilled portion of the through-via a second conductive layer such that the dielectric layer provides a low loop inductance value between the first conductive layer and the second conductive layer.
Claim 2
Independent Claim
88 words
A method of forming a self-aligned through-via-in-via structure in an organic substrate material, comprising: forming a first conductive layer on the sidewall of a through-via in the organic substrate material; electrocoating an organic dielectric layer over the formed first conductive layer such that the formed dielectric layer leaves a portion of the through-via unfilled; and forming within the unfilled portion of the through-via a second conductive layer such that the dielectric layer provides a low loop inductance value between the first conductive layer and the second conductive layer.
Claim 3
Dependent Claim
21 words
The method of claim 1 , wherein forming the second conductive layer comprises leaving a remaining portion of the through-via unfilled.
Claim 4
Dependent Claim
20 words
The method of claim 2 , further comprising: filling the remaining unfilled portion of the through-via with a plugging material.
Claim 5
Dependent Claim
14 words
The method of claim 3 , wherein the plugging material is a silica-filled epoxy.
Claim 6
Dependent Claim
27 words
The method of claim 1 , wherein electrocoating the dielectric layer comprises: electrocoating a dielectric layer having a thickness equal to or less than about 30 microns.
Claim 7
Dependent Claim
39 words
The method of claim 1 , wherein electrocoating the dielectric layer comprises: electrocoating a dielectric layer that is free of pin holes and step coverage problems to prevent bridges or electrical shorts between the first and second conductive layers.
Claim 8
Dependent Claim
35 words
The method of claim 6 , wherein the dielectric layer is formed using high dielectric constant materials selected from the group consisting of organic polymers, and organic polymer mixtures such as epoxy, epoxy-acrylate, and polyimide.
Claim 9
Dependent Claim
51 words
The method of claim 7 , wherein the polymers and polymer mixtures are modified for properties selected from the group consisting of physical, mechanical, and chemical properties including but not limited to glass transition temperature, adhesive properties, dielectric constants, coefficient of thermal expansion, modulus, Poisson's ratio, etch resistance, and solvent resistance.
Claim 10
Dependent Claim
26 words
The method of claim 1 , wherein the first and second conductive layers are formed using electrically conductive materials such as copper, nickel, gold, and silver.
Claim 11
Dependent Claim
24 words
The method of claim 1 , wherein the first conductive layer is a ground plane, and the second conductive layer is a power plane.
Claim 12
Dependent Claim
15 words
The method of claim 1 , wherein the second conductive layer is a conductive polymer.
Claim 13
Dependent Claim
16 words
The method of claim 1 , wherein the organic substrate material comprises more than one layer.
Claim 14
Independent Claim
81 words
A method of forming an organic dielectric layer in a self-aligned through-via-in-via structure, comprising: forming a first electrode layer on the sidewall of a through-via in an organic substrate material; forming an organic dielectric layer over the first electrode layer such that the thickness of the formed organic dielectric layer is less than about 30 microns such that the dielectric layer leaves a portion of the through-via unfilled; and filling the unfilled portion of the through-via with a second electrode layer.
Claim 15
Independent Claim
81 words
A method of forming an organic dielectric layer in a self-aligned through-via-in-via structure, comprising: forming a first electrode layer on the sidewall of a through-via in an organic substrate material; forming an organic dielectric layer over the first electrode layer such that the thickness of the formed organic dielectric layer is less than about 30 microns such that the dielectric layer leaves a portion of the through-via unfilled; and filling the unfilled portion of the through-via with a second electrode layer.
Claim 16
Dependent Claim
46 words
The method of claim 13 , wherein forming an organic dielectric layer comprises electrocoating an organic dielectric layer over the first electrode layer that is free from pin holes and step coverage problems to prevent bridges or electrical shorts between the first and second electrode layers.
Claim 17
Dependent Claim
36 words
The method of claim 14 , wherein the organic dielectric layer is formed using high dielectric constant materials selected from the group consisting of organic polymers, and organic polymer mixtures such as epoxy, epoxy-acrylate, and polyimide.
Claim 18
Independent Claim
35 words
A method comprising: forming a first conductive layer on a multilayered organic substrate material; electrocoating an organic dielectric layer over the first conductive layer; and forming a second conductive layer over the organic dielectric layer.
Claim 19
Independent Claim
35 words
A method comprising: forming a first conductive layer on a multilayered organic substrate material; electrocoating an organic dielectric layer over the first conductive layer; and forming a second conductive layer over the organic dielectric layer.
Claim 20
Dependent Claim
36 words
The method of claim 16 , wherein electrocoating the organic dielectric layer comprises: electrocoating a dielectric layer that is free of pin holes to prevent bridges or electrical shorts between the first and second conductive layers.
Claim 21
Dependent Claim
32 words
The method of claim 17 , wherein the organic dielectric layer is formed using materials selected from the group consisting of organic polymers, and organic polymer mixtures having a high dielectric constant.
Claim 22
Independent Claim
60 words
A method, comprising: forming a first electrode layer, by forming a layer of conductive material over the sidewall of a through-via; electrocoating an organic dielectric layer over the first electrode layer such that a portion of the through-via is left unfilled; and forming a second electrode layer, by filling the remaining unfilled portion of the through-via by a conductive material.
Claim 23
Independent Claim
60 words
A method, comprising: forming a first electrode layer, by forming a layer of conductive material over the sidewall of a through-via; electrocoating an organic dielectric layer over the first electrode layer such that a portion of the through-via is left unfilled; and forming a second electrode layer, by filling the remaining unfilled portion of the through-via by a conductive material.
Claim 24
Dependent Claim
33 words
The method of claim 19 , wherein the organic dielectric layer is free from pin holes and step coverage problems to prevent bridges or electrical shorts between the first and second electrode layers.
Claim 25
Dependent Claim
38 words
The method of claim 20 , wherein the organic dielectric layer is formed from materials selected from the group consisting of organic polymers, and organic polymer mixtures having a high dielectric constant such as epoxy, epoxy-acrylate, and polyimide.
Claim 26
Independent Claim
47 words
A method comprising: forming a first conductive layer on the sidewall of a through-via in a substrate; electrocoating an organic dielectric layer over the first conductive layer, leaving a portion of the through-via unfilled; and forming within the unfilled portion of the through-via a second conductive layer.
Claim 27
Independent Claim
47 words
A method comprising: forming a first conductive layer on the sidewall of a through-via in a substrate; electrocoating an organic dielectric layer over the first conductive layer, leaving a portion of the through-via unfilled; and forming within the unfilled portion of the through-via a second conductive layer.
Claim 28
Dependent Claim
25 words
The method of claim 22 , further comprising: forming an outer layer over the first and second conductive layers and over the organic dielectric layer.
Claim 29
Dependent Claim
30 words
The method of claim 23 , further comprising: forming a first micro via within the outer layer, the first micro via being in electrical contact with the first conductive layer.
Claim 30
Dependent Claim
30 words
The method of claim 24 , further comprising: forming a second micro via within the outer layer, the second micro via being in electrical contact with the second conductive layer.
Claim 31
Dependent Claim
24 words
The method of claim 25 , further comprising: forming ground and power planes in electrical contact with the first and second micro vias, respectively.
Claim 32
Dependent Claim
20 words
The method of claim 26 , wherein the ground and power planes are formed on top of the outer layer.
References Cited (Backward Citations)
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