Electronic packaging device with insertable leads and method of manufacturing

Claim 2

An electronic device, comprising; a non-conducting base body having: at least one side wall, wherein a portion of said at least one side wall defines a plurality of lead channels in said side wall; a portion of the base body defining at least one recess disposed therein; at least one retention element disposed in at least one of said plurality of lead channels; at least one electronic component disposed in said at least one recess, said electronic component having a plurality of wire leads, at least one of said plurality of wire leads extending within at least one of said plurality of lead channels; a plurality of insertable lead terminals, each of said lead terminals received within a respective one of said plurality of lead channels, at least one of said lead terminals forming a conductive contact with said at least one of said plurality of wire leads; and wherein movement of said lead terminals within said plurality of lead channels is restricted by said retention element.

Claim 3

The electronic device of claim 1 , wherein each of the lead terminals comprises a clip region, said clip region forming a shape enabling said clip region to frictionally connect said lead terminal to the respective lead channel.

Claim 4

The electronic device of claim 2 , wherein the clip region is formed by a substantially U-shape bend in the lead terminal.

Claim 5

The electronic device of claim 2 , wherein at least one of the lead terminals secures at least one wire lead in the respective lead channel.

Claim 6

The electronic device of claim 1 , wherein each retention element comprises at least one projection, said projection reducing the cross-sectional area of the respective lead channel.

Claim 7

The electronic device of claim 1 , wherein the base body further defines at least one chamfered notch within said base body, said at least one chamfered notch forming a passage between an inner side of the at least one side wall and an outer side of said side wall, said chamfered notch being adapted to receive at least one of the wire leads.

Claim 8

The electronic device of claim 1 , wherein each of said plurality of lead channels is parallel to one another.

Claim 9

The electronic device of claim 1 , wherein said base body and said at least one electronic component are encapsulated in a non-conductive material.

Claim 10

The electronic device of claim 1 , wherein said base body is formed from a high temperature liquid crystal polymer.

Claim 11

An electronic device base member, comprising: a non-conducting base body having at least one side wall; a portion of the base body defining a recess disposed at least partly within the base body; said recess being adapted to receive an electrical component; a portion of the at least one side wall defining a plurality of lead channels disposed substantially on the at least one side wall, at least one of said lead channels being adapted to receive an insertable lead terminal; and at least one retention element, at least a portion of said at least one retention element being disposed within said at least one lead channel, said at least one retention element preventing said lead terminal from moving substantially in a first direction within said at least one lead channel when said lead terminal is received therein.

Claim 12

An electronic device base member, comprising: a non-conducting base body having at least one side wall; a portion of the base body defining a recess disposed at least partly within the base body; said recess being adapted to receive an electrical component; a portion of the at least one side wall defining a plurality of lead channels disposed substantially on the at least one side wall, at least one of said lead channels being adapted to receive an insertable lead terminal; and at least one retention element, at least a portion of said at least one retention element being disposed within said at least one lead channel, said at least one retention element preventing said lead terminal from moving substantially in a first direction within said at least one lead channel when said lead terminal is received therein.

Claim 13

The base member of claim 10 , wherein said at least one retention element comprises at least one projection, said projection reducing the cross-sectional area of the respective lead channel.

Claim 14

The base member of claim 10 , wherein said base body comprises a generally rectangular box-like form.

Claim 15

The base member of claim 10 , further defining at least one chamfered notch disposed within said base member, said at least one chamfered notch forming a passage between an inner side of one of the side walls and an outer side of said side wall, wherein said chamfered notch is adapted to receive at least one of wire lead of the electrical component.

Claim 16

The base member of claim 13 , wherein said base member is chamfered on a bottom surface of the chamfered notch.

Claim 17

An electronic device, comprising: a non-conducting base body having: at least one side wall; a portion of the base body defining at least one recess disposed at least partly within the base body; a portion of the at least one side wall defining a plurality of lead channels formed in at least a portion of the side wall; at least one retention element disposed in said plurality of lead channels comprising at least one projection, said projection reducing the cross-sectional area of the respective lead channel; a portion of the at least one side wall defining at least one chamfered notch providing a passage between an inner side of the side wall and an outer side of the side wall, at least one electronic component disposed in said at least one recess, said electronic component having a plurality of wire leads, at least one of said plurality of wire leads extending within at least one of said plurality of lead channels and through at least one of said plurality of chamfered notches; and a plurality of insertable lead terminals received within respective ones of said plurality of lead channels, wherein each of the lead terminals comprises a clip region with substantially a U-shape, said U-shape shape enabling said clip region to frictionally connect said lead terminal to the respective lead channel at least one of said lead terminals forming a conductive contact with said at least one of said plurality of wire leads, wherein at least one of said lead terminals secures at least one wire lead in the respective lead channel; wherein the movement of said lead terminals within said plurality of lead channels is restricted by said retention elements.

Claim 18

An electronic device, comprising: a non-conducting base body having: at least one side wall; a portion of the base body defining at least one recess disposed at least partly within the base body; a portion of the at least one side wall defining a plurality of lead channels formed in at least a portion of the side wall; at least one retention element disposed in said plurality of lead channels comprising at least one projection, said projection reducing the cross-sectional area of the respective lead channel; a portion of the at least one side wall defining at least one chamfered notch providing a passage between an inner side of the side wall and an outer side of the side wall, at least one electronic component disposed in said at least one recess, said electronic component having a plurality of wire leads, at least one of said plurality of wire leads extending within at least one of said plurality of lead channels and through at least one of said plurality of chamfered notches; and a plurality of insertable lead terminals received within respective ones of said plurality of lead channels, wherein each of the lead terminals comprises a clip region with substantially a U-shape, said U-shape shape enabling said clip region to frictionally connect said lead terminal to the respective lead channel at least one of said lead terminals forming a conductive contact with said at least one of said plurality of wire leads, wherein at least one of said lead terminals secures at least one wire lead in the respective lead channel; wherein the movement of said lead terminals within said plurality of lead channels is restricted by said retention elements.

Claim 19

An electronic device, comprising: a non-conducting base body having: at least one side wall; a portion of the base body defining at least one recess disposed at least partly within the base body; a portion of the at least one side wall defining a plurality of lead channels formed in the side wall; at least one electronic component disposed in said at least one recess, said electronic component having a plurality of wire leads, at least one of said plurality of wire leads extending within at least one of said plurality of lead channels; a plurality of insertable lead terminals received within respective ones of said plurality of lead channels, means for communicating the lead wire from an inner side of the at least one side wall and an outer side of the side wall; and means for securing the lead terminals within the lead channels, other than molding said lead terminals into said base body.

Claim 20

An electronic device, comprising: a non-conducting base body having: at least one side wall; a portion of the base body defining at least one recess disposed at least partly within the base body; a portion of the at least one side wall defining a plurality of lead channels formed in the side wall; at least one electronic component disposed in said at least one recess, said electronic component having a plurality of wire leads, at least one of said plurality of wire leads extending within at least one of said plurality of lead channels; a plurality of insertable lead terminals received within respective ones of said plurality of lead channels, means for communicating the lead wire from an inner side of the at least one side wall and an outer side of the side wall; and means for securing the lead terminals within the lead channels, other than molding said lead terminals into said base body.