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US6593198B2 Expired / Lapsed US ⏱️ 0.0 years remaining

Semiconductor device and method for fabricating the same

Assignee: Pannova Semic LLC
•
Filing: 2001-09-18
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Granted: 2003-07-15
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Expires: 2021-09-18
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Abstract

Abstract Gate insulating film, gate electrode made up of lower and upper gate electrodes, and on-gate passivation film are formed in this order on an Si substrate. Then, a sidewall is formed as a stack of an oxynitride sidewall having an L-shaped cross section and a nitride sidewall, so as to surround the gate electrode and on-gate passivation film. Alternatively, only the lower edge of an L-oxide sidewall may be changed into an oxynitride region. Or an oxide or stacked sidewall and a nitride sidewall, covering the oxide or stacked sidewall, may be formed instead of the oxynitride sidewall. In any of these embodiments, the lower edge of the sidewall is not removed during a wet etching process.

Inventors

  • 👤 Mizuki Segawa

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-28 19:22
CPC Classifications
H; H10; H10D; H10D64/00; H10D64/60; H10D64/66; H10D64/671; H10D64/01; H10D64/013; H10D64/01302; H10D64/01354; H10D84/00; H10D84/01; H10D84/0123; H10D84/0126; H10D84/0147; H10D84/02; H10D84/03; H10D84/038

Claims Analysis

Total Claims: 16
Claim 1
Independent Claim 95 words
A semiconductor device comprising: a substrate having a semiconductor layer therein; a gate insulating film formed on the semiconductor layer; a gate electrode formed on the gate insulating film; an L-shaped sidewall formed at least over respective sides of the gate electrode; a nitride sidewall formed on the L-shaped side wall; source/drain regions formed respectively in the semiconductor layer so as to be arranged on a side of the L-shaped sidewall; and a silicide layer formed on the source/drain regions, wherein at least a lower edge of the L-shaped sidewall is made of an oxynitride.
Claim 2
Dependent Claim 95 words
A semiconductor device comprising: a substrate having a semiconductor layer therein; a gate insulating film formed on the semiconductor layer; a gate electrode formed on the gate insulating film; an L-shaped sidewall formed at least over respective sides of the gate electrode; a nitride sidewall formed on the L-shaped side wall; source/drain regions formed respectively in the semiconductor layer so as to be arranged on a side of the L-shaped sidewall; and a silicide layer formed on the source/drain regions, wherein at least a lower edge of the L-shaped sidewall is made of an oxynitride.
Claim 3
Dependent Claim 17 words
The device of claim 1 , wherein the L-shaped sidewall is entirely made of the oxynitride film.
Claim 4
Dependent Claim 99 words
A semiconductor device comprising: a substrate having a semiconductor layer therein; a gate insulating film famed on the semiconductor layer; a gate electrode formed on the gate insulating film; an insulator sidewall formed over the sides of the gate electrode a first nitride sidewall, which has been formed on the sides of the insulator sidewall, a lower edge of the nitride sidewall being in contact with the semiconductor layer; source/drain regions formed respectively in the semiconductor layer so as to be arranged on a side of the first nitride sidewall; and a silicide layer formed on the source/drain regions.
Claim 5
Dependent Claim 99 words
A semiconductor device comprising: a substrate having a semiconductor layer therein; a gate insulating film famed on the semiconductor layer; a gate electrode formed on the gate insulating film; an insulator sidewall formed over the sides of the gate electrode a first nitride sidewall, which has been formed on the sides of the insulator sidewall, a lower edge of the nitride sidewall being in contact with the semiconductor layer; source/drain regions formed respectively in the semiconductor layer so as to be arranged on a side of the first nitride sidewall; and a silicide layer formed on the source/drain regions.
Claim 6
Dependent Claim 30 words
The device of claim 3 , wherein the first nitride sidewall is made of a silicon nitride containing silicon at a mole fraction exceeding a mole fraction defined by stoichiometry.
Claim 7
Dependent Claim 47 words
The device of claim 3 , wherein the insulator sidewall is made up of an L-shaped oxide sidewall formed on the sides of the gate electrode and a second nitride sidewall formed on the oxide sidewall, the first nitride sidewall being formed on the second nitride sidewall.
Claim 8
Dependent Claim 28 words
The device of claim 1 , wherein the L-shaped sidewall is made of a silicon dioxide film, and the oxynitride is formed by nitriding the silicon dioxide film.
Claim 9
Dependent Claim 27 words
The device of claim 1 , wherein the gate electrode is made up of lower gate electrode of polysilicon film and upper gate electrode of metal film.
Claim 10
Dependent Claim 17 words
The device of claim 7 , wherein on-gate insulating film is farmed on the upper gate electrode.
Claim 11
Dependent Claim 27 words
The device of claim 1 , wherein the gate electrode is made up of lower gate electrode of polysilicon film and upper gate electrode of suicide film.
Claim 12
Dependent Claim 36 words
The device of claim 1 , wherein the suicide layer is formed substantially nowhere but outside of the lower edge of a stacked sidewall which is a stack of the L-shaped sidewall and the nitride sidewall.
Claim 13
Dependent Claim 42 words
The device of claim 1 , wherein an LDD region is provided in parts of the semiconductor layer below the gate electrode to sandwich the gate electrode therebetween so as to be in contact with an inner side of the source/drain regions.
Claim 14
Dependent Claim 18 words
The device of claim 3 , wherein the insulator sidewall is an oxide sidewall of silicon dioxide film.
Claim 15
Dependent Claim 18 words
The device of claim 4 , wherein the insulator sidewall is an oxide sidewall of silicon dioxide film.
Claim 16
Dependent Claim 45 words
The device of claim 4 , wherein the insulator sidewall consists of an L-shaped oxide sidewall formed over the sides of the gate electrode and second nitride sidewall formed on the oxide sidewall, and the first nitride sidewall is formed on the second nitride sidewall.

References Cited (Backward Citations)

JPH11345963A Cited
US6429083B1 Cited
US6432805B1 Cited
US6417056B1 Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2006-07-14 2007-01-13 2007-07-15 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2010-07-14 2011-01-13 2011-07-15 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2014-07-14 2015-01-13 2015-07-15 $7700.00 Window Closed / Lapsed

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