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US6575770B2 Expired / Lapsed US ⏱️ 0.0 years remaining

Optoelectronic module apparatus and method of assembly

Assignee: Broadcom International Pte Ltd
•
Filing: 2001-08-01
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Granted: 2003-06-10
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Expires: 2021-08-01
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Abstract

Abstract An optoelectronic module including a skeleton structure, a platform portion, and a vertical portion is provided. The skeleton structure has a socket portion and the vertical portion extends from the socket portion to a transverse back plate. The platform portion has a first array of recesses arranged to receive a plurality of pins extending from a first circuit board disposed on the optoelectronic module.

Inventors

  • 👤 Kevin Michael Birch
  • 👤 Peter Charles Gibson

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 13:38
CPC Classifications
G; G02; G02B; G02B6/00; G02B6/24; G02B6/42; G02B6/4201; G02B6/4246; G02B6/4256; G02B6/4257; G02B6/4274; G02B6/4277; G02B6/428; G02B6/4281; G02B6/4283; G02B6/426; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/4913; Y10T29/49139; Y10T29/49204; Y10T29/49208

Claims Analysis

Total Claims: 14
Claim 1
Independent Claim 59 words
An optoelectronic module comprising: a skeleton structure having a socket portion; a platform portion; and a vertical portion, said vertical portion extending from said socket portion to a transverse back plate, wherein said platform portion comprises a first array of recesses arranged to receive a plurality of pins extending from a first circuit board disposed on the optoelectronic module.
Claim 2
Dependent Claim 59 words
An optoelectronic module comprising: a skeleton structure having a socket portion; a platform portion; and a vertical portion, said vertical portion extending from said socket portion to a transverse back plate, wherein said platform portion comprises a first array of recesses arranged to receive a plurality of pins extending from a first circuit board disposed on the optoelectronic module.
Claim 3
Dependent Claim 26 words
The optoelectronic module as claim 1 , wherein said platform portion, said vertical portion, and said transverse back plate are integrally formed on said skeleton structure.
Claim 4
Dependent Claim 19 words
The optoelectronic module as in claim 2 , wherein said first circuit board abuts against said transverse back plate.
Claim 5
Dependent Claim 20 words
The optoelectronic module as in claim 3 , wherein said first circuit board has disposed thereon a first optoelectronic sub-assembly.
Claim 6
Dependent Claim 59 words
The optoelectronic module as in claim 4 , further comprising an optical centerline associated with said first optoelectronic sub-assembly and a centerline associated with said pins, wherein said first optoelectronic sub-assembly is disposed relative to said first circuit board so that said centerline of said pins and said optical centerline are maintained at a predetermined distance from one another.
Claim 7
Dependent Claim 16 words
The optoelectronic module as in claim 5 , wherein said predetermined distance is about 1.33 mm.
Claim 8
Dependent Claim 42 words
The optoelectronic module as in claim 6 , wherein said first array of recesses is disposed so as to align said first circuit board relative to said first optical sub-assembly when said plurality of pins pass through said first array of recesses.
Claim 9
Dependent Claim 37 words
The optoelectronic module as in claim 2 , wherein said platform portion further comprises a second array of recesses arranged to receive a plurality of pins extending from a second circuit board disposed on the optoelectronic module.
Claim 10
Dependent Claim 19 words
The optoelectronic module as in claim 8 , wherein said second circuit board abuts against said transverse back plate.
Claim 11
Dependent Claim 20 words
The optoelectronic module as in claim 9 , wherein said second circuit board has disposed thereon a second optoelectronic sub-assembly.
Claim 12
Independent Claim 127 words
A method of assembling an optoelectronic module comprising a skeleton structure having a socket portion, a platform portion, and a vertical portion, said vertical portion extending from said socket portion to a transverse back plate, wherein said platform portion comprises a first array of recesses arranged to receive a plurality of pins extending from a first circuit board disposed on the optoelectronic module, the method comprising: attaching a first optoelectronic sub-assembly to said first circuit board; and inserting from a substantially horizontal direction said first circuit board onto said platform portion by passing said plurality of pins into said first array of recesses so that said plurality of pins are disposed substantially perpendicular to said platform portion and said first circuit board abuts said transverse back plate.
Claim 13
Independent Claim 127 words
A method of assembling an optoelectronic module comprising a skeleton structure having a socket portion, a platform portion, and a vertical portion, said vertical portion extending from said socket portion to a transverse back plate, wherein said platform portion comprises a first array of recesses arranged to receive a plurality of pins extending from a first circuit board disposed on the optoelectronic module, the method comprising: attaching a first optoelectronic sub-assembly to said first circuit board; and inserting from a substantially horizontal direction said first circuit board onto said platform portion by passing said plurality of pins into said first array of recesses so that said plurality of pins are disposed substantially perpendicular to said platform portion and said first circuit board abuts said transverse back plate.
Claim 14
Dependent Claim 100 words
The method as in claim 11 , wherein said platform portion further comprises a second array of recesses arranged to receive a plurality of pins extending from a second circuit board disposed on said module, said method further comprising: attaching a second optoelectronic sub-assembly to said second circuit board; and inserting from a substantially horizontal direction said second circuit board onto said platform portion by passing said plurality of pins into said second array of recesses so that said plurality of pins are disposed substantially perpendicular to said platform portion and said second circuit board abuts said transverse back plate.

References Cited (Backward Citations)

US6369924B1 Cited
US6381283B1 Cited
US6213651B1 Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2006-06-09 2006-12-09 2007-06-10 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2010-06-09 2010-12-09 2011-06-10 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2014-06-09 2014-12-09 2015-06-10 $7700.00 Window Closed / Lapsed

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