US6573567B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
IC card
Assignee: NEC Electronics Corp
•
Filing: 2000-10-13
•
Granted: 2003-06-03
•
Expires: 2020-10-13
Abstract
Abstract An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip ( 2 ) is mounted on a card substrate ( 1 ), and plural connection terminals ( 3 ) are exposed. The connection terminals are connected to predetermined external terminals ( 4 ) of the semiconductor integrated circuit chip, first overvoltage protection elements ( 7, 8, 9 ) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors ( 11 ) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements. The varistors have been selected by taking into consideration a relationship between the characteristics and the ability of the first overvoltage protection elements contained in the semiconductor integrated circuit chip, and exhibit the effect for preventing the electrostatic damage.
Inventors
- 👤 Hirotaka Nishizawa
- 👤 Yosuke Yukawa
- 👤 Takashi Totsuka
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 10:39
CPC Classifications
G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/0772; G06K19/07735; G06K19/073; G06K19/07732; H; H10; H10D; H10D89/00; H10D89/60; H10D89/601; H10W; H10W42/00; H10W42/60; H10W42/80; H10W70/00; H10W70/60; H10W70/611; H10W70/699; H10W90/00; H10W72/00; H10W72/071; H10W72/075; H10W72/50; H10W72/541; H10W72/547; H10W72/5473; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W72/932; H10W72/951; H10W72/952; H10W74/00; H10W90/20; H10W90/24; H10W90/701; H10W90/731; H10W90/732; H10W90/734; H10W90/751; H10W90/752; H10W90/754; Y; Y10; Y10S; Y10S257/00; Y10S257/922
Claims Analysis
Total Claims: 38
Claim 1
Independent Claim
94 words
An IC card having a semiconductor integrated circuit chip mounted on a card substrate and having plural connection terminals that are exposed, wherein the connection terminals are connected to predetermined external terminals of the semiconductor integrated circuit chip, first overvoltage protection elements connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements connected to the connection terminals are mounted on the card substrate, the second overvoltage protection elements being variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements.
Claim 2
Dependent Claim
94 words
An IC card having a semiconductor integrated circuit chip mounted on a card substrate and having plural connection terminals that are exposed, wherein the connection terminals are connected to predetermined external terminals of the semiconductor integrated circuit chip, first overvoltage protection elements connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements connected to the connection terminals are mounted on the card substrate, the second overvoltage protection elements being variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements.
Claim 3
Dependent Claim
23 words
An IC card according to claim 1 wherein said second overvoltage protection elements are varistors of the surface-mounting type comprising chiefly semiconductor ceramics.
Claim 4
Dependent Claim
60 words
An IC card according to claim 1 , wherein the semiconductor chip is a controller chip, one or plural nonvolatile memory chips connected to the controller chip are mounted on the card substrate, and the controller chip has a memory control function for controlling the reading/writing operation for the nonvolatile memory chip according to an instruction from an external unit.
Claim 5
Dependent Claim
49 words
An IC card according to claim 3 , wherein the controller chip has a privacy protection function that executes encryption for the data that are to be written into the nonvolatile memory chips and executes the decryption for the data that are read out from the nonvolatile memory chips.
Claim 6
Dependent Claim
115 words
An IC card having a semiconductor integrated circuit chip mounted on a card substrate and having plural connection terminals that are exposed, wherein the connection terminals are connected to predetermined external terminals of the semiconductor integrated circuit chip, first overvoltage protection elements connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements connected to the connection terminals are mounted on the card substrate, and wherein a voltage greater than a rated voltage applied to the second overvoltage protection elements for flowing a specified pulse current, is the voltage that enables the first overvoltage protection elements to flow only a current smaller than the above specified pulse current.
Claim 7
Dependent Claim
115 words
An IC card having a semiconductor integrated circuit chip mounted on a card substrate and having plural connection terminals that are exposed, wherein the connection terminals are connected to predetermined external terminals of the semiconductor integrated circuit chip, first overvoltage protection elements connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements connected to the connection terminals are mounted on the card substrate, and wherein a voltage greater than a rated voltage applied to the second overvoltage protection elements for flowing a specified pulse current, is the voltage that enables the first overvoltage protection elements to flow only a current smaller than the above specified pulse current.
Claim 8
Dependent Claim
93 words
An IC card having a semiconductor integrated circuit chip mounted on a card substrate and having plural connection terminals that are exposed, wherein the connection terminals are connected to predetermined external terminals of the semiconductor integrated circuit chip, first overvoltage protection elements connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements connected to the connection terminals are mounted on the card substrate, the second overvoltage protection elements being variable resistor elements having a breakdown voltage greater than that of the first overvoltage protection elements.
Claim 9
Dependent Claim
93 words
An IC card having a semiconductor integrated circuit chip mounted on a card substrate and having plural connection terminals that are exposed, wherein the connection terminals are connected to predetermined external terminals of the semiconductor integrated circuit chip, first overvoltage protection elements connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements connected to the connection terminals are mounted on the card substrate, the second overvoltage protection elements being variable resistor elements having a breakdown voltage greater than that of the first overvoltage protection elements.
Claim 10
Dependent Claim
88 words
An IC card having a semiconductor integrated circuit chip mounted on a card substrate and having plural connection terminals that are exposed, wherein the connection terminals are connected to predetermined external terminals of the semiconductor integrated circuit chip, first overvoltage protection elements connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements connected to the connection terminals are mounted on the card substrate, the second overvoltage protection elements having a capacity greater than that of the first overvoltage protection elements.
Claim 11
Dependent Claim
88 words
An IC card having a semiconductor integrated circuit chip mounted on a card substrate and having plural connection terminals that are exposed, wherein the connection terminals are connected to predetermined external terminals of the semiconductor integrated circuit chip, first overvoltage protection elements connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements connected to the connection terminals are mounted on the card substrate, the second overvoltage protection elements having a capacity greater than that of the first overvoltage protection elements.
Claim 12
Dependent Claim
89 words
An IC card having a semiconductor integrated circuit chip mounted on a card substrate and having plural connection terminals that are exposed, wherein the connection terminals are connected to predetermined external terminals of the semiconductor integrated circuit chip, first overvoltage protection elements connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements connected to the connection terminals are mounted on the card substrate, the second overvoltage protection elements having a breakdown voltage smaller than that of the first overvoltage protection elements.
Claim 13
Dependent Claim
89 words
An IC card having a semiconductor integrated circuit chip mounted on a card substrate and having plural connection terminals that are exposed, wherein the connection terminals are connected to predetermined external terminals of the semiconductor integrated circuit chip, first overvoltage protection elements connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements connected to the connection terminals are mounted on the card substrate, the second overvoltage protection elements having a breakdown voltage smaller than that of the first overvoltage protection elements.
Claim 14
Dependent Claim
93 words
An IC card having a semiconductor integrated circuit chip mounted on a card substrate and having plural connection terminals that are exposed, wherein the connection terminals are connected to predetermined external terminals of the semiconductor integrated circuit chip, first overvoltage protection elements connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements connected to the connection terminals are mounted on the card substrate, the second overvoltage protection elements having a breakdown voltage smaller than that of a circuit protected by the first overvoltage protection elements.
Claim 15
Dependent Claim
93 words
An IC card having a semiconductor integrated circuit chip mounted on a card substrate and having plural connection terminals that are exposed, wherein the connection terminals are connected to predetermined external terminals of the semiconductor integrated circuit chip, first overvoltage protection elements connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements connected to the connection terminals are mounted on the card substrate, the second overvoltage protection elements having a breakdown voltage smaller than that of a circuit protected by the first overvoltage protection elements.
Claim 16
Dependent Claim
152 words
An IC card having a semiconductor integrated circuit chip mounted on a card substrate and having power source connection terminals and signal connection terminals that are exposed, wherein the power source connection terminals and the signal connection terminals are connected to predetermined external terminals of the semiconductor integrated circuit chip, first overvoltage protection elements connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements connected at the ends on one side thereof to the power source connection terminals and connected at the ends on the other side thereof to the signal connection terminals, are mounted on the card substrate, and wherein the signal propagation distances from the signal connection terminals to the corresponding other ends of the second overvoltage protection elements are shorter than the signal propagation distances from the signal connection terminals to the corresponding external terminals of the semiconductor integrated circuit chip.
Claim 17
Dependent Claim
152 words
An IC card having a semiconductor integrated circuit chip mounted on a card substrate and having power source connection terminals and signal connection terminals that are exposed, wherein the power source connection terminals and the signal connection terminals are connected to predetermined external terminals of the semiconductor integrated circuit chip, first overvoltage protection elements connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements connected at the ends on one side thereof to the power source connection terminals and connected at the ends on the other side thereof to the signal connection terminals, are mounted on the card substrate, and wherein the signal propagation distances from the signal connection terminals to the corresponding other ends of the second overvoltage protection elements are shorter than the signal propagation distances from the signal connection terminals to the corresponding external terminals of the semiconductor integrated circuit chip.
Claim 18
Dependent Claim
92 words
An IC card having a semiconductor integrated circuit chip-mounted on a card substrate and having plural connection terminals that are exposed, wherein the connection terminals are connected to predetermined external terminals of the semiconductor integrated circuit chip, first overvoltage protection elements connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements connected to the connection terminals are mounted on the card substrate, the second overvoltage protection elements being surface-mounted on the electrically conducting pattern formed on the card substrate so as to be connected.
Claim 19
Dependent Claim
92 words
An IC card having a semiconductor integrated circuit chip-mounted on a card substrate and having plural connection terminals that are exposed, wherein the connection terminals are connected to predetermined external terminals of the semiconductor integrated circuit chip, first overvoltage protection elements connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements connected to the connection terminals are mounted on the card substrate, the second overvoltage protection elements being surface-mounted on the electrically conducting pattern formed on the card substrate so as to be connected.
Claim 20
Dependent Claim
91 words
An IC card according to claim 11 , wherein the semiconductor chip is a controller chip, one or plural nonvolatile memory chips connected to the controller chip are mounted on the card substrate, the controller chip has a memory control function for controlling the reading/writing operation for the nonvolatile memory chip according to an instruction from an external unit, the connection terminals are connected to the external terminals of the controller chip through the bonding wires, and the controller chip and the nonvolatile memory chips are connected through the bonding wires.
Claim 21
Dependent Claim
83 words
An IC card having plural memory chip and a controller chip for controlling the memory chips that are mounted on one surface of a card substrate, wherein the surface area on one surface of the card substrate is larger than the total areas of the memory chips and the controller chip, and the memory chips are mounted on the card substrate in a manner of being stacked in a plural number with their positions being so deviated that the external terminals are exposed.
Claim 22
Dependent Claim
83 words
An IC card having plural memory chip and a controller chip for controlling the memory chips that are mounted on one surface of a card substrate, wherein the surface area on one surface of the card substrate is larger than the total areas of the memory chips and the controller chip, and the memory chips are mounted on the card substrate in a manner of being stacked in a plural number with their positions being so deviated that the external terminals are exposed.
Claim 23
Dependent Claim
84 words
An IC card having plural memory chips and a controller chip for controlling the memory chips that are mounted on one surface of a card substrate, wherein the memory chips are mounted on the card substrate in a manner of being stacked in a plural number with their positions being so deviated that the external terminals are exposed, and the external terminals of the memory chips that receive the same signals from the controller chip are successively connected in series through the bonding wires.
Claim 24
Dependent Claim
84 words
An IC card having plural memory chips and a controller chip for controlling the memory chips that are mounted on one surface of a card substrate, wherein the memory chips are mounted on the card substrate in a manner of being stacked in a plural number with their positions being so deviated that the external terminals are exposed, and the external terminals of the memory chips that receive the same signals from the controller chip are successively connected in series through the bonding wires.
Claim 25
Dependent Claim
99 words
An IC card having plural memory chips and a controller chip for controlling the memory chips that are mounted on one surface of a card substrate, wherein the memory chips are mounted on the card substrate in a manner of being stacked in a plural number with their positions being so deviated that the external terminals are exposed, and the external terminals for receiving chip selection signals of the memory chips are located at the ends of the array of the external terminals of the memory chips and are separately connected to the controller chip through the bonding wires.
Claim 26
Dependent Claim
99 words
An IC card having plural memory chips and a controller chip for controlling the memory chips that are mounted on one surface of a card substrate, wherein the memory chips are mounted on the card substrate in a manner of being stacked in a plural number with their positions being so deviated that the external terminals are exposed, and the external terminals for receiving chip selection signals of the memory chips are located at the ends of the array of the external terminals of the memory chips and are separately connected to the controller chip through the bonding wires.
Claim 27
Dependent Claim
124 words
An IC card having plural memory chips and a controller chip for controlling the memory chips that are mounted on a card substrate and having plural connection terminals that are exposed, wherein: the memory chips, are connected to the controller chip; the connection terminals are connected to predetermined external terminals of the controller chip; first overvoltage protection elements connected to the external terminals are integrated in the controller chip; second overvoltage protection elements connected to the connection terminals are mounted on the card substrate and distances from the connection terminals are increased in order of the second overvoltage protection elements, the controller chip and the plural memory chips which are arranged like columns from one side toward the opposing side of the card substrate.
Claim 28
Dependent Claim
124 words
An IC card having plural memory chips and a controller chip for controlling the memory chips that are mounted on a card substrate and having plural connection terminals that are exposed, wherein: the memory chips, are connected to the controller chip; the connection terminals are connected to predetermined external terminals of the controller chip; first overvoltage protection elements connected to the external terminals are integrated in the controller chip; second overvoltage protection elements connected to the connection terminals are mounted on the card substrate and distances from the connection terminals are increased in order of the second overvoltage protection elements, the controller chip and the plural memory chips which are arranged like columns from one side toward the opposing side of the card substrate.
Claim 29
Dependent Claim
36 words
An IC card according to claim 16 , wherein said memory chips are mounted on the card substrate in a manner of being stacked with their positions being so deviated that the external terminals are exposed.
Claim 30
Dependent Claim
133 words
An IC card having plural memory chips and a controller chip for controlling the memory chips that are mounted on a card substrate and having plural connection terminals that are exposed, wherein: the plural connection terminals are arranged along one side between the neighboring two sides of the card substrate; a memory controller is arranged with its lengthwise direction in parallel with the other side of the neighboring two sides; the plural memory chips are arranged in parallel in a direction nearly at right angles with the direction in which the connection terminals are arranged; the connection terminals are connected to predetermined external terminals of the controller chip; first overvoltage protection elements connected to the external terminals are integrated on the controller chip; and the memory chips are connected to the controller chip.
Claim 31
Dependent Claim
133 words
An IC card having plural memory chips and a controller chip for controlling the memory chips that are mounted on a card substrate and having plural connection terminals that are exposed, wherein: the plural connection terminals are arranged along one side between the neighboring two sides of the card substrate; a memory controller is arranged with its lengthwise direction in parallel with the other side of the neighboring two sides; the plural memory chips are arranged in parallel in a direction nearly at right angles with the direction in which the connection terminals are arranged; the connection terminals are connected to predetermined external terminals of the controller chip; first overvoltage protection elements connected to the external terminals are integrated on the controller chip; and the memory chips are connected to the controller chip.
Claim 32
Dependent Claim
35 words
An IC card according to claim 18 , wherein the second overvoltage protection elements connected to the connection terminals are mounted on the card substrate along the direction in which the connection terminals are arranged.
Claim 33
Dependent Claim
57 words
An IC card according to claim 18 , wherein the memory chips are arranged in parallel being divided into a first group in which the memory chips are stacked in a plural number with their positions being so deviated that the external terminals are exposed, and a second group in which the memory chips are similarly stacked.
Claim 34
Dependent Claim
94 words
An IC card wherein plural connection terminals are formed on one surface of a card substrate, the connection terminals are connected to an electrically conducting pattern on the other surface of the card substrate via through holes, and the external connection terminals of a semiconductor integrated circuit chip are connected to the electrically conducting pattern, the semiconductor integrated circuit being mounted on the other surface of the card substrate, and the through holes being arranged outside the molding region that covers the semiconductor integrated circuit chip and the other surface of the card substrate.
Claim 35
Dependent Claim
94 words
An IC card wherein plural connection terminals are formed on one surface of a card substrate, the connection terminals are connected to an electrically conducting pattern on the other surface of the card substrate via through holes, and the external connection terminals of a semiconductor integrated circuit chip are connected to the electrically conducting pattern, the semiconductor integrated circuit being mounted on the other surface of the card substrate, and the through holes being arranged outside the molding region that covers the semiconductor integrated circuit chip and the other surface of the card substrate.
Claim 36
Dependent Claim
25 words
An IC card according to claim 21 , wherein the through holes are formed at deviated positions in the slide surfaces of the connection terminals.
Claim 37
Dependent Claim
108 words
An IC card having plural connection terminals formed on one surface of a card substrate and having a semiconductor integrated circuit chip mounted on the other surface of the card substrate, wherein the connection terminals are connected to predetermined external terminals of the semiconductor integrated circuit chip, first overvoltage protection elements connected to the external terminals are integrated in the semiconductor integrated circuit chip, second overvoltage protection elements connected to the connection terminals are mounted on the other surface of the card substrate, and the semiconductor integrated circuit chip, the second overvoltage protection elements and the other surface of the card substrate are covered with a metal cap.
Claim 38
Dependent Claim
108 words
An IC card having plural connection terminals formed on one surface of a card substrate and having a semiconductor integrated circuit chip mounted on the other surface of the card substrate, wherein the connection terminals are connected to predetermined external terminals of the semiconductor integrated circuit chip, first overvoltage protection elements connected to the external terminals are integrated in the semiconductor integrated circuit chip, second overvoltage protection elements connected to the connection terminals are mounted on the other surface of the card substrate, and the semiconductor integrated circuit chip, the second overvoltage protection elements and the other surface of the card substrate are covered with a metal cap.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-06-02 | 2006-12-02 | 2007-06-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-06-02 | 2010-12-02 | 2011-06-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-06-02 | 2014-12-02 | 2015-06-03 | $7700.00 | Window Closed / Lapsed |