US6569767B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device and its production process
Assignee: Sharp Corp
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Filing: 2000-10-27
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Granted: 2003-05-27
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Expires: 2020-10-27
Abstract
Abstract A process for producing a semiconductor device comprising the steps of: forming a metal wiring layer containing copper as the main component on a semiconductor substrate; forming an insulating film on the entire surface of the resulting semiconductor substrate; removing the insulating film only from a place where a wire of gold or aluminum is to be bonded, in order to expose a part of the metal wiring layer; forming a layer of copper silicide or a layer of a compound of copper and boron in a surface layer of the exposed part of the metal wiring layer; and bonding a wire to a surface of the layer of copper silicide or the layer of the compound of copper and boron.
Inventors
- 👤 Kazunori Fujisawa
- 👤 Nobuyoshi Awaya
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 22:46
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/064; H10W20/066; H10W72/00; H10W72/071; H10W20/40; H10W20/41; H10W20/44; H10W20/4403; H10W20/4421; H10W72/01; H10W72/019; H10W72/50; H10W72/531; H10W72/536; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/59; H10W72/90; H10W72/921; H10W72/923; H10W72/951; H10W72/952; H10W72/981; H10W72/983
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
156 words
A process for producing a semiconductor device comprising: forming a metal wiring layer containing copper as the main component on a semiconductor substrate; forming an insulating film on the entire surface of the resulting semiconductor substrate; removing the insulating film only from a place where a wire of gold or aluminum is to be bonded, in order to expose a part of the metal wiring layer; forming a layer of copper silicide or a layer of a compound of copper and boron in a surface layer of the exposed part of the metal wiring layer; and bonding the wire of gold or aluminum directly to a surface of the layer of copper silicide or the layer of the compound of copper and boron, wherein said bonding is carried out without depositing any conductive layer between gold or aluminum of the wire and the surface of the layer of copper silicide or compound of copper and boron.
Claim 2
Dependent Claim
156 words
A process for producing a semiconductor device comprising: forming a metal wiring layer containing copper as the main component on a semiconductor substrate; forming an insulating film on the entire surface of the resulting semiconductor substrate; removing the insulating film only from a place where a wire of gold or aluminum is to be bonded, in order to expose a part of the metal wiring layer; forming a layer of copper silicide or a layer of a compound of copper and boron in a surface layer of the exposed part of the metal wiring layer; and bonding the wire of gold or aluminum directly to a surface of the layer of copper silicide or the layer of the compound of copper and boron, wherein said bonding is carried out without depositing any conductive layer between gold or aluminum of the wire and the surface of the layer of copper silicide or compound of copper and boron.
Claim 3
Dependent Claim
45 words
A process according,to claim 1 , wherein the layer of copper silicide or the layer of the compound of copper and boron formed on the surface of the metal wiring layer containing copper as the main component has a thickness of 10 to 100 nm.
Claim 4
Dependent Claim
31 words
A process according to claim 1 , wherein the layer of copper silicide or the layer of the compound of copper and boron has a resistivity of 2.5 to 5 μΩcm.
Claim 5
Dependent Claim
30 words
A process of producing a semiconductor device according to claim 1 , wherein the metal wiring layer is selected from layers of copper, a copper-silver alloy and a copper-zirconium alloy.
Claim 6
Dependent Claim
143 words
A process for producing a semiconductor device comprising: forming a metal wiring layer containing copper as the main component on a semiconductor substrate; forming an insulating film on the entire surface of the resulting semiconductor substrate; removing the insulating film only from a place where a wire of gold or aluminum is to be bonded, in order to expose a part of the metal wiring layer; forming a layer of copper silicide or a layer of a compound of copper and boron in a surface layer of the exposed part of the metal wiring layer; bonding a wire directly to a surface of the layer of copper silicide or the layer of the compound of copper and boron; and wherein the layer of the compound of copper and boron is formed by reacting diborane with the copper contained in the metal wiring layer.
Claim 7
Dependent Claim
143 words
A process for producing a semiconductor device comprising: forming a metal wiring layer containing copper as the main component on a semiconductor substrate; forming an insulating film on the entire surface of the resulting semiconductor substrate; removing the insulating film only from a place where a wire of gold or aluminum is to be bonded, in order to expose a part of the metal wiring layer; forming a layer of copper silicide or a layer of a compound of copper and boron in a surface layer of the exposed part of the metal wiring layer; bonding a wire directly to a surface of the layer of copper silicide or the layer of the compound of copper and boron; and wherein the layer of the compound of copper and boron is formed by reacting diborane with the copper contained in the metal wiring layer.
Claim 8
Dependent Claim
104 words
A process for producing a semiconductor device, the process comprising: forming a conductive layer comprising copper on a semiconductor substrate; forming an insulating film on the semiconductor substrate over the conductive layer comprising copper; removing the insulating film from a place where a wire comprising gold or aluminum is to be bonded, in order to expose a part of the conductive layer comprising copper; forming a layer comprising a compound of copper and boron in a surface of the exposed part of the conductive layer comprising copper; and bonding a wire to a surface of the layer comprising the compound of copper and boron.
Claim 9
Dependent Claim
104 words
A process for producing a semiconductor device, the process comprising: forming a conductive layer comprising copper on a semiconductor substrate; forming an insulating film on the semiconductor substrate over the conductive layer comprising copper; removing the insulating film from a place where a wire comprising gold or aluminum is to be bonded, in order to expose a part of the conductive layer comprising copper; forming a layer comprising a compound of copper and boron in a surface of the exposed part of the conductive layer comprising copper; and bonding a wire to a surface of the layer comprising the compound of copper and boron.
Claim 10
Dependent Claim
127 words
A process for producing a semiconductor device, the process comprising: forming a conductive layer comprising copper on a semiconductor substrate; forming an insulating film on the semiconductor substrate over the conductive layer comprising copper; removing the insulating film from a place where a wire is to be bonded, in order to expose a part of the conductive layer comprising copper; forming a layer comprising copper silicide or a compound of copper and boron in a surface of the exposed part of the conductive layer comprising copper; and bonding a wire directly to a surface of the layer comprising the copper silicide or the compound of copper and boron in a manner such that the wire is not bonded directly to any insulating film provided on the substrate.
Claim 11
Dependent Claim
127 words
A process for producing a semiconductor device, the process comprising: forming a conductive layer comprising copper on a semiconductor substrate; forming an insulating film on the semiconductor substrate over the conductive layer comprising copper; removing the insulating film from a place where a wire is to be bonded, in order to expose a part of the conductive layer comprising copper; forming a layer comprising copper silicide or a compound of copper and boron in a surface of the exposed part of the conductive layer comprising copper; and bonding a wire directly to a surface of the layer comprising the copper silicide or the compound of copper and boron in a manner such that the wire is not bonded directly to any insulating film provided on the substrate.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-05-26 | 2006-11-25 | 2007-05-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-05-26 | 2010-11-25 | 2011-05-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-05-26 | 2014-11-25 | 2015-05-27 | $7700.00 | Window Closed / Lapsed |