US6524886B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making leadless semiconductor package
Assignee: Advanced Semiconductor Engineering Inc
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Filing: 2001-05-24
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Granted: 2003-02-25
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Expires: 2021-05-24
Abstract
Abstract A method of making a leadless semiconductor package mainly comprising the steps of: attaching a tape onto the bottom of a lead frame; attaching a semiconductor chip to the die pad of the lead frame and electrically coupling the semiconductor chip to the leads of the lead frame; forming a package body over the semiconductor chip and the lead frame in a manner that each lead of the lead frame has at least a portion exposed from the bottom of the package body; removing the tape; and grinding the bottom of the package body as well as the exposed portions of the lead frame till each lead of the lead frame is less than about 1 mil thick thereby reducing the problems due to CTE mismatch between the leads and the package body.
Inventors
- 👤 Shih Chang Lee
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:24
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/019; H10W74/10; H10W74/111; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
117 words
A method of making a leadless semiconductor package, said method comprising the steps of: providing a lead frame including a die pad and a plurality of leads; attaching a semiconductor chip to the die pad of the lead frame; electrically coupling the semiconductor chip to the leads of the lead frame; forming a package body over the semiconductor chip and the lead frame in a manner that each lead of the lead frame has at least a portion exposed from the bottom of the package body; and grinding the bottom of the package body as well as the exposed portions of the lead frame till the entire lead frame is less than about 1 mil in thickness.
Claim 2
Independent Claim
117 words
A method of making a leadless semiconductor package, said method comprising the steps of: providing a lead frame including a die pad and a plurality of leads; attaching a semiconductor chip to the die pad of the lead frame; electrically coupling the semiconductor chip to the leads of the lead frame; forming a package body over the semiconductor chip and the lead frame in a manner that each lead of the lead frame has at least a portion exposed from the bottom of the package body; and grinding the bottom of the package body as well as the exposed portions of the lead frame till the entire lead frame is less than about 1 mil in thickness.
Claim 3
Dependent Claim
20 words
The method as claimed in claim 1 , wherein the grinding step is accomplished by a Chemical Mechanical Polishing technique.
Claim 4
Dependent Claim
25 words
The method as claimed in claim 1 , wherein the backside surface of the die pad is exposed from the bottom of the package body.
Claim 5
Dependent Claim
37 words
The method as claimed in claim 1 , further comprising the step of attaching a tape onto the lead frame before the chip attaching step, and the step of removing the tape after forming the package body.
Claim 6
Dependent Claim
20 words
The method as claimed in claim 4 , wherein the grinding step is accomplished by a Chemical Mechanical Polishing technique.
Claim 7
Dependent Claim
25 words
The method as claimed in claim 4 , wherein the backside surface of the die pad is exposed from the bottom surface of the package.
Claim 8
Independent Claim
119 words
A method of making a leadless semiconductor package, said method comprising the steps of: providing a lead frame including a die pad and a plurality of leads; attaching a semiconductor chip to the die pad of the lead frame; electrically coupling the semiconductor chip to the leads of the lead frame; forming a package body over the semiconductor chip and the lead frame in a manner that each lead of the lead frame has at least a portion exposed from the bottom of the package body; and grinding the bottom of the package body as well as the exposed portions of the lead frame till each said lead, in its entirety, is less than about 1 mil in thickness.
Claim 9
Independent Claim
119 words
A method of making a leadless semiconductor package, said method comprising the steps of: providing a lead frame including a die pad and a plurality of leads; attaching a semiconductor chip to the die pad of the lead frame; electrically coupling the semiconductor chip to the leads of the lead frame; forming a package body over the semiconductor chip and the lead frame in a manner that each lead of the lead frame has at least a portion exposed from the bottom of the package body; and grinding the bottom of the package body as well as the exposed portions of the lead frame till each said lead, in its entirety, is less than about 1 mil in thickness.
Claim 10
Dependent Claim
20 words
The method as claimed in claim 7 , wherein the grinding step is accomplished by a Chemical Mechanical Polishing technique.
Claim 11
Dependent Claim
25 words
The method as claimed in claim 7 , wherein the backside surface of the die pad is exposed from the bottom of the package body.
Claim 12
Dependent Claim
34 words
The method as claimed in claim 7 , further comprising the steps of attaching a tape onto the lead frame before the chip attaching step, and removing the tape after forming the package body.
Claim 13
Dependent Claim
20 words
The method as claimed in claim 10 , wherein the grinding step is accomplished by a Chemical Mechanical Polishing technique.
Claim 14
Dependent Claim
25 words
The method as claimed in claim 10 , wherein the backside surface of the die pad is exposed from the bottom surface of the package.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-02-24 | 2006-08-26 | 2007-02-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-02-24 | 2010-08-26 | 2011-02-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-02-24 | 2014-08-26 | 2015-02-25 | $7700.00 | Window Closed / Lapsed |