US6468879B1 — Method and device for separating a plate of mater…

Claim 1

Independent Claim 126 words

A method of separating into two wafers a plate of material for manufacturing substrates for electronics, optics, or optoelectronics, or for manufacturing microsystems, said wafers being situated on either side of a plane of weakness, the method comprising the steps of: exerting a deformation force by applying suction to at least one of the wafers in a region extending from close to an edge of the plate to a center thereof in a zone situated between at least two thrust points that are rigidly secured to each other so as to deform said at least one wafer and thereby cause the wafers to separate from each other in a zone of the plate at said plane of weakness; and exerting guided separation movement on the wafers.

Claim 2

Independent Claim 126 words

A method of separating into two wafers a plate of material for manufacturing substrates for electronics, optics, or optoelectronics, or for manufacturing microsystems, said wafers being situated on either side of a plane of weakness, the method comprising the steps of: exerting a deformation force by applying suction to at least one of the wafers in a region extending from close to an edge of the plate to a center thereof in a zone situated between at least two thrust points that are rigidly secured to each other so as to deform said at least one wafer and thereby cause the wafers to separate from each other in a zone of the plate at said plane of weakness; and exerting guided separation movement on the wafers.

Claim 3

Dependent Claim 30 words

The method according to claim 1 , wherein the region within which said suction is applied to exert the deformation force is a radially asymmetrical region relative to said plate.

Claim 4

Dependent Claim 33 words

The method according to claim 1 , wherein said separation movement is obtained by moving means for applying said suction in a direction that extends generally transversely to the plane of the plate.

Claim 5

Dependent Claim 25 words

The method according to claim 1 , wherein said separation movement is obtained by moving at least one of the wafers in translation without rotation.

Claim 6

Dependent Claim 26 words

The method according to claim 1 , wherein said separation movement is obtained by moving at least one of the wafers in translation accompanied by rotation.

Claim 7

Dependent Claim 23 words

The method according to claim 1 , further comprising the step of releasing at least one of the wafers by eliminating the suction.

Claim 8

Dependent Claim 37 words

The method according to claim 1 , wherein said step of exerting a deformation force is implemented simultaneously with cleavage treatment on the plane of weakness and/or with a step of applying stress suitable for favoring separation.

Claim 9

Dependent Claim 41 words

The method according to claim 7 , wherein said application of stress is taken from the group consisting of applying a temperature gradient, applying mechanical vibration, applying chemical etching, applying shear stress, and applying a flow of fluid at high speed.

Claim 10

Independent Claim 139 words

An apparatus for separating a plate of material, in particular of semiconductor material, into first and second wafers, said wafers being situated on either side of a plane of weakness, the apparatus comprising: means for holding said plate via said first wafer; stress-applying means for exerting deformation stress on at least said second wafer by applying a suction force in a zone of the plate situated between at least two bearing points that are rigidly secured to each other, said zone extending from close to an edge of the plate to a center thereof, said deformation stress creating a localized separation between said wafers within a centralized portion of said zone at said plane of weakness; and means for moving the wafers apart from each other along a predetermined path, said localized separation propagating along said plane of weakness.

Claim 11

Independent Claim 139 words

An apparatus for separating a plate of material, in particular of semiconductor material, into first and second wafers, said wafers being situated on either side of a plane of weakness, the apparatus comprising: means for holding said plate via said first wafer; stress-applying means for exerting deformation stress on at least said second wafer by applying a suction force in a zone of the plate situated between at least two bearing points that are rigidly secured to each other, said zone extending from close to an edge of the plate to a center thereof, said deformation stress creating a localized separation between said wafers within a centralized portion of said zone at said plane of weakness; and means for moving the wafers apart from each other along a predetermined path, said localized separation propagating along said plane of weakness.

Claim 12

Dependent Claim 24 words

The apparatus according to claim 9 , wherein said stress-applying means and said moving means are constituted by the same a first gripping member.

Claim 13

Dependent Claim 14 words

The apparatus according to claim 10 , wherein said gripping member possesses suction means.

Claim 14

Dependent Claim 28 words

The apparatus according to claim 11 , wherein the gripping member includes a generally planer element whose face directed towards said wafer possesses at least one suction cavity.

Claim 15

Dependent Claim 51 words

The apparatus according to claim 12 , wherein a single suction cavity is provided that is generally elongate in shape and that is suitable for extending between an edge region of the plate and a central region of the plate, said single suction cavity being radially asymmetrical relative to said plate.

Claim 16

Dependent Claim 25 words

The apparatus according to claim 12 , wherein the suction cavity deforms the plate to give the plate a convex shape around an elongate cap.

Claim 17

Dependent Claim 24 words

The apparatus according to claim 12 , wherein the holding means includes a second gripping member extending substantially parallel to said first gripping member.

Claim 18

Dependent Claim 19 words

The apparatus according to claim 15 , further comprising guide means on which the first gripping member is mounted.

Claim 19

Dependent Claim 23 words

The apparatus according to claim 15 , further comprising means for resiliently urging the first gripping member away from the second gripping member.

Claim 20

Dependent Claim 36 words

The apparatus according to claim 17 , further comprising manual actuator means for urging the first gripping member against said resilient urging means so as to move said first and second gripping members towards each other.

Claim 21

Dependent Claim 22 words

The apparatus according to claim 17 , wherein said guide means and the resilient urging means are constituted by a common member.

Claim 22

Dependent Claim 20 words

The apparatus according to claim 19 , wherein said common member is a single-piece link member constituting a deformable parallelogram.

Claim 23

Dependent Claim 15 words

The apparatus according to claim 12 , further comprising means for selectively eliminating the suction.

Claim 24

Independent Claim 150 words

A method of separating a plate of material for manufacturing substrates for electronic microsystems into two wafers, said wafers being situated on either side of a plane of weakness, the method comprising the steps of: exerting a deformation force by applying suction to at least one of the wafers in a region extending from close to one edge of the plate to a center thereof, a perimeter of said region defined by a plurality of wafer-surface-contacting points that are rigidly secured to each other; exerting guided separation movement on the wafers; and at least one of said deformation force and said separation movement creating a localized separation between said wafers within a central portion of said region and at said plane of weakness, said localized separation initiating, in response to said separation movement, a separation wave propagating over an entire extent of said plane of weakness to separate said wafers.

Claim 25

Independent Claim 150 words

A method of separating a plate of material for manufacturing substrates for electronic microsystems into two wafers, said wafers being situated on either side of a plane of weakness, the method comprising the steps of: exerting a deformation force by applying suction to at least one of the wafers in a region extending from close to one edge of the plate to a center thereof, a perimeter of said region defined by a plurality of wafer-surface-contacting points that are rigidly secured to each other; exerting guided separation movement on the wafers; and at least one of said deformation force and said separation movement creating a localized separation between said wafers within a central portion of said region and at said plane of weakness, said localized separation initiating, in response to said separation movement, a separation wave propagating over an entire extent of said plane of weakness to separate said wafers.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	2005-10-21	2006-04-22	2006-10-22	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	2009-10-21	2010-04-22	2010-10-22	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2013-10-21	2014-04-22	2014-10-22	$7700.00	Window Closed / Lapsed

Method and device for separating a plate of material, in particular semiconductor material, into two wafers

Abstract

Inventors

Bibliographic Details

Claims Analysis

References Cited (Backward Citations)

USPTO Annuity & Maintenance Windows

Assigned Categories & Tags

Assign Category Tag