US6462405B1
Expired / Lapsed
US
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Semiconductor package
Assignee: Siliconware Precision Industries Co Ltd
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Filing: 2001-07-18
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Granted: 2002-10-08
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Expires: 2021-07-18
Abstract
Abstract A semiconductor package is proposed, in which a lid is attached to a semiconductor chip and appropriately spaced apart from a heat sink having a top surface thereof exposed to the outside an encapsulant, so as to prevent external moisture from condensing on the semiconductor chip and reduce a thermal stress effect on the semiconductor chip. Moreover, a thermal conductive path is reduced in a portion passing through the encapsulant, allowing the heat-dissipating efficiency to be improved. In addition, with no contact between the heat sink and the semiconductor chip, quality of the semiconductor package is assured with no damage to the semiconductor chip.
Inventors
- 👤 Cheng-Yuan Lai
- 👤 Chien-Ping Huang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 21:10
CPC Classifications
H; H10; H10W; H10W42/00; H10W42/121; H10W40/00; H10W40/20; H10W40/25; H10W40/253; H10W40/70; H10W40/77; H10W40/778; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W76/00; H10W76/40; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/877; H10W72/884; H10W74/15; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734; H10W90/736; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
172 words
A semiconductor package, comprising: a substrate having a first surface and a second surface; a semiconductor chip having a first surface and a second surface, wherein the second surface of the semiconductor chip is attached to the first surface of the substrate; a plurality of first conductive members for electrically connecting the substrate to the semiconductor chip; a lid attached to the first surface of the semiconductor chip and having a coefficient of thermal expansion similar to that of the semiconductor chip; a heat sink mounted on the substrate and having a first surface and a second surface, wherein a gap is formed between the second surface of the heat sink and the lid; an encapsulant for encapsulating the semiconductor chip, the first conductive members, the lid and the heat sink, wherein the first surface of the heat sink is exposed to the outside of the encapsulant; and a plurality of second conductive members disposed on the second surface of the substrate for electrically connecting the semiconductor chip to an external device.
Claim 2
Dependent Claim
172 words
A semiconductor package, comprising: a substrate having a first surface and a second surface; a semiconductor chip having a first surface and a second surface, wherein the second surface of the semiconductor chip is attached to the first surface of the substrate; a plurality of first conductive members for electrically connecting the substrate to the semiconductor chip; a lid attached to the first surface of the semiconductor chip and having a coefficient of thermal expansion similar to that of the semiconductor chip; a heat sink mounted on the substrate and having a first surface and a second surface, wherein a gap is formed between the second surface of the heat sink and the lid; an encapsulant for encapsulating the semiconductor chip, the first conductive members, the lid and the heat sink, wherein the first surface of the heat sink is exposed to the outside of the encapsulant; and a plurality of second conductive members disposed on the second surface of the substrate for electrically connecting the semiconductor chip to an external device.
Claim 3
Dependent Claim
28 words
The semiconductor package according to claim 1 , wherein the gap is preferably from 0.03 mm to 0.45 mm, and more preferably from 0.05 mm to 0.30 mm.
Claim 4
Dependent Claim
18 words
The semiconductor package according to claim 1 , wherein the lid is made of a thermally conductive material.
Claim 5
Dependent Claim
17 words
The semiconductor package according to claim 1 , wherein the lid is made of a semiconductor material.
Claim 6
Dependent Claim
30 words
The semiconductor package according to claim 1 , wherein the lid is made of a metallic material having a coefficient of thermal expansion similar to that of the semiconductor chip.
Claim 7
Dependent Claim
24 words
The semiconductor package according to claim 1 , wherein the lid is attached to the semiconductor chip by means of a thermally conductive adhesive.
Claim 8
Dependent Claim
16 words
The semiconductor package according to claim 1 , wherein the first conductive members are gold wires.
Claim 9
Dependent Claim
16 words
The semiconductor package according to claim 1 , wherein the second conductive members are solder balls.
Claim 10
Dependent Claim
24 words
The semiconductor package according to claim 1 , wherein a plurality of flow channels are formed on the lid along a resin flow direction.
Claim 11
Dependent Claim
17 words
The semiconductor package according to claim 9 , wherein the flow channels are grooves formed on lid.
Claim 12
Dependent Claim
20 words
The semiconductor package according to claim 9 , wherein the flow channels are constructed by protrusions formed on the lid.
Claim 13
Dependent Claim
35 words
The semiconductor package according to claim 11 , wherein a plurality of flow channels are formed along a resin flow direction on the second surface of the heat sink at positions opposing the semiconductor chip.
Claim 14
Dependent Claim
23 words
The semiconductor package according to claim 12 , wherein the flow channels are grooves formed on the second surface of the heat sink.
Claim 15
Dependent Claim
25 words
The semiconductor package according to claim 12 , wherein the flow channels are constructed by protrusions formed on the second surface of the heat sink.
Claim 16
Dependent Claim
158 words
A semiconductor package, comprising: a substrate having a first surface and a second surface; a semiconductor chip having a first surface and a second surface, wherein the first surface of the semiconductor chip is electrically connected to the first surface of the substrate in a flip chip manner; a lid attached to the second surface of the semiconductor chip and having a coefficient of thermal expansion similar to that of the semiconductor chip; a heat sink mounted on the substrate and having a first surface and a second surface, wherein a gap is formed between the second surface of the heat sink and the lid; an encapsulant for encapsulating the semiconductor chip, the lid and the heat sink, wherein the first surface of the heat sink is exposed to the outside of the encapsulant; and a plurality of conductive members disposed on the second surface of the substrate for electrically connecting the semiconductor chip to an external device.
Claim 17
Dependent Claim
158 words
A semiconductor package, comprising: a substrate having a first surface and a second surface; a semiconductor chip having a first surface and a second surface, wherein the first surface of the semiconductor chip is electrically connected to the first surface of the substrate in a flip chip manner; a lid attached to the second surface of the semiconductor chip and having a coefficient of thermal expansion similar to that of the semiconductor chip; a heat sink mounted on the substrate and having a first surface and a second surface, wherein a gap is formed between the second surface of the heat sink and the lid; an encapsulant for encapsulating the semiconductor chip, the lid and the heat sink, wherein the first surface of the heat sink is exposed to the outside of the encapsulant; and a plurality of conductive members disposed on the second surface of the substrate for electrically connecting the semiconductor chip to an external device.
Claim 18
Dependent Claim
23 words
The semiconductor package according to claim 15 , wherein the semiconductor chip is electrically connected to the substrate by means of solder bumps.
Claim 19
Dependent Claim
28 words
The semiconductor package according to claim 15 , wherein the gap is preferably from 0.03 mm to 0.45 mm, and more preferably from 0.05 mm to 0.30 mm.
Claim 20
Dependent Claim
18 words
The semiconductor package according to claim 15 , wherein the lid is made of a thermal conductive material.
Claim 21
Dependent Claim
17 words
The semiconductor package according to claim 15 , wherein the lid is made of a semiconductor material.
Claim 22
Dependent Claim
30 words
The semiconductor package according to claim 15 , where the lid is made of a metallic material having a coefficient of thermal expansion similar to that of the semiconductor chip.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-10-07 | 2006-04-08 | 2006-10-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-10-07 | 2010-04-08 | 2010-10-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-10-07 | 2014-04-08 | 2014-10-08 | $7700.00 | Window Closed / Lapsed |