US6440773B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device
Assignee: Hitachi Ltd
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Filing: 1997-12-22
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Granted: 2002-08-27
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Expires: 2017-12-22
Abstract
Abstract An IC card strong against bending and with a thin semiconductor chip mounted thereon is disclosed which is further provided with a reinforcing plate to reduce damage of the semiconductor chip caused by a point pressure. The IC card is employable even under a mechanically severe environment and is thus highly reliable.
Inventors
- 👤 Mitsuo Usami
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 18:55
CPC Classifications
G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/0772; G06K19/07728; G06K19/07749; H; H10; H10W; H10W70/00; H10W70/60; H10W70/699; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W74/00; H10W74/10; H10W74/15
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
113 words
A method for manufacturing card-like semiconductor devices, comprising the steps of: providing a semiconductor wafer having a plurality of ICs formed thereon; removing the back side of the semiconductor wafer to thin the wafer into a thickness of 0.1 to 110 μm; affixing a metallic plate as a reinforcing plate to the back of the thus-thinned semiconductor wafer to reduce a local stress of each of the ICs; cutting the semiconductor wafer into a plurality of IC chips with the metallic plate affixed thereto to form a plurality of laminates each comprised of a piece of the metallic plate and one of the IC chips; and mounting the laminate onto a card-like substrate.
Claim 2
Independent Claim
113 words
A method for manufacturing card-like semiconductor devices, comprising the steps of: providing a semiconductor wafer having a plurality of ICs formed thereon; removing the back side of the semiconductor wafer to thin the wafer into a thickness of 0.1 to 110 μm; affixing a metallic plate as a reinforcing plate to the back of the thus-thinned semiconductor wafer to reduce a local stress of each of the ICs; cutting the semiconductor wafer into a plurality of IC chips with the metallic plate affixed thereto to form a plurality of laminates each comprised of a piece of the metallic plate and one of the IC chips; and mounting the laminate onto a card-like substrate.
Claim 3
Dependent Claim
63 words
A method for manufacturing card-like semiconductor devices according to claim 1 , further comprising the steps of forming a projection-like bump on a connecting terminal portion of said one of said IC chips, coating the projection-like bump with a plastic resin, and exposing the projection-like bump by deleting the plastic resin by ashing, wherein said IC chip is face-down-bonded to said card-like substrate.
Claim 4
Dependent Claim
29 words
A method for manufacturing card-like semiconductor devices according to claim 1 , wherein said semiconductor wafer with the metallic plate affixed thereto is cut by using a laser beam.
Claim 5
Dependent Claim
25 words
A method for manufacturing card-like semiconductor devices according to claim 1 , wherein said semiconductor wafer with metallic plate affixed thereto is cut by dicing.
Claim 6
Dependent Claim
36 words
A method for manufacturing card-like semiconductor devices according to claim 1 , wherein the thickness of said metallic plate is nearly the same as that of said semiconductor wafer which is made into a thin film.
Claim 7
Dependent Claim
23 words
A method for manufacturing card-like semiconductor devices according to claim 1 , wherein said metallic plate is made of tungsten or stainless steel.
Claim 8
Independent Claim
147 words
A method for manufacturing card-like semiconductor devices, comprising the steps of: providing a semiconductor wafer with a plurality of ICs formed thereon; removing the back side of the semiconductor wafer to thin the wafer into a thickness of 0.1 to 110 μm; cutting the semiconductor wafer to form a plurality of IC chips; providing a plurality of thin substrates with a conductive pattern formed thereon; opposing each of the cut IC chips to a corresponding one of the thin substrates and connecting an external terminal formed on one side of each of the IC chips to the conductive pattern of the corresponding one of the thin substrates; attaching a reinforcing plate for reducing a local stress imposed on each IC chip to an opposite side of each IC chip; and forming cover sheets so as to sandwich therebetween each IC chip with the reinforcing plate attached thereto.
Claim 9
Independent Claim
147 words
A method for manufacturing card-like semiconductor devices, comprising the steps of: providing a semiconductor wafer with a plurality of ICs formed thereon; removing the back side of the semiconductor wafer to thin the wafer into a thickness of 0.1 to 110 μm; cutting the semiconductor wafer to form a plurality of IC chips; providing a plurality of thin substrates with a conductive pattern formed thereon; opposing each of the cut IC chips to a corresponding one of the thin substrates and connecting an external terminal formed on one side of each of the IC chips to the conductive pattern of the corresponding one of the thin substrates; attaching a reinforcing plate for reducing a local stress imposed on each IC chip to an opposite side of each IC chip; and forming cover sheets so as to sandwich therebetween each IC chip with the reinforcing plate attached thereto.
Claim 10
Dependent Claim
24 words
A method for manufacturing card-like semiconductor devices according to claim 7 , wherein each IC chip and reinforcing plate are bonded to each other.
Claim 11
Dependent Claim
27 words
A method for manufacturing card-like semiconductor devices according to claim 7 , wherein each IC chip and reinforcing plate are affixed together using a bubble separation film.
Claim 12
Dependent Claim
65 words
A method for manufacturing card-like semiconductor devices according to claim 7 , further comprising the steps of forming a projection-like bump on a connecting terminal portion of each IC chip, coating the projection-like bump with a plastic resin, and exposing the projection-like bump by deleting the plastic resin by ashing, wherein said external terminal of each IC chip is connected by using a conductive adhesive.
Claim 13
Dependent Claim
26 words
A method for manufacturing card-like semiconductor devices according to claim 7 , wherein said each card-like semiconductor device has a spacer disposed around the IC chip.
Claim 14
Dependent Claim
30 words
A method for manufacturing card-like semiconductor devices according to claim 7 , wherein each said card-like semiconductor device has other reinforcing plates disposed so as to sandwich the IC chip.
Claim 15
Dependent Claim
24 words
A method for manufacturing card-like semiconductor devices according to claim 7 , wherein each said card-like semiconductor device includes a plurality of IC chips.
Claim 16
Dependent Claim
26 words
A method for manufacturing card-like semiconductor devices according to claim 7 , wherein each said IC chip is nearly the same size as said reinforcing plate.
Claim 17
Dependent Claim
28 words
A method for manufacturing card-like semiconductor devices according to claim 7 , wherein the reinforcing plate is formed of material higher in Young's modulus than the cover sheet.
Claim 18
Dependent Claim
26 words
A method for manufacturing card-like semiconductor devices according to claim 7 , wherein each said card-like semiconductor device has a spacer disposed around the reinforcing plate.
Claim 19
Dependent Claim
24 words
A method for manufacturing card-like semiconductor devices according to claim 7 , wherein each said card-like semiconductor device is a noncontact type IC card.
Claim 20
Dependent Claim
24 words
A method for manufacturing card-like semiconductor devices according to claim 7 , wherein each said card-like semiconductor device is a contact type IC card.
Claim 21
Dependent Claim
24 words
A method for manufacturing card-like semiconductor devices according to claim 7 , wherein each IC chip includes a high-frequency circuit and a memory section.
Claim 22
Dependent Claim
20 words
A method for manufacturing card-like semiconductor devices according to claim 7 , wherein the reinforcing plate has a shading characteristic.
Claim 23
Dependent Claim
22 words
A method for manufacturing card-like semiconductor devices according to claim 7 , wherein each IC chip includes a once-write type memory section.
Claim 24
Dependent Claim
22 words
A method for manufacturing card-like semiconductor devices according to claim 7 , wherein each said card-like semiconductor device includes a magnetic tape.
Claim 25
Dependent Claim
36 words
A method for manufacturing card-like semiconductor devices according to claim 7 , wherein the thickness of said metallic plate is nearly the same as that of said semiconductor wafer which is made into a thin film.
Claim 26
Dependent Claim
23 words
A method for manufacturing card-like semiconductor devices according to claim 7 , wherein said metallic plate is made of tungsten or stainless steel.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-08-26 | 2006-02-25 | 2006-08-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-08-26 | 2010-02-25 | 2010-08-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-08-26 | 2014-02-25 | 2014-08-27 | $7700.00 | Window Closed / Lapsed |