US6406636B1
Expired / Lapsed
US
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Methods for wafer to wafer bonding using microstructures
Assignee: APPLIED PHOTONIC PRODUCTS Inc
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Filing: 1999-06-02
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Granted: 2002-06-18
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Expires: 2019-06-02
Abstract
Abstract Wafer-to-wafer bonding using, e.g., solder metal bonding, glass bonding or polymer (adhesive) bonding is improved by profiling one or both of the wafer surfaces being bonded to define microstructures therein. Profiling means providing other than the conventional planar bonding surface to define cavities therein. The bonding material fills the cavities in the microstructures. For instance, a system of ridges and trenches (e.g. in cross-section vertical, slanted, key-holed shaped, or diamond-shaped) are microstructures that increase the surface area of the wafers to which the bonding material can adhere. Use of the key-hole shaped or diamond-shaped profile having a negative slope at the trench interior substantially increases the bonding force. Where electrical leads feed through a bond, the seal to the bond at that point is improved by either using lengthened feedthroughs which extend the length of a substantial portion of the bond or by use of doped (diffused) conductive wafer regions rather than metallized feedthroughs. In some cases the bonded surfaces include spacers which define a precisely defined distance between the two wafers, thus providing an exactly specified thickness of the bonding material. In some cases the edges of the bonded assembly are sealed by a sealant which extends through narrow capillary spaces between the two bonded wafers, thus hermetically sealing together the two wafers.
Inventors
- 👤 Vladimir I. Vaganov
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 16:53
CPC Classifications
B; B23; B23K; B23K1/00; B23K1/0008; B23K1/0016; C; C04; C04B; C04B37/00; C04B37/003; C04B37/005; B81; B81C; B81C1/00; B81C1/00015; B81C1/00261; B81C1/00269; C04B37/006; C04B37/008; G; G02; G02B; G02B6/00; G02B6/10; G02B6/12; H; H10; H10P; H10P90/00; H10P90/19; H10P90/1904; H10P90/1906; H10P90/1914; H10W; H10W76/00; H10W76/60; B23K2101/00; B23K2101/36; B23K2101/40; B29; B29C; B29C65/00; B29C65/48; B29C65/52; B29C66/00; B29C66/01; B29C66/05; B29C66/303; B29C66/3032; B29C66/30325; B81C2203/00; B81C2203/01; B81C2203/0172; B81C2203/019; C04B2237/00; C04B2237/02; C04B2237/04; C04B2237/08; C04B2237/10; C04B2237/12; C04B2237/30; C04B2237/32; C04B2237/40; C04B2237/50; C04B2237/64; C04B2237/72; H10W72/00; H10W72/01; H10W72/0198; H10W72/071; H10W72/073; H10W72/07331; H10W72/07336; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/90; H10W72/931; H10W76/63; H10W90/00; H10W90/701; H10W90/731; H10W90/732
Claims Analysis
Total Claims: 75
Claim 1
Independent Claim
104 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the bonding comprises the act of depositing the bonding material on the principal surface of at least one of the substrates; and patterning the deposited bonding material prior to the bonding.
Claim 2
Independent Claim
104 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the bonding comprises the act of depositing the bonding material on the principal surface of at least one of the substrates; and patterning the deposited bonding material prior to the bonding.
Claim 3
Dependent Claim
28 words
The method of claim 1 , further comprising the act of etching at least a portion of the principal surface of the second substrate prior to the bonding.
Claim 4
Dependent Claim
17 words
The method of claim 1 , wherein the bonding includes the act of processing the bonding material.
Claim 5
Dependent Claim
24 words
The method of claim 1 , further comprising the act of aligning the first and second substrate one to another prior to the bonding.
Claim 6
Independent Claim
89 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; and further comprising the act of reducing a thickness of one of the substrates after the bonding.
Claim 7
Independent Claim
89 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; and further comprising the act of reducing a thickness of one of the substrates after the bonding.
Claim 8
Independent Claim
90 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; and further comprising the act of sealing at least a portion of the first and second substrates together.
Claim 9
Independent Claim
90 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; and further comprising the act of sealing at least a portion of the first and second substrates together.
Claim 10
Independent Claim
91 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the etching includes a combination of micromachining and depositing masking layers on side walls of the microstructure.
Claim 11
Independent Claim
91 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the etching includes a combination of micromachining and depositing masking layers on side walls of the microstructure.
Claim 12
Dependent Claim
39 words
The method of claim 7 , wherein the micromachining is selected from the group consisting of anisotropic etching, wet isotropic etching, RIE, isotropic plasma etching, laser etching, ultrasound etching, sawing, spark erosion, molding, welding, stamping, and a combination thereof.
Claim 13
Dependent Claim
34 words
The method of claim 7 , wherein the depositing the masking layers is selected from the group consisting of oxidation, chemical vapor deposition, sputtering, evaporation, spinning, spraying, epitaxy, soldering, electroplating, and a combination thereof.
Claim 14
Independent Claim
108 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the etching includes the acts of RIE etching first, then oxide or nitride deposition, then etching the oxide or nitride on a bottom of the microstructure, then a second RIE etching, then anisotropic etching.
Claim 15
Independent Claim
108 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the etching includes the acts of RIE etching first, then oxide or nitride deposition, then etching the oxide or nitride on a bottom of the microstructure, then a second RIE etching, then anisotropic etching.
Claim 16
Independent Claim
114 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the microstructure is a bridge and the etching includes the acts of RIE etching first, then oxide or nitride deposition, then etching the oxide or nitride on a bottom of the microstructure, then a second RIE etching, then anisotropic undercutting.
Claim 17
Independent Claim
114 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the microstructure is a bridge and the etching includes the acts of RIE etching first, then oxide or nitride deposition, then etching the oxide or nitride on a bottom of the microstructure, then a second RIE etching, then anisotropic undercutting.
Claim 18
Independent Claim
117 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the microstructure is a bridge and the etching includes the acts of RIE etching first, then oxide or nitride deposition, then etching the oxide or nitride on a bottom of the microstructure, then a second RIE etching, then anisotropic etching, then isotropic undercutting.
Claim 19
Independent Claim
117 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the microstructure is a bridge and the etching includes the acts of RIE etching first, then oxide or nitride deposition, then etching the oxide or nitride on a bottom of the microstructure, then a second RIE etching, then anisotropic etching, then isotropic undercutting.
Claim 20
Independent Claim
79 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the microstructure is a beam.
Claim 21
Independent Claim
79 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the microstructure is a beam.
Claim 22
Dependent Claim
27 words
The method of claim 1 , wherein the depositing is selected from the group consisting of spraying, brushing, dipping, dispersing, printing, screen printing, and any combination thereof.
Claim 23
Dependent Claim
22 words
The method of claim 1 , wherein there is no patterning of the bonding material overlying at least part of the microstructure.
Claim 24
Independent Claim
114 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the bonding comprises the act of depositing the bonding material on the principal surface of at least one of the substrates; and wherein the depositing includes the act of contact printing the bonding material to a surface of the microstructure.
Claim 25
Independent Claim
114 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the bonding comprises the act of depositing the bonding material on the principal surface of at least one of the substrates; and wherein the depositing includes the act of contact printing the bonding material to a surface of the microstructure.
Claim 26
Dependent Claim
57 words
The method of claim 1 , wherein the bonding material is selected from the group consisting of a liquid, a suspension, and an emulsion, and further comprising the act of depositing the bonding material on a surface which is brought into contact with the microstructure, and wherein the bonding material adheres to a top of the microstructure.
Claim 27
Independent Claim
129 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the bonding comprises the act of depositing the bonding material on the principal surface of at least one of the substrates; and wherein the bonding material is a thermoplastic sheet which is brought into contact with the microstructure, further comprising the act of heating the thermoplastic so it adheres to a top of the microstructure.
Claim 28
Independent Claim
129 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the bonding comprises the act of depositing the bonding material on the principal surface of at least one of the substrates; and wherein the bonding material is a thermoplastic sheet which is brought into contact with the microstructure, further comprising the act of heating the thermoplastic so it adheres to a top of the microstructure.
Claim 29
Independent Claim
131 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the bonding comprises the act of depositing the bonding material on the principal surface of at least one of the substrates; and wherein the bonding material is a self adhesive bonding material on a third substrate and further comprising the act of bringing the third substrate into contact with the microstructure thereby to deposit the bonding material.
Claim 30
Independent Claim
131 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the bonding comprises the act of depositing the bonding material on the principal surface of at least one of the substrates; and wherein the bonding material is a self adhesive bonding material on a third substrate and further comprising the act of bringing the third substrate into contact with the microstructure thereby to deposit the bonding material.
Claim 31
Independent Claim
130 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the bonding comprises the act of depositing the bonding material on the principal surface of at least one of the substrates; and wherein the bonding material is selected from the group consisting of a liquid, a suspension, and an emulsion and further comprising the act of depositing the bonding material by spraying it through a mask.
Claim 32
Independent Claim
130 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the bonding comprises the act of depositing the bonding material on the principal surface of at least one of the substrates; and wherein the bonding material is selected from the group consisting of a liquid, a suspension, and an emulsion and further comprising the act of depositing the bonding material by spraying it through a mask.
Claim 33
Independent Claim
127 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the bonding comprises the act of depositing the bonding material on the principal surface of at least one of the substrates; and wherein the bonding material is selected from the group consisting of a liquid, a suspension, and an emulsion and further comprising the act of depositing the bonding material by screen printing.
Claim 34
Independent Claim
127 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the bonding comprises the act of depositing the bonding material on the principal surface of at least one of the substrates; and wherein the bonding material is selected from the group consisting of a liquid, a suspension, and an emulsion and further comprising the act of depositing the bonding material by screen printing.
Claim 35
Independent Claim
129 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the bonding comprises the act of depositing the bonding material on the principal surface of at least one of the substrates; and wherein the bonding material is selected from the group consisting of a liquid, a suspension, and an emulsion and defines a profile opposite to a profile of the microstructure on the bonding wafer.
Claim 36
Independent Claim
129 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the bonding comprises the act of depositing the bonding material on the principal surface of at least one of the substrates; and wherein the bonding material is selected from the group consisting of a liquid, a suspension, and an emulsion and defines a profile opposite to a profile of the microstructure on the bonding wafer.
Claim 37
Dependent Claim
32 words
The method of claim 4 , further comprising after the aligning, the act of clam ping the substrates and wherein the bonding material is applied to voids in one of the substrates.
Claim 38
Independent Claim
119 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; and aligning the first and second substrate one to another prior to the bonding; wherein after the aligning, the substrates are temporarily bonded together; further comprising the act of applying sealing material to edges of the substrates via voids defined in at least one of the substrates.
Claim 39
Independent Claim
119 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; and aligning the first and second substrate one to another prior to the bonding; wherein after the aligning, the substrates are temporarily bonded together; further comprising the act of applying sealing material to edges of the substrates via voids defined in at least one of the substrates.
Claim 40
Independent Claim
95 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; bonding with a material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; and further comprising after the bonding, the act of etching one of the substrates uniformly to reduce a total thickness of the bonded structure.
Claim 41
Independent Claim
95 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; bonding with a material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; and further comprising after the bonding, the act of etching one of the substrates uniformly to reduce a total thickness of the bonded structure.
Claim 42
Dependent Claim
23 words
The method of claim 1 , further comprising after the bonding, the act of etching one of the substrates locally to define patterns.
Claim 43
Independent Claim
111 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; sealing at least a portion of the first and second substrates together; and further comprising after the bonding, the act of applying sealing material to edges of at least one of the substrates via voids defined in the substrate.
Claim 44
Independent Claim
111 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; sealing at least a portion of the first and second substrates together; and further comprising after the bonding, the act of applying sealing material to edges of at least one of the substrates via voids defined in the substrate.
Claim 45
Dependent Claim
23 words
The method of claim 1 , wherein the bonding material is selected from a group consisting of solder metals, glass materials, and polymers.
Claim 46
Dependent Claim
22 words
The method of claim 1 , wherein the microstructure is selected from a group consisting of trenches, ridges, pyramids, poles, and cavities.
Claim 47
Dependent Claim
19 words
The method of claim 1 , wherein the first substrate defines in its principal surface a plurality of microstructures.
Claim 48
Independent Claim
96 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein a sidewall of the microstructure has a negative slope relative to a plane defined by the principal surface of the first substrate.
Claim 49
Independent Claim
96 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein a sidewall of the microstructure has a negative slope relative to a plane defined by the principal surface of the first substrate.
Claim 50
Dependent Claim
22 words
The method of claim 1 , wherein the microstructure is selected from a group consisting of V-shaped, U-shaped, keyhole-shaped, and diamond-shaped microstructures.
Claim 51
Independent Claim
91 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the principal surface of the second substrate defines at least one microstructure filled by the bonding material.
Claim 52
Independent Claim
91 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the principal surface of the second substrate defines at least one microstructure filled by the bonding material.
Claim 53
Independent Claim
105 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the second substrate defines a plurality of microstructures which are each a ridge, each ridge extending from the second substrate into the bonding material in a trench in the first substrate.
Claim 54
Independent Claim
105 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the second substrate defines a plurality of microstructures which are each a ridge, each ridge extending from the second substrate into the bonding material in a trench in the first substrate.
Claim 55
Independent Claim
105 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the first and second substrates each define a plurality of microstructures for bonding, and each of the microstructures on the first substrate extends into a corresponding microstructure on the second substrate.
Claim 56
Independent Claim
105 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the first and second substrates each define a plurality of microstructures for bonding, and each of the microstructures on the first substrate extends into a corresponding microstructure on the second substrate.
Claim 57
Dependent Claim
57 words
The method of claim 35 , wherein each microstructure in the first substrate is a ridge that defines a neck portion and a wider end portion distal of the neck portion, and the end portion of each ridge on the first substrate interlocks with the end portion of a corresponding microstructure for bonding on the second substrate.
Claim 58
Independent Claim
102 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; and further comprising the act of forming an electrically conductive trace at a principal surface of the first or second substrate and extending beyond an edge of the bonding material.
Claim 59
Independent Claim
102 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; and further comprising the act of forming an electrically conductive trace at a principal surface of the first or second substrate and extending beyond an edge of the bonding material.
Claim 60
Dependent Claim
14 words
The method of claim 36 , wherein the conductive trace is formed of metal.
Claim 61
Dependent Claim
26 words
The method of claim 37 , wherein the conductive trace is formed of one of polysilicon or a doped region of the first or second substrate.
Claim 62
Dependent Claim
46 words
The method of claim 37 , wherein the bonding material defines a bonding ring in a plane lying parallel to that of the principal surface of the first substrate, and the conductive trace is formed extending along a length of a portion of the bonding ring.
Claim 63
Dependent Claim
22 words
The method of claim 39 , further comprising the act of forming a metallized area on a portion of the conductive trace.
Claim 64
Independent Claim
121 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the first substrate defines at least one spacer extending towards and in contact with the principal surface of the second substrate, thereby to define a particular distance between the first and second substrates and a thickness of the bonding layer fills in the cavity in the microstructures.
Claim 65
Independent Claim
121 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the first substrate defines at least one spacer extending towards and in contact with the principal surface of the second substrate, thereby to define a particular distance between the first and second substrates and a thickness of the bonding layer fills in the cavity in the microstructures.
Claim 66
Dependent Claim
37 words
The method of claim 42 , wherein the spacer is at an edge of the bonded structure, and further comprising forming a sealant lying on an outer surface of the first and second substrates at the edge.
Claim 67
Independent Claim
126 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the first substrate defines a cavity extending therethrough to the principal surface of the second substrate and further comprising the act of forming a sealant lying on a side surface of the cavity and on a portion of the principal surface of the second substrate that is in communication with the cavity.
Claim 68
Independent Claim
126 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the first substrate defines a cavity extending therethrough to the principal surface of the second substrate and further comprising the act of forming a sealant lying on a side surface of the cavity and on a portion of the principal surface of the second substrate that is in communication with the cavity.
Claim 69
Dependent Claim
30 words
The method of claim 44 , wherein the first substrate further defines a capillary opening in communication with the cavity, and the sealant is formed extending into the capillary opening.
Claim 70
Dependent Claim
24 words
The method of claim 45 wherein the first substrate defines a capillary opening at the edge, and the sealant extends into the capillary opening.
Claim 71
Dependent Claim
35 words
The method of claim 1 , wherein one of the first or second substrates further defines at least one structure selected from a group consisting of micro-sensors, micro-actuators, micro-machined structures, and micro-electronic and micro-electro-mechanical devices.
Claim 72
Dependent Claim
13 words
The method of claim 1 , wherein the structure is a single die.
Claim 73
Dependent Claim
24 words
The method of claim 1 , wherein the second substrate is selected from the group consisting of crystalline silicon, metal, glass, ceramic or plastic.
Claim 74
Independent Claim
106 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the at least one microstructure has a vertical dimension of less than 15 μm, and a horizontal dimension of less than 5 μm, relative to the principal surface of the first substrate.
Claim 75
Independent Claim
106 words
A method of bonding substrates, comprising the acts of: etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; and bonding with a bonding material the etched portion of the principal surface of the first substrate to a principal surface of a second substrate, during which the bonding material fills the at least one cavity; wherein the at least one microstructure has a vertical dimension of less than 15 μm, and a horizontal dimension of less than 5 μm, relative to the principal surface of the first substrate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-06-17 | 2005-12-17 | 2006-06-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-06-17 | 2009-12-17 | 2010-06-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-06-17 | 2013-12-17 | 2014-06-18 | $7700.00 | Window Closed / Lapsed |