US6403401B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Heat spreader hole pin 1 identifier
Assignee: Stats Chippac Pte Ltd
•
Filing: 2000-08-14
•
Granted: 2002-06-11
•
Expires: 2020-08-14
Abstract
Abstract A new method is provided to identify semiconductor devices whereby the invention provides for a shallow depression on the backside of the heat sink of the ball grid array package. This shallow depression or hole can be used for visual and optical inspection of the device orientation.
Inventors
- 👤 Weddie Pacio Aquien
- 👤 Loreto Y. Cantillep
- 👤 Setho Sing Fee
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:27
CPC Classifications
H; H10; H10W; H10W46/00; H10W40/00; H10W40/10; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W90/00; H10W90/701; H05; H05K; H05K1/00; H05K1/02; H05K1/0266; H05K1/0269; H05K3/00; H05K3/30; H05K3/303; H10W46/101; H10W46/601; H10W46/607; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/00; H10W72/071; H10W72/075; H10W72/50; H10W72/551; H10W72/90; H10W72/951; H10W72/952; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
267 words
A method of assembling a ball grid array assembly having a metal heatsink, comprising the steps of: providing a square or rectangular shaped metal heat sink in addition to providing a square or rectangular shaped laminate substrate whereby said metal heat sink and said laminate substrate are aimed at packaging ball grid array devices whereby further said heat sink has a laminate substrate attach surface and a heat sink marking surface whereby further said laminate substrate has a heat sink attach surface and a die attach surface; applying a layer of epoxy coat to said marking surface of said heat sink; applying a first layer of adhesive to said heat sink attach surface of said laminated substrate; attaching said heat sink to said laminate substrate by overlying said heat sink over said first layer of adhesive; applying a second layer of adhesive to die attach surface of said laminate substrate; providing a layer of interconnect tracings over said second layer of adhesive that has been applied to said laminate substrate said interconnect tracings having been provided with contact pads; providing a solder mask over said layer of interconnect tracings; inserting contact balls within said solder mask such that said solder balls overlay contact pads in said layer of interconnect tracings; electrically connecting said contact balls with said contact pads in said layer of interconnect tracings by reflow of said contact balls; encapsulating said ball grid array assembly thereby protecting said ball grid array assembly form environmental damage; providing identification markings on said marking surface of said heat sink; and performing inspection of said ball grid array assembly.
Claim 2
Independent Claim
267 words
A method of assembling a ball grid array assembly having a metal heatsink, comprising the steps of: providing a square or rectangular shaped metal heat sink in addition to providing a square or rectangular shaped laminate substrate whereby said metal heat sink and said laminate substrate are aimed at packaging ball grid array devices whereby further said heat sink has a laminate substrate attach surface and a heat sink marking surface whereby further said laminate substrate has a heat sink attach surface and a die attach surface; applying a layer of epoxy coat to said marking surface of said heat sink; applying a first layer of adhesive to said heat sink attach surface of said laminated substrate; attaching said heat sink to said laminate substrate by overlying said heat sink over said first layer of adhesive; applying a second layer of adhesive to die attach surface of said laminate substrate; providing a layer of interconnect tracings over said second layer of adhesive that has been applied to said laminate substrate said interconnect tracings having been provided with contact pads; providing a solder mask over said layer of interconnect tracings; inserting contact balls within said solder mask such that said solder balls overlay contact pads in said layer of interconnect tracings; electrically connecting said contact balls with said contact pads in said layer of interconnect tracings by reflow of said contact balls; encapsulating said ball grid array assembly thereby protecting said ball grid array assembly form environmental damage; providing identification markings on said marking surface of said heat sink; and performing inspection of said ball grid array assembly.
Claim 3
Dependent Claim
81 words
The method if claim 1 wherein one or more laminate substrate identification marks have been provided overlying said layer of second adhesive coating whereby said laminate substrate identification marks are facing away from said square or rectangular shaped laminate substrate and are provided along a periphery of said layer of second adhesive coating preferably in one or more corners of said layer of second adhesive coating where said layer of second adhesive coating overlays said square or rectangular shaped laminate substrate.
Claim 4
Dependent Claim
78 words
The method of claim 1 wherein a indentation has been provided in said marking surface of said square or rectangular shaped heat sink whereby said indentation is preferably located at one or more corners of said square or rectangular shaped heat sink whereby said indentation is a removal of said heat sink material that penetrates said heat sink to a depth of between about 30 and 70% of the thickness of said square or rectangular shaped heat sink.
Claim 5
Dependent Claim
24 words
The method of claim 1 wherein said ball grid array assembly is preferably used for Flex Enhanced BGA (FEBGA) or Enhanced BGA (EBGA) devices.
Claim 6
Dependent Claim
26 words
The method of claim 1 wherein said heat sink attach surface of said heatsink and said marking surface of said heatsink have been black oxide plated.
Claim 7
Dependent Claim
16 words
The method of claim 1 wherein said a square or rectangular shaped heat sink contains copper.
Claim 8
Dependent Claim
27 words
The method of claim 1 wherein said layer of interconnect tracings over said second layer of adhesive that has been applied to said laminate substrate contain copper.
References Cited (Backward Citations)
US5768774A
Cited
US5869891A
Cited
US6011304A
Cited
US5895967A
Cited
US5869883A
Cited
US5977626A
Cited
US20020000651A1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-06-10 | 2005-12-10 | 2006-06-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-06-10 | 2009-12-10 | 2010-06-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-06-10 | 2013-12-10 | 2014-06-11 | $7700.00 | Window Closed / Lapsed |