US6376332B1
Expired / Lapsed
US
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Composite member and separating method therefor, bonded substrate stack and separating method therefor, transfer method for transfer layer, and SOI substrate manufacturing method
Assignee: Canon Inc
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Filing: 2000-02-01
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Granted: 2002-04-23
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Expires: 2020-02-01
Abstract
Abstract A bonded substrate stack formed by bonding first and second substrates is appropriately separated. A first substrate having a porous layer inside and a single-crystal Si layer and insulating layer on the porous layer is brought into tight contact with a second substrate while shifting their central positions to prepare a bonded substrate stack having a projecting portion at which the outer peripheral edge of the first substrate projects outside that of the second substrate. First, a fluid is ejected to the projecting portion to form a separation start portion, and then, separation is started from the separation start portion while rotating the bonded substrate stack.
Inventors
- 👤 Kazutaka Yanagita
- 👤 Kazuaki Ohmi
- 👤 Kiyofumi Sakaguchi
- 👤 Hirokazu Kurisu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 17:32
CPC Classifications
H; H10; H10W; H10W10/00; H10W10/01; H10W10/041; H10P; H10P90/00; H10P90/19; H10P90/1904; H10P90/1906; H10P90/1924; H10P90/1914; H10W10/10; H10W10/181; H10W10/40; H10W46/00; H10W46/201
Claims Analysis
Total Claims: 61
Claim 1
Independent Claim
84 words
A method of separating a composite member having a structure in which a first member having a separation layer inside is brought into tight contact with a second member, wherein said composite member has a projecting portion at which an outer peripheral edge of said first member projects outside that of said second member, and said method comprises the separation step of starting separating said composite member from said projecting portion and then separating said composite member into two members at said separation layer.
Claim 2
Independent Claim
84 words
A method of separating a composite member having a structure in which a first member having a separation layer inside is brought into tight contact with a second member, wherein said composite member has a projecting portion at which an outer peripheral edge of said first member projects outside that of said second member, and said method comprises the separation step of starting separating said composite member from said projecting portion and then separating said composite member into two members at said separation layer.
Claim 3
Dependent Claim
61 words
The method according to claim 1 , wherein a major surface of said first member has the same shape as that of said second member, and said composite member has a structure in which the major surface of said first member is brought into tight contact with the major surface of said second member while shifting central positions from each other.
Claim 4
Dependent Claim
52 words
The method according to claim 1 , wherein a major surface of said second member is smaller than that of said first member, and said composite member has a structure in which the major surface of said first member is brought into tight contact with the major surface of said second member.
Claim 5
Dependent Claim
62 words
The method according to claim 1 , wherein the separation step comprises: the pre-separation step of processing said projecting portion to form a separation start portion; and the main separation step of starting separating said composite member from said separation start portion and then breaking substantially only said separation layer to separate said composite member into two members at said separation layer.
Claim 6
Dependent Claim
60 words
A method of bringing a first member having a separation layer inside into tight contact with a second member to manufacture a composite member having a projecting portion at which an outer peripheral edge of said first member projects outside that of said second member, wherein said separation layer is adapted to separate by the method of claim 1 .
Claim 7
Independent Claim
108 words
A method of transferring a transfer layer on a surface of a first member to a second member, comprising: a preparation step of bringing a first member having a separation layer inside and said transfer layer on said separation layer into tight contact with a second member to prepare a composite member in which an outer peripheral edge of said first member projects outside that of said second member; and a separation step for starting separating said composite member from said projecting portion and separating said composite member into two members at said separation layer, thereby transferring said transfer layer of said first member to said second member.
Claim 8
Independent Claim
108 words
A method of transferring a transfer layer on a surface of a first member to a second member, comprising: a preparation step of bringing a first member having a separation layer inside and said transfer layer on said separation layer into tight contact with a second member to prepare a composite member in which an outer peripheral edge of said first member projects outside that of said second member; and a separation step for starting separating said composite member from said projecting portion and separating said composite member into two members at said separation layer, thereby transferring said transfer layer of said first member to said second member.
Claim 9
Dependent Claim
104 words
A separating method of separating into two substrates a bonded substrate stack having a structure formed by bringing a transfer layer of a first substrate having a separation layer inside and said transfer layer on said separation layer into tight contact with a second substrate, wherein said bonded substrate stack has a projecting portion at which an outer peripheral edge of said first substrate projects outside that of said second substrate, and said separation method comprises the separation step of starting separating said bonded substrate stack from said projecting portion and then separating said bonded substrate stack into two substrates at said separation layer.
Claim 10
Dependent Claim
104 words
A separating method of separating into two substrates a bonded substrate stack having a structure formed by bringing a transfer layer of a first substrate having a separation layer inside and said transfer layer on said separation layer into tight contact with a second substrate, wherein said bonded substrate stack has a projecting portion at which an outer peripheral edge of said first substrate projects outside that of said second substrate, and said separation method comprises the separation step of starting separating said bonded substrate stack from said projecting portion and then separating said bonded substrate stack into two substrates at said separation layer.
Claim 11
Dependent Claim
50 words
The method according to claim 7 , wherein said first substrate has the same size as that of said second substrate, and said bonded substrate stack has a structure in which said first substrate and said second substrate are brought into tight contact while shifting central positions from each other.
Claim 12
Dependent Claim
34 words
The method according to claim 7 , wherein said bonded substrate stack has a structure in which said first substrate is brought into tight contact with said second substrate smaller than said first substrate.
Claim 13
Dependent Claim
51 words
The method according to claim 7 , wherein said second substrate has one of an orientation flat and a notch, and said bonded substrate stack has, as said projecting portion, a portion where said first substrate is exposed in the presence of the orientation flat or notch of said second substrate.
Claim 14
Dependent Claim
96 words
The method according to claim 7 , wherein each of said first substrate and said second substrate has one of an orientation flat and a notch, and said bonded substrate stack is formed by bringing said first substrate and said second substrate into tight contact with each other without matching the orientation flat or notch of said first substrate with the orientation flat or notch of said second substrate, and has, as said projecting portion, a portion where said first substrate is exposed in the presence of the orientation flat or notch of said second substrate.
Claim 15
Dependent Claim
70 words
A method of bonding a transfer layer of a first substrate having a separation layer inside and said transfer layer on said separation layer to a second substrate to manufacture a bonded substrate stack having a projecting portion at which an outer peripheral edge of said first substrate projects outside that of said second substrate, wherein said separation layer is adapted to separate by the method of claim 1 .
Claim 16
Dependent Claim
115 words
A transfer method of transferring a transfer layer on a surface of a first substrate to a second substrate, comprising: the preparation step of bonding said transfer layer of said first substrate having a separation layer inside and said transfer layer on said separation layer to said second substrate to prepare a bonded substrate stack having a projecting portion at which an outer peripheral edge of said first substrate projects outside that of said second substrate; and the separation step of starting separating said bonded substrate stack from said projecting portion and then separating said bonded substrate stack at said separation layer, thereby transferring said transfer layer of said first substrate to said second substrate.
Claim 17
Dependent Claim
115 words
A transfer method of transferring a transfer layer on a surface of a first substrate to a second substrate, comprising: the preparation step of bonding said transfer layer of said first substrate having a separation layer inside and said transfer layer on said separation layer to said second substrate to prepare a bonded substrate stack having a projecting portion at which an outer peripheral edge of said first substrate projects outside that of said second substrate; and the separation step of starting separating said bonded substrate stack from said projecting portion and then separating said bonded substrate stack at said separation layer, thereby transferring said transfer layer of said first substrate to said second substrate.
Claim 18
Dependent Claim
41 words
The method according to claim 13 , wherein the preparation step comprises bringing said first substrate and said second substrate, which have the same size, into tight contact with each other while shifting central positions to prepare said bonded substrate stack.
Claim 19
Dependent Claim
34 words
The method according to claim 13 , wherein the preparation step comprises bringing said first substrate into tight contact with said second substrate smaller than said first substrate to prepare said bonded substrate stack.
Claim 20
Dependent Claim
64 words
The method according to claim 13 , wherein the preparation step comprises bringing said first substrate into tight contact with said second substrate having one of an orientation flat and a notch to prepare said bonded substrate stack having, as said projecting portion, a portion where said first substrate is exposed in the presence of the orientation flat or notch of said second substrate.
Claim 21
Dependent Claim
72 words
The method according to claim 13 , wherein the preparation step comprises preparing said first substrate and said second substrate each having one of an orientation flat and a notch, and bringing said first substrate and said second substrate into tight contact with each other without matching the orientation flat or notch of said first substrate with the orientation flat or notch of said second substrate to prepare said bonded substrate stack.
Claim 22
Dependent Claim
59 words
The method according to claim 13 , wherein the separation step comprises: the pre-separation step of processing said projecting portion to form a separation start portion; and starting separating said bonded substrate stack from said separation start portion and then breaking substantially only said separation layer to separate said bonded substrate stack into two substrates at said separation layer.
Claim 23
Dependent Claim
28 words
The method according to claim 18 , wherein the pre-separation step comprises ejecting a fluid to said projecting portion to form said separation start portion by the fluid.
Claim 24
Dependent Claim
37 words
The method according to claim 18 , wherein the pre-separation step comprises inserting a wedge-shaped member into a gap between said first substrate and said second substrate at said projecting portion to form said separation start portion.
Claim 25
Dependent Claim
26 words
The method according to claim 18 , wherein the pre-separation step comprises supplying a vibration energy to said projecting portion to form said separation start portion.
Claim 26
Dependent Claim
37 words
The method according to claim 18 , wherein the pre-separation step comprises dipping said projecting portion in a liquid and supplying a vibration energy to said projecting portion through the liquid to form said separation start portion.
Claim 27
Dependent Claim
14 words
The method according to claim 22 , wherein water is used as the liquid.
Claim 28
Dependent Claim
15 words
The method according to claim 22 , wherein an etchant is used as the liquid.
Claim 29
Dependent Claim
30 words
The method according to claim 18 , wherein the pre-separation step comprises etching said transfer layer and said separation layer at said projecting portion to form said separation start portion.
Claim 30
Dependent Claim
46 words
The method according to claim 13 , wherein the separation step comprises ejecting a fluid to said projecting portion to form said separation start portion on said bonded substrate stack and continuing separating said bonded substrate stack while changing a position where the fluid is injected.
Claim 31
Dependent Claim
37 words
The method according to claim 13 , wherein the separation step comprises inserting a wedge-shaped member into a gap between said first substrate and said second substrate at said projecting portion to separate said bonded substrate stack.
Claim 32
Dependent Claim
27 words
The method according to claim 18 , wherein said separation start portion is a portion where said separation layer at said portion has the most fragile structure.
Claim 33
Dependent Claim
34 words
The method according to claim 18 , wherein said separation start portion is a portion where said transfer layer at said portion is removed, and said separation layer under said transfer layer is exposed.
Claim 34
Dependent Claim
40 words
The method according to claim 18 , wherein said separation start portion is a portion where said separation layer at said portion is exposed, and an outer peripheral edge of said separation layer is located inside said bonded substrate stack.
Claim 35
Dependent Claim
15 words
The method according to claim 13 , wherein said separation layer is a porous layer.
Claim 36
Dependent Claim
37 words
The method according to claim 13 , wherein said first substrate is a substrate formed by anodizing a substrate to form a porous layer as the separation layer and forming said transfer layer on said separation layer.
Claim 37
Dependent Claim
23 words
The method according to claim 13 , wherein said first substrate has, as said separation layer, a porous layer formed by ion implantation.
Claim 38
Dependent Claim
16 words
The method according to claim 13 , wherein said transfer layer includes a single-crystal Si layer.
Claim 39
Dependent Claim
25 words
The method according to claim 13 , wherein said transfer layer sequentially has a single-crystal Si layer and an insulating layer as said transfer layer.
Claim 40
Independent Claim
127 words
A method of manufacturing an SOI substrate, comprising: the preparation step of bringing a surface of a first substrate having a porous layer inside and a transfer layer including a single-crystal Si layer on said porous layer into tight contact with a second substrate to prepare a bonded substrate stack having a projecting portion at which an outer peripheral edge of said first substrate projects outside that of said second substrate; the separation step for starting separating said bonded substrate stack from said projecting portion and separating said bonded substrate stack at said porous layer, thereby transferring said transfer layer of said first substrate to said second substrate; and the removal step of removing said porous layer remaining on a surface of said second substrate after separation.
Claim 41
Independent Claim
127 words
A method of manufacturing an SOI substrate, comprising: the preparation step of bringing a surface of a first substrate having a porous layer inside and a transfer layer including a single-crystal Si layer on said porous layer into tight contact with a second substrate to prepare a bonded substrate stack having a projecting portion at which an outer peripheral edge of said first substrate projects outside that of said second substrate; the separation step for starting separating said bonded substrate stack from said projecting portion and separating said bonded substrate stack at said porous layer, thereby transferring said transfer layer of said first substrate to said second substrate; and the removal step of removing said porous layer remaining on a surface of said second substrate after separation.
Claim 42
Dependent Claim
32 words
The method according to claim 36 , wherein said first substrate has, as said transfer layer, not only said single-crystal Si layer but also an insulating layer on said single-crystal Si layer.
Claim 43
Dependent Claim
18 words
The method according to claim 36 , wherein said second substrate has an insulating layer on a surface.
Claim 44
Dependent Claim
41 words
The method according to claim 36 , wherein the preparation step comprises bringing said first substrate and said second substrate, which have the same size, into tight contact with each other while shifting central positions to prepare said bonded substrate stack.
Claim 45
Dependent Claim
34 words
The method according to claim 36 , wherein the preparation step comprises bringing said first substrate into tight contact with said second substrate smaller than said first substrate to prepare said bonded substrate stack.
Claim 46
Dependent Claim
32 words
The method according to claim 40 , wherein the preparation step comprises bringing said first substrate into tight contact with said second substrate while making the central positions match with each other.
Claim 47
Dependent Claim
64 words
The method according to claim 36 , wherein the preparation step comprises bringing said first substrate into tight contact with said second substrate having one of an orientation flat and a notch to prepare said bonded substrate stack having, as said projecting portion, a portion where said first substrate is exposed in the presence of the orientation flat or notch of said second substrate.
Claim 48
Dependent Claim
72 words
The method according to claim 36 , wherein the preparation step comprises preparing said first substrate and said second substrate each having one of an orientation flat and a notch, and bringing said first substrate and said second substrate into tight contact with each other without matching the orientation flat or notch of said first substrate with the orientation flat or notch of said second substrate to prepare said bonded substrate stack.
Claim 49
Dependent Claim
59 words
The method according to claim 36 , wherein the separation step comprises: the pre-separation step of processing said projecting portion to form a separation start portion; and starting separating said bonded substrate stack from said separation start portion and then breaking substantially only said porous layer to separate said bonded substrate stack into two substrates at said porous layer.
Claim 50
Dependent Claim
28 words
The method according to claim 44 , wherein the pre-separation step comprises ejecting a fluid to said projecting portion to form said separation start portion by the fluid.
Claim 51
Dependent Claim
37 words
The method according to claim 44 , wherein the pre-separation step comprises inserting a wedge-shaped member into a gap between said first substrate and said second substrate at said projecting portion to form said separation start portion.
Claim 52
Dependent Claim
26 words
The method according to claim 44 , wherein the pre-separation step comprises supplying a vibration energy to said projecting portion to form said separation start portion.
Claim 53
Dependent Claim
37 words
The method according to claim 44 , wherein the pre-separation step comprises dipping said projecting portion in a liquid and supplying a vibration energy to said projecting portion through the liquid to form said separation start portion.
Claim 54
Dependent Claim
14 words
The method according to claim 48 , wherein water is used as the liquid.
Claim 55
Dependent Claim
15 words
The method according to claim 48 , wherein an etchant is used as the liquid.
Claim 56
Dependent Claim
30 words
The method according to claim 44 , wherein the pre-separation step comprises etching said transfer layer and said porous layer at said projecting portion to form said separation start portion.
Claim 57
Dependent Claim
46 words
The method according to claim 36 , wherein the separation step comprises ejecting a fluid to said projecting portion to form said separation start portion on said bonded substrate stack and continuing separating said bonded substrate stack while changing a position where the fluid is injected.
Claim 58
Dependent Claim
37 words
The method according to claim 36 , wherein the separation step comprises inserting a wedge-shaped member into a gap between said first substrate and said second substrate at said projecting portion to separate said bonded substrate stack.
Claim 59
Dependent Claim
27 words
The method according to claim 36 , wherein said separation start portion is a portion where said porous layer at said portion has the most fragile structure.
Claim 60
Dependent Claim
34 words
The method according to claim 36 , wherein said separation start portion is a portion where said transfer layer at said portion is removed, and said porous layer under said transfer layer is exposed.
Claim 61
Dependent Claim
40 words
The method according to claim 36 , wherein said separation start portion is a portion where said porous layer at said portion is exposed, and an outer peripheral edge of said porous layer is located inside said bonded substrate stack.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-04-22 | 2005-10-22 | 2006-04-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-04-22 | 2009-10-22 | 2010-04-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-04-22 | 2013-10-22 | 2014-04-23 | $7700.00 | Window Closed / Lapsed |