US6330159B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Vertical surface mount apparatus with thermal carrier
Assignee: Micron Technology Inc
•
Filing: 2000-06-28
•
Granted: 2001-12-11
•
Expires: 2020-06-28
Abstract
Abstract A high density vertical surface mount package and thermal carrier therefor including a heat sink.
Inventors
- 👤 Larry D. Kinsman
- 👤 Jerry M. Brooks
- 👤 Walter L. Moden
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 19:21
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/303; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W40/70; H10W40/77; H10W40/778; H05K1/00; H05K1/02; H05K1/0201; H05K1/0203; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09709; H05K2201/10; H05K2201/10431; H05K2201/10439; H05K2201/10454; H05K2201/10613; H05K2201/10621; H05K2201/10659; H05K2201/10696; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 34
Claim 1
Independent Claim
216 words
A vertically mounted semiconductor device chip package assembly for a substrate, comprising: a semiconductor die package including an encapsulated semiconductor device, said semiconductor die package having a first surface having a first size, a second surface having a second size substantially the same as the first size of the first surface, a lead edge, a first end surface, a second end surface, and a plurality of lead pins extending along the lead edge configured to mount to said substrate, said plurality of lead pins comprising gull-wing zig-zag lead pins connected to said encapsulated semiconductor device; and a carrier device comprising a thermally conductive member having a pair of insert leads, one insert lead of said pair of insert leads connected to an end of the thermally conductive member extending therefrom configured to vertically mount said carrier device to said substrate, said pair of insert leads offset from said plurality of lead pins of said semiconductor die package mounted thereto, said carrier device substantially conforming to a surface area of said first surface of said semiconductor die package, said carrier device adhesively connected to said first surface of said semiconductor die package and connected by an interference fit by engagement with portions of said pair of insert leads providing a heat sink for said semiconductor die package.
Claim 2
Dependent Claim
216 words
A vertically mounted semiconductor device chip package assembly for a substrate, comprising: a semiconductor die package including an encapsulated semiconductor device, said semiconductor die package having a first surface having a first size, a second surface having a second size substantially the same as the first size of the first surface, a lead edge, a first end surface, a second end surface, and a plurality of lead pins extending along the lead edge configured to mount to said substrate, said plurality of lead pins comprising gull-wing zig-zag lead pins connected to said encapsulated semiconductor device; and a carrier device comprising a thermally conductive member having a pair of insert leads, one insert lead of said pair of insert leads connected to an end of the thermally conductive member extending therefrom configured to vertically mount said carrier device to said substrate, said pair of insert leads offset from said plurality of lead pins of said semiconductor die package mounted thereto, said carrier device substantially conforming to a surface area of said first surface of said semiconductor die package, said carrier device adhesively connected to said first surface of said semiconductor die package and connected by an interference fit by engagement with portions of said pair of insert leads providing a heat sink for said semiconductor die package.
Claim 3
Dependent Claim
67 words
The semiconductor device chip package assembly of claim 1 , wherein said carrier device includes a first portion including one of said pair of insert leads and a second portion including another of said pair of insert leads, the first portion and the second portion of said carrier device being located substantially adjacent the first end surface and the second end surface of the semiconductor die package.
Claim 4
Dependent Claim
18 words
The semiconductor device chip package assembly of claim 1 , wherein said carrier device is comprised of copper.
Claim 5
Dependent Claim
18 words
The semiconductor device chip package assembly of claim 1 , wherein said carrier device is comprised of aluminum.
Claim 6
Dependent Claim
24 words
The semiconductor device chip package assembly of claim 1 , wherein a portion of said carrier device is coated with a tin/lead alloy metal.
Claim 7
Dependent Claim
24 words
The semiconductor device chip package assembly of claim 1 , wherein a portion of said carrier device is coated with a nickel/palladium alloy metal.
Claim 8
Dependent Claim
24 words
The semiconductor device chip package assembly of claim 1 , wherein a portion of said carrier device is coated with a nickel/palladium/aluminum alloy metal.
Claim 9
Dependent Claim
34 words
The semiconductor device chip package assembly of claim 1 , wherein a portion of each insert lead of said pair of insert leads of said carrier device is coated with a metal for soldering.
Claim 10
Dependent Claim
27 words
The semiconductor device chip package assembly of claim 1 , wherein said carrier device has a thickness in the range of 5 mils to about 12 mils.
Claim 11
Dependent Claim
22 words
The semiconductor device chip package assembly of claim 1 , wherein said semiconductor die package includes a portion thereof made from epoxy.
Claim 12
Dependent Claim
226 words
A vertical mount semiconductor device chip package assembly for mounting to a substrate, comprising: a semiconductor die package including an encapsulated semiconductor device, said semiconductor die package having a first surface, a second surface, a lead edge, a first end surface having a length and thickness, a second end surface having substantially the same length and thickness as the length and thickness of the first end surface, and a plurality of lead pins extending along the lead edge configured to mount to said substrate, the plurality of lead pins comprising gull-wing zig-zag lead pins, the first surface and the second surface of the semiconductor die package having substantially the same surface area; and a thermally conductive carrier substantially conforming to the surface area of said first surface of said semiconductor die package, said thermally conductive carrier including a pair of insert leads extending therefrom and configured to mount said thermally conductive carrier to said substrate, each insert lead of said pair of insert leads connected to an end of said thermally conductive carrier in substantial alignment with said plurality of lead pins of said semiconductor die package, said thermally conductive carrier adhesively connected to said first surface of said semiconductor die package and connected by an interference fit by engaging portions of said pair of insert leads providing a heat sink for said semiconductive die package.
Claim 13
Dependent Claim
226 words
A vertical mount semiconductor device chip package assembly for mounting to a substrate, comprising: a semiconductor die package including an encapsulated semiconductor device, said semiconductor die package having a first surface, a second surface, a lead edge, a first end surface having a length and thickness, a second end surface having substantially the same length and thickness as the length and thickness of the first end surface, and a plurality of lead pins extending along the lead edge configured to mount to said substrate, the plurality of lead pins comprising gull-wing zig-zag lead pins, the first surface and the second surface of the semiconductor die package having substantially the same surface area; and a thermally conductive carrier substantially conforming to the surface area of said first surface of said semiconductor die package, said thermally conductive carrier including a pair of insert leads extending therefrom and configured to mount said thermally conductive carrier to said substrate, each insert lead of said pair of insert leads connected to an end of said thermally conductive carrier in substantial alignment with said plurality of lead pins of said semiconductor die package, said thermally conductive carrier adhesively connected to said first surface of said semiconductor die package and connected by an interference fit by engaging portions of said pair of insert leads providing a heat sink for said semiconductive die package.
Claim 14
Dependent Claim
28 words
The semiconductor device chip package assembly of claim 11 , wherein said semiconductor die package is additionally connected to said thermally conductive carrier by a plurality of clips.
Claim 15
Dependent Claim
69 words
The semiconductor device chip package assembly of claim 11 , wherein said thermally conductive carrier includes a first portion including one of said pair of insert leads and a second portion including another of said pair of insert leads, the first portion and the second portion of said thermally conductive carrier being located substantially adjacent the first end surface and the second end surface of the semiconductor die package.
Claim 16
Dependent Claim
19 words
The semiconductor device chip package assembly of claim 11 , wherein said thermally conductive carrier is comprised of copper.
Claim 17
Dependent Claim
19 words
The semiconductor device chip package assembly of claim 11 , wherein said thermally conductive carrier is comprised of aluminum.
Claim 18
Dependent Claim
25 words
The semiconductor device chip package assembly of claim 11 , wherein a portion of said thermally conductive carrier is coated with a tin/lead alloy metal.
Claim 19
Dependent Claim
25 words
The semiconductor device chip package assembly of claim 11 , wherein a portion of said thermally conductive carrier is coated with a nickel/palladium alloy metal.
Claim 20
Dependent Claim
24 words
The semiconductor device chip package assembly of claim 11 , wherein a portion of said thermally conductive carrier is coated with a nickel/palladium/aluminum metal.
Claim 21
Dependent Claim
25 words
The semiconductor device chip package assembly of claim 11 , wherein a portion of said thermally conductive carrier is coated with a metal for soldering.
Claim 22
Dependent Claim
28 words
The semiconductor device chip package assembly of claim 11 , wherein said thermally conductive carrier has a thickness in the range of 5 mils to about 12 mils.
Claim 23
Dependent Claim
20 words
The semiconductor device chip package assembly of claim 11 , wherein a portion of said semiconductor die package includes epoxy.
Claim 24
Independent Claim
218 words
A method of forming a vertical mount semiconductor device chip package assembly for mounting to a substrate, comprising: forming a semiconductor die package including an encapsulated semiconductor device, said semiconductor die package having a first surface having a first size, a second surface having a second size substantially the same as the first size of the first surface, a lead edge, a first end surface, a second end surface, and a plurality of lead pins extending along the lead edge for connecting to said substrate, said plurality of lead pins comprising gull-wing zig-zag leads; forming a thermally conductive carrier substantially conforming to a surface area of said first surface of said semiconductor die package, said thermally conductive carrier including at least two leads extending therefrom; connecting portions of the thermally conductive carrier using an interference fit with portions of said semiconductor die package, said thermally conductive carrier including a pair of insert leads extending therefrom; adhesively connecting to said first surface of said semiconductor die package providing a heat sink for said semiconductor die package, said thermally conductive carrier including a pair of insert leads extending therefrom; and mounting said thermally conductive carrier having said semiconductor die package connected thereto to said substrate by connecting said pair of insert leads to said substrate in a substantially vertical orientation.
Claim 25
Independent Claim
218 words
A method of forming a vertical mount semiconductor device chip package assembly for mounting to a substrate, comprising: forming a semiconductor die package including an encapsulated semiconductor device, said semiconductor die package having a first surface having a first size, a second surface having a second size substantially the same as the first size of the first surface, a lead edge, a first end surface, a second end surface, and a plurality of lead pins extending along the lead edge for connecting to said substrate, said plurality of lead pins comprising gull-wing zig-zag leads; forming a thermally conductive carrier substantially conforming to a surface area of said first surface of said semiconductor die package, said thermally conductive carrier including at least two leads extending therefrom; connecting portions of the thermally conductive carrier using an interference fit with portions of said semiconductor die package, said thermally conductive carrier including a pair of insert leads extending therefrom; adhesively connecting to said first surface of said semiconductor die package providing a heat sink for said semiconductor die package, said thermally conductive carrier including a pair of insert leads extending therefrom; and mounting said thermally conductive carrier having said semiconductor die package connected thereto to said substrate by connecting said pair of insert leads to said substrate in a substantially vertical orientation.
Claim 26
Dependent Claim
65 words
The method of claim 22 , wherein said thermally conductive carrier includes a first portion including one of said pair of insert leads and a second portion including another of said pair of insert leads, the first portion and the second portion of said thermally conductive carrier being located substantially adjacent the first end surface and the second end surface of the semiconductor die package.
Claim 27
Dependent Claim
15 words
The method of claim 22 , wherein said thermally conductive carrier is comprised of copper.
Claim 28
Dependent Claim
15 words
The method of claim 22 , wherein said thermally conductive carrier is comprised of aluminum.
Claim 29
Dependent Claim
21 words
The method of claim 22 , wherein a portion of said thermally conductive carrier is coated with a tin/lead alloy metal.
Claim 30
Dependent Claim
21 words
The method of claim 22 , wherein a portion of said thermally conductive carrier is coated with a nickel/palladium alloy metal.
Claim 31
Dependent Claim
20 words
The method of claim 22 , wherein a portion of said thermally conductive carrier is coated with a nickel/palladium/aluminum metal.
Claim 32
Dependent Claim
21 words
The method of claim 22 , wherein a portion of said thermally conductive carrier is coated with a metal for soldering.
Claim 33
Dependent Claim
25 words
The method of claim 22 , wherein said thermally conductive carrier has a thickness in a range of about 5 mils to about 12 mils.
Claim 34
Dependent Claim
16 words
The method of claim 22 , wherein a portion of said semiconductor die package includes epoxy.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-12-10 | 2005-06-11 | 2005-12-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-12-10 | 2009-06-11 | 2009-12-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-12-10 | 2013-06-11 | 2013-12-11 | $7700.00 | Window Closed / Lapsed |